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Patent Agency Ranking
公开(公告)号：US12007413B2
公开(公告)日：2024-06-11
申请号：US18527013
申请日：2023-12-01
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Tetsuo Yoshida , Shunsuke Otake , Tatsuya Matsuoka
IPC: G01R31/28 , G01R1/067 , G01R1/073 , H01L21/67 , H01L21/687
CPC classification number: G01R1/07307 , G01R1/0675 , G01R31/2887 , G01R31/2889 , G01R31/2891 , H01L21/67248 , H01L21/68707
Abstract: A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.
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公开(公告)号：US10481177B2
公开(公告)日：2019-11-19
申请号：US15524925
申请日：2014-11-26
Applicant: TOKYO SEIMITSU CO., LTD.
Inventor： Yuichi Ozawa , Yasuhito Iguchi , Tetsuo Yoshida , Junzo Koshio
Abstract: A wafer inspection method improving inspection accuracy and operation efficiency. A method for performing electrical inspection by bringing into contact with pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads recognizing the positional shifts of the pads due to thermal expansion; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.
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公开(公告)号：US09983256B2
公开(公告)日：2018-05-29
申请号：US14515688
申请日：2014-10-16
Applicant: TOKYO SEIMITSU CO., LTD
Inventor： Yuichi Ozawa , Yasuhito Iguchi , Tetsuo Yoshida , Junzo Koshio
CPC classification number: G01R31/2601 , G01B2210/56 , G01R31/2891
Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other. The device is provided with a microscope 23 for image-capturing the electrode pad and for outputting the external shape of the electrode pad as image data, and a control unit 27 which stores image data of an external shape of the electrode pad prior to the contact with a probe 102, and compares the image data of the external shape thus stored with image data thereof after the contact obtained from the microscope 23, or compares the registered frame of the electrode pad with the outer periphery of the electrode pad detected at the time of inspecting a needle trace, so that the quality of the contact between the electrode pad and the probe 102 is determined.
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公开(公告)号：US11940463B2
公开(公告)日：2024-03-26
申请号：US18459132
申请日：2023-08-31
Applicant: Tokyo Seimitsu Co., Ltd.
Inventor： Natsumi Hayashi , Hideki Morii , Tetsuo Yoshida , Toshiyuki Kimura
CPC classification number: G01R1/06711 , G01R1/07314
Abstract: The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.
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公开(公告)号：US20150109625A1
公开(公告)日：2015-04-23
申请号：US14515688
申请日：2014-10-16
Applicant: TOKYO SEIMITSU CO., LTD
Inventor： Yuichi Ozawa , Yasuhito Iguchi , Tetsuo Yoshida , Junzo Koshio
CPC classification number: G01R31/2601 , G01B2210/56 , G01R31/2891
Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other. The device is provided with a microscope 23 for image-capturing the electrode pad and for outputting the external shape of the electrode pad as image data, and a control unit 27 which stores image data of an external shape of the electrode pad prior to the contact with a probe 102, and compares the image data of the external shape thus stored with image data thereof after the contact obtained from the microscope 23, or compares the registered frame of the electrode pad with the outer periphery of the electrode pad detected at the time of inspecting a needle trace, so that the quality of the contact between the electrode pad and the probe 102 is determined.
Abstract translation: 为了提供能够确认电检查是否已经被适当地执行的探测装置和探测方法，其中电极焊盘与预定压力的探头接触，通过利用外部形状的改变 当探针和电极垫彼此按压时，形成在电极焊盘上。 该装置设置有用于图像捕获电极焊盘并用于输出电极焊盘的外部形状的显微镜23作为图像数据，以及控制单元27，其在接触之前存储电极焊盘的外部形状的图像数据 与探针102相比较，并将这样存储的外部形状的图像数据与从显微镜23获得的接触后的图像数据进行比较，或者比较电极焊盘的登记的框架与当时检测到的电极焊盘的外周边 检查针迹，从而确定电极垫和探针102之间的接触质量。
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