公开(公告)号：US07934856B2

公开(公告)日：2011-05-03

申请号：US12751261

申请日：2010-03-31

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US07690817B2

公开(公告)日：2010-04-06

申请号：US11947075

申请日：2007-11-29

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US20110182073A1

公开(公告)日：2011-07-28

申请号：US13078601

申请日：2011-04-01

申请人： Tomohiro SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US20080128739A1

公开(公告)日：2008-06-05

申请号：US11947075

申请日：2007-11-29

申请人： TOMOHIRO SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： TOMOHIRO SANPEI ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： H01L33/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US20100188852A1

公开(公告)日：2010-07-29

申请号：US12751261

申请日：2010-03-31

申请人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

发明人： Tomohiro Sanpei ,  Yumiko Hayashida ,  Masahiro Izumi ,  Kiyoshi Otani ,  Yutaka Honda ,  Shinji Nogi

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

摘要翻译： 照明装置包括基板，绝缘体，导体，多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体，突出部分，半导体发光元件和连接构件。

公开(公告)号：US07989840B2

公开(公告)日：2011-08-02

申请号：US11844037

申请日：2007-08-23

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： H01L33/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

公开(公告)号：US08558272B2

公开(公告)日：2013-10-15

申请号：US13184320

申请日：2011-07-15

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： H01L33/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

公开(公告)号：US20110273880A1

公开(公告)日：2011-11-10

申请号：US13184320

申请日：2011-07-15

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： F21V7/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。

公开(公告)号：US20080191620A1

公开(公告)日：2008-08-14

申请号：US10599296

申请日：2005-03-23

申请人： Takayoshi Moriyama ,  Akiko Nakanishi ,  Masami Iwamoto ,  Shinji Nogi ,  Kozo Ogawa ,  Keiichi Shimizu ,  Akiko Saitou ,  Seiko Kawashima ,  Tomohiro Sanpei ,  Masahiro Izumi ,  Masahiro Toda

发明人： Takayoshi Moriyama ,  Akiko Nakanishi ,  Masami Iwamoto ,  Shinji Nogi ,  Kozo Ogawa ,  Keiichi Shimizu ,  Akiko Saitou ,  Seiko Kawashima ,  Tomohiro Sanpei ,  Masahiro Izumi ,  Masahiro Toda

IPC分类号： H01L33/00 ,  H01J1/62

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device, with which the luminous efficiency is improved and the color non-uniformity of the emitted light is lessened. Specifically, a light emitting diode element is covered with a diffusing layer, with which a diffusing agent is added to a resin. A phosphor layer, with which a phosphor is added to a resin, is disposed on top of the diffusing layer. The light from the light emitting diode element is diffused by the diffusing layer. By exciting the phosphor layer with the light diffused by the diffusing layer and thereby making the phosphor layer emit light, the luminous efficiency is improved and the color non-uniformity is lessened.

摘要翻译： 发光装置，发光效率提高，发光的颜色不均匀性降低。 具体地，发光二极管元件被扩散层覆盖，扩散剂通过该扩散层向树脂中添加扩散剂。 将荧光体添加到树脂中的磷光体层设置在漫射层的顶部。 来自发光二极管元件的光被扩散层扩散。 通过由扩散层扩散的光激发荧光体层，从而使荧光体层发光，提高了发光效率，降低了颜色不均匀性。

公开(公告)号：US20080055901A1

公开(公告)日：2008-03-06

申请号：US11844037

申请日：2007-08-23

申请人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

发明人： Tomohiro Sanpei ,  Masahiro Izumi ,  Shinji Nogi ,  Akiko Saito

IPC分类号： F21V7/00

CPC分类号： F21V31/04 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

摘要翻译： 照明装置包括多个半导体发光器件，反射层，多个导体部分和半透明粘合剂层。 每个半导体发光器件具有透光性基板和形成在基板上的半导体发光层。 反射层的间隔尺寸设置有半导体发光元件。 导体部分设置在反射层上，电连接到半导体发光器件。 粘接层将半导体发光元件的基板粘合到反射层上，由此将半导体发光元件保持在反射层上。