-
公开(公告)号：US08414704B2
公开(公告)日：2013-04-09
申请号：US12349682
申请日：2009-01-07
IPC分类号： B32B37/00 , C23C16/00 , H01L21/306 , B23B31/28
CPC分类号： H01L21/67103 , C23C16/4586 , H01L21/6833 , Y10T279/23
摘要： The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.
摘要翻译： 本发明涉及一种接合结构，包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中的端子，暴露于所述孔的底部的暴露表面，并且由具有基本上等于所述陶瓷构件的热膨胀系数的热膨胀系数的耐热金属制成; 包括与端子的暴露表面接触的第一钽层，形成在第一钽层上的金层和形成在金层上的第二钽层的钎焊接合层; 以及插入孔中的连接构件，其通过钎焊接合层接合到端子，并且由具有基本上等于陶瓷构件的热膨胀系数的热膨胀系数的难熔金属制成。
-
公开(公告)号：US20090173449A1
公开(公告)日：2009-07-09
申请号：US12349693
申请日：2009-01-07
IPC分类号： B32B37/00
CPC分类号： H01L21/6831 , H01L21/67103 , Y10T279/23
摘要： A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.
摘要翻译： 根据本发明的接合结构包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中并包括暴露于所述孔的底部的暴露表面的端子; 形成为与端子的暴露表面接触的钎焊接合层; 以及插入孔中的连接构件，并通过钎焊接合层与端子接合。 孔的内径大于连接构件的外径。 当连接构件插入孔中时，在孔和连接构件之间形成间隙。 钎焊池空间形成在孔的表面中，并且在横截面中具有大致半圆形形状。 钎焊池空间部分填充有钎焊材料。
-
公开(公告)号：US08480806B2
公开(公告)日：2013-07-09
申请号：US12349693
申请日：2009-01-07
CPC分类号： H01L21/6831 , H01L21/67103 , Y10T279/23
摘要： A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.
摘要翻译： 根据本发明的接合结构包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中并包括暴露于所述孔的底部的暴露表面的端子; 形成为与端子的暴露表面接触的钎焊接合层; 以及插入孔中的连接构件，并通过钎焊接合层与端子接合。 孔的内径大于连接构件的外径。 当连接构件插入孔中时，在孔和连接构件之间形成间隙。 钎焊池空间形成在孔的表面中，并且在横截面中具有大致半圆形形状。 钎焊池空间部分填充有钎焊材料。
-
4.发明授权公开(公告)号：US08193629B2
公开(公告)日：2012-06-05
申请号：US12350314
申请日：2009-01-08
IPC分类号： B32B3/00
CPC分类号： H01L21/6833 , H01L21/67005 , Y10T428/12535 , Y10T428/24612 , Y10T428/2462
摘要： A bonding structure including: a ceramic member made of aluminum nitride and including a hole; a terminal embedded in the ceramic member, exposed to a bottom surface of the hole, and made of molybdenum; a brazed bond layer consisting of gold (Au) only; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of molybdenum.
摘要翻译： 一种接合结构，包括：由氮化铝制成并包括孔的陶瓷构件; 嵌入在陶瓷构件中的端子，暴露于孔的底表面，并由钼制成; 仅由金（Au）组成的钎焊接合层; 以及插入孔中的连接构件，通过钎焊接合层与钼端子接合，并由钼制成。
-
公开(公告)号：US20090173448A1
公开(公告)日：2009-07-09
申请号：US12349682
申请日：2009-01-07
IPC分类号： B32B37/00
CPC分类号： H01L21/67103 , C23C16/4586 , H01L21/6833 , Y10T279/23
摘要： The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.
摘要翻译： 本发明涉及一种接合结构，包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中的端子，暴露于所述孔的底部的暴露表面，并且由具有基本上等于所述陶瓷构件的热膨胀系数的热膨胀系数的耐热金属制成; 包括与端子的暴露表面接触的第一钽层，形成在第一钽层上的金层和形成在金层上的第二钽层的钎焊接合层; 以及插入孔中的连接构件，其通过钎焊接合层接合到端子，并且由具有基本上等于陶瓷构件的热膨胀系数的热膨胀系数的难熔金属制成。
-
公开(公告)号：US06827567B2
公开(公告)日：2004-12-07
申请号：US09770023
申请日：2001-01-25
IPC分类号： B29C4334
CPC分类号： H01M10/0404 , B29C43/08 , B29C43/34 , B30B11/08 , H01M4/08 , H01M6/08 , H01M10/04 , Y10T29/49108
摘要： Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.
摘要翻译： 将粉末混合物在中心销位于比模具顶面低的状态下供给到模具中，之后将中心销提升到给定的成型位置，在该模制位置处，在中心销和中心销之间限定环形成型空间 死了 然后将粉末混合物从上部和下部用上部柱塞和下部柱塞压缩以形成颗粒。 中心销和下柱塞同时被提起以从模具中取出颗粒。
-
公开(公告)号：US10774412B2
公开(公告)日：2020-09-15
申请号：US14130530
申请日：2012-06-29
申请人： Norio Imai , Masayuki Wakita , Takuya Nishio , Jun Haga , Kengo Hata , Yasuaki Tanaka , Mitsuru Yoshida , Hiroshi Takebayashi , Suguhiro Fukushima , Toshiro Tomida
发明人： Norio Imai , Masayuki Wakita , Takuya Nishio , Jun Haga , Kengo Hata , Yasuaki Tanaka , Mitsuru Yoshida , Hiroshi Takebayashi , Suguhiro Fukushima , Toshiro Tomida
IPC分类号： C21D8/02 , C22C38/12 , C22C38/02 , C22C38/06 , C22C38/04 , C22C38/00 , C21D9/46 , C23C2/02 , C23C2/04
摘要： A hot-dip galvanized cold-rolled steel sheet has a tensile strength of 750 MPa or higher, a composition consisting, in mass percent, C: more than 0.10% and less than 0.25%, Si: more than 0.50% and less than 2.0%, Mn: more than 1.50% and 3.0% or less, and optionally containing one or more types of Ti, Nb, V, Cr, Mo, B, Ca, Mg, REM, and Bi, P: less than 0.050%, S: 0.010% or less, sol. Al: 0.50% or less, and N: 0.010% or less, and a main phase as a low-temperature transformation product and a second phase as retained austenite. The retained austenite volume fraction is more than 4.0% and less than 25.0% of the whole structure, and has an average grain size of less than 0.80 μm. A number density of retained austenite grains having a grain size of 1.2 μm or more is 3.0×10−2/μm2 or less.
-
8.发明申请公开(公告)号：US20140212686A1
公开(公告)日：2014-07-31
申请号：US14130530
申请日：2012-06-29
申请人： Norio Imai , Masayuki Wakita , Takuya Nishio , Jun Haga , Kengo Hata , Yasuaki Tanaka , Mitsuru Yoshida , Hiroshi Takebayashi , Suguhiro Fukushima , Toshiro Tomida
发明人： Norio Imai , Masayuki Wakita , Takuya Nishio , Jun Haga , Kengo Hata , Yasuaki Tanaka , Mitsuru Yoshida , Hiroshi Takebayashi , Suguhiro Fukushima , Toshiro Tomida
摘要： A hot-dip galvanized cold-rolled steel sheet has a tensile strength of 750 MPa or higher, a composition consisting, in mass percent, of C: more than 0.10% and less than 0.25%, Si: more than 0.50% and less than 2.0%, Mn: more than 1.50% and 3.0% or less, and optionally containing one or more types of Ti, Nb, V, Cr, Mo, B, Ca, Mg, REM, and Bi, P: less than 0.050%, S: 0.010% or less, sol. Al: 0.50% or less, and N: 0.010% or less, and a main phase as a low-temperature transformation product and a second phase as retained austenite. The retained austenite volume fraction is more than 4.0% and less than 25.0% of the whole structure, and has an average grain size of less than 0.80 □m. A number density of retained austenite grains having a grain size of 1.2 □m or more is 3.0□10−2/□m2 or less.
摘要翻译： 热浸镀锌冷轧钢板的拉伸强度为750MPa以上，以质量％计，C：0.10以上且小于0.25％的Si：超过0.50％以下 2.0％，Mn：大于1.50％和3.0％以下，并且任选地含有一种或多种Ti，Nb，V，Cr，Mo，B，Ca，Mg，REM和Bi，P：小于0.050％ ，S：0.010％以下，溶胶。 Al：0.50％以下，N：0.010％以下，作为低温相变产物的主相和作为残留奥氏体的第二相。 残留奥氏体体积分数大于整个结构的4.0％以上且小于25.0％，平均粒径小于0.80μm。 晶粒尺寸为1.2μm以上的残留奥氏体晶粒的数密度为3.0×10 -2 /□m 2以下。
-
9.发明授权Powder compression molding method for producing cathode pellets for dry cells 失效用于生产干细胞阴极丸的粉末压缩成型方法公开(公告)号：US06558594B2
公开(公告)日：2003-05-06
申请号：US09769894
申请日：2001-01-25
IPC分类号： B29C4302
摘要： Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.
摘要翻译： 将粉末混合物在中心销位于比模具顶面低的状态下供给到模具中，之后将中心销提升到给定的成型位置，在该模制位置处，在中心销和中心销之间限定环形成型空间 死了 然后将粉末混合物从上部和下部用上部柱塞和下部柱塞压缩以形成颗粒。 中心销和下柱塞同时被提起以从模具中取出颗粒。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.02 秒)
