公开(公告)号：US20130258619A1

公开(公告)日：2013-10-03

申请号：US13436177

申请日：2012-03-30

申请人： Tom J. Ley ,  Eric S. Tosaya ,  Chia-Ken Leong

发明人： Tom J. Ley ,  Eric S. Tosaya ,  Chia-Ken Leong

IPC分类号： H05K7/14 ,  H05K3/00

CPC分类号： H05K7/1461 ,  H05K1/0271 ,  H05K3/0058 ,  H05K2201/2018 ,  Y10T29/49124

摘要： Various circuit boards and stiffener frames and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a stiffener frame that has a surface adapted to engage a side of a circuit board. The surface includes a projection to protect a corner of the circuit board.

摘要翻译： 公开了各种电路板和加强框架及其制造方法。 一方面，提供一种制造方法，其包括制造具有适于接合电路板侧的表面的加强框架。 该表面包括用于保护电路板角部的突起。

公开(公告)号：US08008133B2

公开(公告)日：2011-08-30

申请号：US12029305

申请日：2008-02-11

申请人： Eric Tosaya ,  Jun Zhai ,  Chia-Ken Leong ,  Tom Ley

发明人： Eric Tosaya ,  Jun Zhai ,  Chia-Ken Leong ,  Tom Ley

IPC分类号： H01L21/00

CPC分类号： H01L23/16 ,  H01L23/04 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19105

摘要： Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.

摘要翻译： 提供各种半导体芯片封装及其制造方法。 一方面，提供一种制造方法，其包括提供在第一侧上具有第一侧和第一多个无源器件的衬底。 加强框架连接在第一侧上。 加强框架具有第一和第二间隔开的相对的壁，其限定了第一多个无源器件定位在其中的通道，以及不覆盖衬底的第一侧的中心部分的中心开口。

公开(公告)号：US10510721B2

公开(公告)日：2019-12-17

申请号：US15675214

申请日：2017-08-11

申请人： Milind S. Bhagavat ,  Lei Fu ,  Ivor Barber ,  Chia-Ken Leong ,  Rahul Agarwal

发明人： Milind S. Bhagavat ,  Lei Fu ,  Ivor Barber ,  Chia-Ken Leong ,  Rahul Agarwal

IPC分类号： H01L25/065 ,  H01L23/29 ,  H01L23/498 ,  H01L23/528 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L23/36

摘要： Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip.

公开(公告)号：US20190051633A1

公开(公告)日：2019-02-14

申请号：US15675214

申请日：2017-08-11

申请人： Milind S. Bhagavat ,  Lei Fu ,  Ivor Barber ,  Chia-Ken Leong ,  Rahul Agarwal

发明人： Milind S. Bhagavat ,  Lei Fu ,  Ivor Barber ,  Chia-Ken Leong ,  Rahul Agarwal

IPC分类号： H01L25/065 ,  H01L23/498 ,  H01L23/29 ,  H01L23/528

摘要： Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip.

公开(公告)号：US08405187B2

公开(公告)日：2013-03-26

申请号：US13158048

申请日：2011-06-10

申请人： Eric Tosaya ,  Jun Zhai ,  Chia-Ken Leong ,  Tom Ley

发明人： Eric Tosaya ,  Jun Zhai ,  Chia-Ken Leong ,  Tom Ley

IPC分类号： H01L29/00

CPC分类号： H01L23/16 ,  H01L23/04 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19105

摘要： Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.

摘要翻译： 提供各种半导体芯片封装及其制造方法。 一方面，提供一种制造方法，其包括提供在第一侧上具有第一侧和第一多个无源器件的衬底。 加强框架连接在第一侧上。 加强框架具有第一和第二间隔开的相对的壁，其限定了第一多个无源器件定位在其中的通道，以及不覆盖衬底的第一侧的中心部分的中心开口。

公开(公告)号：US20110241161A1

公开(公告)日：2011-10-06

申请号：US13158048

申请日：2011-06-10

申请人： Eric Tosaya ,  Jun Zhai ,  Chia-Ken Leong ,  Tom Ley

发明人： Eric Tosaya ,  Jun Zhai ,  Chia-Ken Leong ,  Tom Ley

IPC分类号： H01L27/02

CPC分类号： H01L23/16 ,  H01L23/04 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19105

摘要： Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.

摘要翻译： 提供各种半导体芯片封装及其制造方法。 一方面，提供一种制造方法，其包括提供在第一侧上具有第一侧和第一多个无源器件的衬底。 加强框架连接在第一侧上。 加强框架具有第一和第二间隔开的相对的壁，其限定了第一多个无源器件定位在其中的通道，以及不覆盖衬底的第一侧的中心部分的中心开口。

公开(公告)号：USD641720S1

公开(公告)日：2011-07-19

申请号：US29358472

申请日：2010-03-26

申请人： Stephen Heng ,  Sanjay Dandia ,  Nikon Banouvong ,  Chia-Ken Leong

设计人： Stephen Heng ,  Sanjay Dandia ,  Nikon Banouvong ,  Chia-Ken Leong

公开(公告)号：US20100276799A1

公开(公告)日：2010-11-04

申请号：US12435147

申请日：2009-05-04

申请人： Stephen F. Heng ,  Sanjay Dandia ,  Chia-Ken Leong

发明人： Stephen F. Heng ,  Sanjay Dandia ,  Chia-Ken Leong

IPC分类号： H01L23/04 ,  H01L21/50

CPC分类号： H01L23/42 ,  H01L21/50 ,  H01L23/10 ,  H01L23/16 ,  H01L23/36 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/1531 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2224/0401

摘要： Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.

摘要翻译： 公开了各种半导体芯片封装及其组装和制造方法。 一方面，提供了一种制造方法，其包括将加强框架耦合到基板的第一侧。 加强框架具有中心开口以容纳半导体芯片和外边缘表面。 半导体芯片与开口中的第一侧耦合。 盖子用粘合剂联接到加强筋框架上。 盖具有从加强框架的外边缘表面设置的第一边缘表面。 粘合剂从加强框架的外边缘表面回退。

公开(公告)号：US08216887B2

公开(公告)日：2012-07-10

申请号：US12435147

申请日：2009-05-04

申请人： Stephen F. Heng ,  Sanjay Dandia ,  Chia-Ken Leong

发明人： Stephen F. Heng ,  Sanjay Dandia ,  Chia-Ken Leong

IPC分类号： H01L21/77 ,  H01L21/98

CPC分类号： H01L23/42 ,  H01L21/50 ,  H01L23/10 ,  H01L23/16 ,  H01L23/36 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/1531 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2224/0401

摘要： Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.

摘要翻译： 公开了各种半导体芯片封装及其组装和制造方法。 一方面，提供了一种制造方法，其包括将加强框架耦合到基板的第一侧。 加强框架具有中心开口以容纳半导体芯片和外边缘表面。 半导体芯片与开口中的第一侧耦合。 盖子用粘合剂联接到加强筋框架上。 盖具有从加强框架的外边缘表面设置的第一边缘表面。 粘合剂从加强框架的外边缘表面回退。

公开(公告)号：USD658607S1

公开(公告)日：2012-05-01

申请号：US29394524

申请日：2011-06-17

申请人： Stephen Heng ,  Sanjay Dandia ,  Nikon Banouvong ,  Chia-Ken Leong

设计人： Stephen Heng ,  Sanjay Dandia ,  Nikon Banouvong ,  Chia-Ken Leong