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公开(公告)号：US07816250B2
公开(公告)日：2010-10-19
申请号：US11540027
申请日：2006-09-29
申请人： Tom Fitzgerald , Carl Deppisch , Fay Hua
发明人： Tom Fitzgerald , Carl Deppisch , Fay Hua
IPC分类号： H01L21/208 , H01L33/62
CPC分类号： C22C21/00 , B23K35/0244 , B23K35/24 , B23K35/286 , B23K35/40 , C22C28/00 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/16152 , H01L2924/00 , H01L2224/0401
摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.
摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。
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公开(公告)号：US20100259890A1
公开(公告)日：2010-10-14
申请号：US12822951
申请日：2010-06-24
申请人： Tom Fitzgerald , Carl Deppisch , Fay Hua
发明人： Tom Fitzgerald , Carl Deppisch , Fay Hua
CPC分类号： C22C21/00 , B23K35/0244 , B23K35/24 , B23K35/286 , B23K35/40 , C22C28/00 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/16152 , H01L2924/00 , H01L2224/0401
摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.
摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。
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公开(公告)号：US20080090405A1
公开(公告)日：2008-04-17
申请号：US11540027
申请日：2006-09-29
申请人： Tom Fitzgerald , Carl Deppisch , Fay Hua
发明人： Tom Fitzgerald , Carl Deppisch , Fay Hua
IPC分类号： H01L21/44
CPC分类号： C22C21/00 , B23K35/0244 , B23K35/24 , B23K35/286 , B23K35/40 , C22C28/00 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/16152 , H01L2924/00 , H01L2224/0401
摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.
摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。
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公开(公告)号：US08242602B2
公开(公告)日：2012-08-14
申请号：US12822951
申请日：2010-06-24
申请人： Tom Fitzgerald , Carl Deppisch , Fay Hua
发明人： Tom Fitzgerald , Carl Deppisch , Fay Hua
IPC分类号： H01L23/488
CPC分类号： C22C21/00 , B23K35/0244 , B23K35/24 , B23K35/286 , B23K35/40 , C22C28/00 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/16152 , H01L2924/00 , H01L2224/0401
摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.
摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。
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公开(公告)号：US07439617B2
公开(公告)日：2008-10-21
申请号：US11479577
申请日：2006-06-30
申请人： Carl Deppisch , Tom Fitzgerald , Fay Hua , Wei Shi , Mike Gasparek
发明人： Carl Deppisch , Tom Fitzgerald , Fay Hua , Wei Shi , Mike Gasparek
CPC分类号： H01L23/42 , H01L21/563 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/1617
摘要： A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.
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公开(公告)号：US20080017975A1
公开(公告)日：2008-01-24
申请号：US11479577
申请日：2006-06-30
申请人： Carl Deppisch , Tom Fitzgerald , Fay Hua , Wei Shi , Mike Gasparek
发明人： Carl Deppisch , Tom Fitzgerald , Fay Hua , Wei Shi , Mike Gasparek
CPC分类号： H01L23/42 , H01L21/563 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/1617
摘要： A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.
摘要翻译： 一种冷却装置，包括具有第一配合表面的导热体，在第一配合表面的一部分处以图案设置的第一焊料可润湿材料，以及设置在第一配合表面处的可回流焊料。 焊料材料的一部分被构造成能够接触相邻设置的第二配合表面，并且当熔化时，通过冷却装置的第一配合表面和第二配合表面之间的接合线间隙形成单个流动前沿 ，例如，热成分。 冷却装置的配合表面邻近热部件的配合表面定位，焊料材料至少加热至其熔点。 焊料材料保持在熔融状态，直到其流入并基本上填充冷却装置的配合表面与热部件的配合表面之间的接合线间隙，然后冷却到其熔点以下物理和/或 热耦合冷却装置和热部件。
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