公开(公告)号：US20210301402A1

公开(公告)日：2021-09-30

申请号：US17265288

申请日：2019-07-29

申请人： Tokyo Electron Limited

发明人： Yusuke SUZUKI ,  Tsuyoshi MORIYA ,  Tadashi MITSUNARI ,  Shinya IWASHITA ,  Yoshinori MORISADA ,  Naotaka NORO ,  Munehito KAGAYA ,  Satoshi TANAKA

IPC分类号： C23C16/52 ,  C23C16/50 ,  C23C16/455

摘要： A film forming apparatus includes: a processing container; a support mechanism configured to support a substrate to be capable of being raised and lowered; a first gas supplier configured to supply a first gas to a front surface of the substrate supported on the support mechanism; a second gas supplier configured to supply a second gas to a rear surface of the substrate supported on the support mechanism; and a third gas supplier configured to supply a third gas to at least one of the front surface and the rear surface of the substrate supported on the support mechanism.

公开(公告)号：US20200370172A1

公开(公告)日：2020-11-26

申请号：US16881787

申请日：2020-05-22

申请人： Tokyo Electron Limited

发明人： Tsuyoshi MORIYA ,  Tadahiro ISHIZAKA ,  Yoshinori MORISADA

IPC分类号： C23C16/27 ,  H01L21/311 ,  C23C16/455

摘要： In a hard mask formed on a target film formed on a substrate, a first film having a stress in a first direction and a second film having a stress in a second direction opposite to the first direction are alternately stacked one or more times.

公开(公告)号：US20150240121A1

公开(公告)日：2015-08-27

申请号：US14632311

申请日：2015-02-26

申请人： TOKYO ELECTRON LIMITED

发明人： Kippei SUGITA ,  Tatsuya YAMAGUCHI ,  Yoshinori MORISADA ,  Makoto FUJIKAWA

IPC分类号： C09D179/08 ,  C23C16/52 ,  C23C16/455 ,  C23C16/46 ,  C23C16/44

CPC分类号： C09D179/08 ,  B05D1/60 ,  B05D3/0254 ,  C08G73/105 ,  C08G73/1071 ,  C23C16/30 ,  C23C16/56 ,  H01L21/02063 ,  H01L21/3065 ,  H01L21/31058 ,  H01L21/67109

摘要： A method for improving a chemical resistance of a polymerized film, which is formed on a surface of a target object and to be processed by a chemical, includes: consecutively performing a treatment for improving the chemical resistance of the polymerized film subsequent to formation of the polymerized film within a processing chamber of a film forming apparatus where the polymerized film is formed, without unloading the target object from the processing chamber.

摘要翻译： 用于提高形成在目标物体的表面上并由化学品加工的聚合膜的耐药性的方法包括：连续地进行用于提高形成后的聚合膜的耐化学性的处理 在其中形成聚合膜的成膜设备的处理室内，不从处理室卸载目标物体。

公开(公告)号：US20150232702A1

公开(公告)日：2015-08-20

申请号：US14619375

申请日：2015-02-11

申请人： TOKYO ELECTRON LIMITED

发明人： Tatsuya YAMAGUCHI ,  Yoshinori MORISADA

IPC分类号： C09D183/14 ,  C23C16/455 ,  C23C16/46 ,  C23C16/52 ,  C23C16/44

CPC分类号： C09D183/14 ,  B05D1/34 ,  B05D1/60 ,  C08G77/54

摘要： A polymerized film forming method for forming a polymerized film on a target surface of a workpiece using a first raw material gas which contains a first monomer and a second raw material gas which contains a second monomer differing from the first monomer includes: supplying the first raw material gas wherein difunctional non-aromatic amine having a hydrolyzable group is used for the first monomer; and supplying the second raw material gas wherein difunctional acid anhydride is used for the second monomer.

摘要翻译： 使用包含第一单体的第一原料气体和含有与第一单体不同的第二单体的第二原料气体，在工件的目标表面上形成聚合膜的聚合膜形成方法包括：供给第一原料 其中具有可水解基团的双官能非芳族胺用于第一单体的原料气体; 并且供给第二原料气体，其中二官能酸酐用于第二单体。