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公开(公告)号:US07934856B2
公开(公告)日:2011-05-03
申请号:US12751261
申请日:2010-03-31
申请人: Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
发明人: Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
IPC分类号: F21V29/00
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US07690817B2
公开(公告)日:2010-04-06
申请号:US11947075
申请日:2007-11-29
申请人: Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
发明人: Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
IPC分类号: F21V29/00
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US20110182073A1
公开(公告)日:2011-07-28
申请号:US13078601
申请日:2011-04-01
申请人: Tomohiro SANPEI , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
发明人: Tomohiro SANPEI , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
IPC分类号: F21V29/00
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US20080128739A1
公开(公告)日:2008-06-05
申请号:US11947075
申请日:2007-11-29
申请人: TOMOHIRO SANPEI , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
发明人: TOMOHIRO SANPEI , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
IPC分类号: H01L33/00
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US20100188852A1
公开(公告)日:2010-07-29
申请号:US12751261
申请日:2010-03-31
申请人: Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
发明人: Tomohiro Sanpei , Yumiko Hayashida , Masahiro Izumi , Kiyoshi Otani , Yutaka Honda , Shinji Nogi
IPC分类号: F21V29/00
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US08398267B2
公开(公告)日:2013-03-19
申请号:US13449513
申请日:2012-04-18
IPC分类号: F21V7/22
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US08167456B2
公开(公告)日:2012-05-01
申请号:US13078601
申请日:2011-04-01
IPC分类号: F21V7/22
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US20120201028A1
公开(公告)日:2012-08-09
申请号:US13449513
申请日:2012-04-18
IPC分类号: F21V21/00
CPC分类号: H05K1/0203 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/3025 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要: An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.
摘要翻译: 照明装置包括基板,绝缘体,导体,多个半导体发光元件和透光密封构件。 基板包括表面和突出部分。 突起部形成为从其端部朝向基板的表面逐渐变厚。 绝缘体形成在表面上。 导体形成在绝缘体上。 半导体发光元件安装在突出部分上。 半导体发光元件通过连接构件电连接到导体。 密封构件覆盖绝缘体,突出部分,半导体发光元件和连接构件。
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公开(公告)号:US06765100B2
公开(公告)日:2004-07-20
申请号:US09973191
申请日:2001-10-10
申请人: Tomoyuki Onishi , Naoko Hirose , Yasuyuki Otake , Takashi Nakano , Yutaka Honda , Masakazu Nakazawa , Kunisuke Izawa
发明人: Tomoyuki Onishi , Naoko Hirose , Yasuyuki Otake , Takashi Nakano , Yutaka Honda , Masakazu Nakazawa , Kunisuke Izawa
IPC分类号: C07D30124
CPC分类号: C07C269/06 , C07B2200/07 , C07C269/08 , C07D263/24 , C07D303/36 , C07C271/16
摘要: The invention relates to a method for industrially producing highly pure (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoepoxide (crystal) or (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoalcohol. The method for producing N-carbamate-protected &bgr;-aminoepoxide crystal, includes one or more of the following steps (a) to (d): (a) dissolving (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoalcohol containing at least the diastereomer as an impurity in a solvent including at least one or more selected from aromatic hydrocarbon solvent, saturated hydrocarbon solvent, aqueous mixture solvent, acetone and 2-propanol, to remove insoluble matters; (b) treating the (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoalcohol with a base, thereby converting the N-carbamate-protected &bgr;-aminoalcohol to (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoepoxide; (c) treating the (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoepoxide containing at least the diastereomer as an impurity with an acid, thereby converting the diastereomer as an impurity to (4S, 5R) or (4R, 5S) oxazolidin-2-one derivative, and optionally separating and removing the resulting oxazolidin-2-one derivative in water or an aqueous mixture solvent; and (d) crystallizing the (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoepoxide in a mixture solvent of water and water-miscible organic solvent. By the methods of the present invention, highly pure (2R, 3S)- or (2S, 3R)-N-carbamate-protected &bgr;-aminoepoxide or (2R, 3S) or (2S, 3R)-N-carbamate-protected &bgr;-aminoalcohol can be efficiently produced.
摘要翻译: 本发明涉及工业生产高纯度(2R,3S) - 或(2S,3R)-N-氨基甲酸酯保护的β-氨基环氧化物(晶体)或(2R,3S) - 或(2S,3R)-N 氨基甲酸酯保护的β-氨基醇。 制备N-氨基甲酸酯保护的β-氨基环氧化物晶体的方法包括一个或多个以下步骤(a)至(d):( a)将(2R,3S) - 或(2S,3R)-N-氨基甲酸酯 在包含至少一种或多种选自芳族烃溶剂,饱和烃溶剂,含水混合物溶剂,丙酮和2-丙醇的溶剂的溶剂中至少含有作为杂质的非对映体的β-保护的β-氨基醇,以除去不溶物;(b) 用碱处理(2R,3S) - 或(2S,3R)-N-氨基甲酸酯保护的β-氨基醇,从而将N-氨基甲酸酯保护的β-氨基醇转化为(2R,3S) - 或(2S,3R )-N-氨基甲酸酯保护的β-氨基环氧化物;(c)用酸处理至少含有非对映体作为杂质的(2R,3S) - 或(2S,3R)-N-氨基甲酸酯保护的β-氨基环氧化物,由此 将非对映异构体作为杂质转化为(4S,5R)或(4R,5S)恶唑烷-2-酮衍生物,任选分离和除去得到的恶唑烷-2-酮衍生物 在水或含水混合溶剂中; 和(d)在水和水混溶性有机溶剂的混合溶剂中结晶(2R,3S) - 或(2S,3R)-N-氨基甲酸酯保护的β-氨基环氧化物。 通过本发明的方法,高纯度(2R,3S) - 或(2S,3R)-N-氨基甲酸酯保护的β-氨基环氧化物或(2R,3S)或(2S,3R)-N-氨基甲酸酯保护的β - 氨基醇可以有效地生产。
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公开(公告)号:US5767316A
公开(公告)日:1998-06-16
申请号:US752169
申请日:1996-11-18
申请人: Yutaka Honda , Satoshi Katayama , Kunisuke Izawa , Masakazu Nakazawa , Takayuki Suzuki , Naoko Kanno
发明人: Yutaka Honda , Satoshi Katayama , Kunisuke Izawa , Masakazu Nakazawa , Takayuki Suzuki , Naoko Kanno
IPC分类号: C07C221/00 , C07C223/02 , C07C227/16 , C07C227/32 , C07C229/22 , C07C229/34 , C07C269/06 , C07C271/22 , C07C319/20 , C07C323/43
CPC分类号: C07C271/22 , C07C221/00 , C07C227/16 , C07C227/32 , C07C229/22 , C07C229/34 , C07C269/06 , C07C319/20 , C07C323/43 , Y02P20/55
摘要: Compounds formed by reacting a protected amino acid with an alkali metal enolate of an alkyl acetate are reacted with a halogenating agent for halogenation of the 2-position, or a protected amino acid is reacted with an alkali metal enolate of an alkyl halogenoacetate, to form a 4-amino-3-oxo-2-halogenobutanoic acid ester derivative, and hydrolysis and decarboxylation are conducted to produce a 3-amino-2-oxo-1-halogenopropane derivative or its salt. The present method is a useful process for producing a 3-amino-2-oxo-1-halogenopropane derivatives which can easily be converted to a 3-amino-1,2-epoxypropane.
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