公开(公告)号：US20110182073A1

公开(公告)日：2011-07-28

申请号：US13078601

申请日：2011-04-01

申请人： Tomohiro SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US07934856B2

公开(公告)日：2011-05-03

申请号：US12751261

申请日：2010-03-31

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US07690817B2

公开(公告)日：2010-04-06

申请号：US11947075

申请日：2007-11-29

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US20080128739A1

公开(公告)日：2008-06-05

申请号：US11947075

申请日：2007-11-29

申请人： TOMOHIRO SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： TOMOHIRO SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： H01L33/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US20100188852A1

公开(公告)日：2010-07-29

申请号：US12751261

申请日：2010-03-31

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US08167456B2

公开(公告)日：2012-05-01

申请号：US13078601

申请日：2011-04-01

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

IPC分类号： F21V7/22

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US08398267B2

公开(公告)日：2013-03-19

申请号：US13449513

申请日：2012-04-18

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

IPC分类号： F21V7/22

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US20120201028A1

公开(公告)日：2012-08-09

申请号：US13449513

申请日：2012-04-18

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda

IPC分类号： F21V21/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US08773612B2

公开(公告)日：2014-07-08

申请号：US13202689

申请日：2010-02-26

申请人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

发明人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

IPC分类号： G02F1/1335

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting module (1) comprises a module substrate (2), a light emitting diode string (31), and a sealing member (48). The light emitting diode string (31) includes light emitting diode elements (32) and bonding wires (37) which connect the light emitting diode elements (32). The light emitting diode element (32) has a pair of element electrodes (33, 34) and has a rectangular shape extending in a direction along which the element electrodes (33, 34) are aligned. The sealing member (48) is laminated on the module substrate (2) to seal the light emitting diode string (31). The light emitting diode elements (32) are arranged at intervals in a direction crossing the direction along which the element electrodes (33, 34) are aligned, and the element electrodes (33, 34) with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements (32) between the light emitting diode elements (32) adjacent to each other. Each bonding wire (37) is obliquely wired with respect to the arrangement direction of the light emitting diode elements (32) to connect the element electrodes (33, 34) with different polarities of the light emitting diode elements (32) adjacent to each other.

摘要翻译： 发光模块（1）包括模块基板（2），发光二极管串（31）和密封构件（48）。 发光二极管串（31）包括连接发光二极管元件（32）的发光二极管元件（32）和接合线（37）。 发光二极管元件（32）具有一对元件电极（33,34），并且具有在元件电极（33,34）对齐的方向上延伸的矩形形状。 密封构件（48）层压在模块基板（2）上以密封发光二极管串（31）。 发光二极管元件（32）沿与元件电极（33,34）对准的方向交叉的方向间隔配置，具有相同极性的元件电极（33,34） 在彼此相邻的发光二极管元件（32）之间的发光二极管元件（32）的布置方向上彼此相对。 每个接合线（37）相对于发光二极管元件（32）的布置方向倾斜地连接，以将彼此相邻的发光二极管元件（32）的不同极性的元件电极（33,34）连接 。

公开(公告)号：US20110303927A1

公开(公告)日：2011-12-15

申请号：US13202689

申请日：2010-02-26

申请人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

发明人： Tomohiro Sanpei ,  Kiyoshi Otani ,  Masahiro Izumi ,  Junya Murata ,  Akiko Saito ,  Yumiko Hayashida

IPC分类号： H01L33/60

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting module (1) comprises a module substrate (2), a light emitting diode string (31), and a sealing member (48). The light emitting diode string (31) includes light emitting diode elements (32) and bonding wires (37) which connect the light emitting diode elements (32). The light emitting diode element (32) has a pair of element electrodes (33, 34) and has a rectangular shape extending in a direction along which the element electrodes (33, 34) are aligned. The sealing member (48) is laminated on the module substrate (2) to seal the light emitting diode string (31). The light emitting diode elements (32) are arranged at intervals in a direction crossing the direction along which the element electrodes (33, 34) are aligned, and the element electrodes (33, 34) with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements (32) between the light emitting diode elements (32) adjacent to each other. Each bonding wire (37) is obliquely wired with respect to the arrangement direction of the light emitting diode elements (32) to connect the element electrodes (33, 34) with different polarities of the light emitting diode elements (32) adjacent to each other.

摘要翻译： 发光模块（1）包括模块基板（2），发光二极管串（31）和密封构件（48）。 发光二极管串（31）包括连接发光二极管元件（32）的发光二极管元件（32）和接合线（37）。 发光二极管元件（32）具有一对元件电极（33,34），并且具有在元件电极（33,34）对齐的方向上延伸的矩形形状。 密封构件（48）层压在模块基板（2）上以密封发光二极管串（31）。 发光二极管元件（32）沿与元件电极（33,34）对准的方向交叉的方向间隔配置，具有相同极性的元件电极（33,34） 在彼此相邻的发光二极管元件（32）之间的发光二极管元件（32）的布置方向上彼此相对。 每个接合线（37）相对于发光二极管元件（32）的布置方向倾斜地连接，以将彼此相邻的发光二极管元件（32）的不同极性的元件电极（33,34）连接 。