公开(公告)号：US08414704B2

公开(公告)日：2013-04-09

申请号：US12349682

申请日：2009-01-07

申请人： Tomoyuki Fujii ,  Taichi Nakamura ,  Hiroshi Takebayashi

发明人： Tomoyuki Fujii ,  Taichi Nakamura ,  Hiroshi Takebayashi

IPC分类号： B32B37/00 ,  C23C16/00 ,  H01L21/306 ,  B23B31/28

CPC分类号： H01L21/67103 ,  C23C16/4586 ,  H01L21/6833 ,  Y10T279/23

摘要： The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.

摘要翻译： 本发明涉及一种接合结构，包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中的端子，暴露于所述孔的底部的暴露表面，并且由具有基本上等于所述陶瓷构件的热膨胀系数的热膨胀系数的耐热金属制成; 包括与端子的暴露表面接触的第一钽层，形成在第一钽层上的金层和形成在金层上的第二钽层的钎焊接合层; 以及插入孔中的连接构件，其通过钎焊接合层接合到端子，并且由具有基本上等于陶瓷构件的热膨胀系数的热膨胀系数的难熔金属制成。

公开(公告)号：US08480806B2

公开(公告)日：2013-07-09

申请号：US12349693

申请日：2009-01-07

申请人： Taichi Nakamura ,  Hiroshi Takebayashi ,  Tomoyuki Fujii

发明人： Taichi Nakamura ,  Hiroshi Takebayashi ,  Tomoyuki Fujii

IPC分类号： B32B37/00 ,  C23C16/00 ,  B23B31/28

CPC分类号： H01L21/6831 ,  H01L21/67103 ,  Y10T279/23

摘要： A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.

摘要翻译： 根据本发明的接合结构包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中并包括暴露于所述孔的底部的暴露表面的端子; 形成为与端子的暴露表面接触的钎焊接合层; 以及插入孔中的连接构件，并通过钎焊接合层与端子接合。 孔的内径大于连接构件的外径。 当连接构件插入孔中时，在孔和连接构件之间形成间隙。 钎焊池空间形成在孔的表面中，并且在横截面中具有大致半圆形形状。 钎焊池空间部分填充有钎焊材料。

公开(公告)号：US08193629B2

公开(公告)日：2012-06-05

申请号：US12350314

申请日：2009-01-08

申请人： Hiroshi Takebayashi ,  Taichi Nakamura ,  Tomoyuki Fujii

发明人： Hiroshi Takebayashi ,  Taichi Nakamura ,  Tomoyuki Fujii

IPC分类号： B32B3/00

CPC分类号： H01L21/6833 ,  H01L21/67005 ,  Y10T428/12535 ,  Y10T428/24612 ,  Y10T428/2462

摘要： A bonding structure including: a ceramic member made of aluminum nitride and including a hole; a terminal embedded in the ceramic member, exposed to a bottom surface of the hole, and made of molybdenum; a brazed bond layer consisting of gold (Au) only; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of molybdenum.

摘要翻译： 一种接合结构，包括：由氮化铝制成并包括孔的陶瓷构件; 嵌入在陶瓷构件中的端子，暴露于孔的底表面，并由钼制成; 仅由金（Au）组成的钎焊接合层; 以及插入孔中的连接构件，通过钎焊接合层与钼端子接合，并由钼制成。

公开(公告)号：US20090176065A1

公开(公告)日：2009-07-09

申请号：US12350314

申请日：2009-01-08

申请人： Hiroshi TAKEBAYASHI ,  Taichi Nakamura ,  Tomoyuki Fujii

发明人： Hiroshi TAKEBAYASHI ,  Taichi Nakamura ,  Tomoyuki Fujii

IPC分类号： B32B3/00

CPC分类号： H01L21/6833 ,  H01L21/67005 ,  Y10T428/12535 ,  Y10T428/24612 ,  Y10T428/2462

摘要： A bonding structure according to the present invention includes: a ceramic member made of aluminum nitride and including a hole; a terminal embedded in the ceramic member, exposed to a bottom surface of the hole, and made of molybdenum; a brazed bond layer consisted of gold (Au) only; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of molybdenum.

摘要翻译： 根据本发明的接合结构包括：由氮化铝制成并包括孔的陶瓷构件; 嵌入在陶瓷构件中的端子，暴露于孔的底表面，并由钼制成; 钎焊接合层仅由金（Au）组成; 以及插入孔中的连接构件，通过钎焊接合层与钼端子接合，并由钼制成。

公开(公告)号：US20090173448A1

公开(公告)日：2009-07-09

申请号：US12349682

申请日：2009-01-07

申请人： Tomoyuki FUJII ,  Taichi Nakamura ,  Hiroshi Takebayashi

发明人： Tomoyuki FUJII ,  Taichi Nakamura ,  Hiroshi Takebayashi

IPC分类号： B32B37/00

CPC分类号： H01L21/67103 ,  C23C16/4586 ,  H01L21/6833 ,  Y10T279/23

摘要： The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.

摘要翻译： 本发明涉及一种接合结构，包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中的端子，暴露于所述孔的底部的暴露表面，并且由具有基本上等于所述陶瓷构件的热膨胀系数的热膨胀系数的耐热金属制成; 包括与端子的暴露表面接触的第一钽层，形成在第一钽层上的金层和形成在金层上的第二钽层的钎焊接合层; 以及插入孔中的连接构件，其通过钎焊接合层接合到端子，并且由具有基本上等于陶瓷构件的热膨胀系数的热膨胀系数的难熔金属制成。

公开(公告)号：US20090173449A1

公开(公告)日：2009-07-09

申请号：US12349693

申请日：2009-01-07

申请人： Taichi Nakamura ,  Hiroshi Takebayashi ,  Tomoyuki Fujii

发明人： Taichi Nakamura ,  Hiroshi Takebayashi ,  Tomoyuki Fujii

IPC分类号： B32B37/00

CPC分类号： H01L21/6831 ,  H01L21/67103 ,  Y10T279/23

摘要： A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.

摘要翻译： 根据本发明的接合结构包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中并包括暴露于所述孔的底部的暴露表面的端子; 形成为与端子的暴露表面接触的钎焊接合层; 以及插入孔中的连接构件，并通过钎焊接合层与端子接合。 孔的内径大于连接构件的外径。 当连接构件插入孔中时，在孔和连接构件之间形成间隙。 钎焊池空间形成在孔的表面中，并且在横截面中具有大致半圆形形状。 钎焊池空间部分填充有钎焊材料。

公开(公告)号：US20130241069A1

公开(公告)日：2013-09-19

申请号：US13823463

申请日：2011-10-17

申请人： Taichi Nakamura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Yukihiro Ishimaru

发明人： Taichi Nakamura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Yukihiro Ishimaru

IPC分类号： H01L23/00

CPC分类号： H01L24/30 ,  B22F2999/00 ,  B23K1/0016 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K2101/40 ,  B32B15/018 ,  C22C1/0483 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  C22C9/02 ,  C22C13/00 ,  H01L21/563 ,  H01L23/4827 ,  H01L23/562 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05147 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/2733 ,  H01L2224/29 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/83065 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2924/00015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  B22F1/0003 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2224/45099

摘要： A bonding structure body in which a semiconductor element and an electrode are bonded via a solder material, wherein a part that allows bonding has a first intermetallic compound layer that has been formed on the electrode side, a second intermetallic compound layer that has been formed on the semiconductor element side, and a third layer that is constituted by a phase containing Sn and a sticks-like intermetallic compound part, which is sandwiched between the two layers of the first intermetallic compound layer and the second intermetallic compound layer, and the sticks-like intermetallic compound part is interlayer-bonded to both of the first intermetallic compound layer and the second intermetallic compound layer.

摘要翻译： 一种接合结构体，其中半导体元件和电极通过焊料材料接合，其中允许接合的部分具有形成在电极侧的第一金属间化合物层，形成在第二金属间化合物层上的第二金属间化合物层 半导体元件侧和由夹在第一金属间化合物层和第二金属间化合物层的两层之间的含有Sn和棒状金属间化合物部分的相位构成的第三层， 类似金属间化合物部分被层间接合到第一金属间化合物层和第二金属间化合物层上。

公开(公告)号：US08421246B2

公开(公告)日：2013-04-16

申请号：US12864826

申请日：2009-05-22

申请人： Akio Furusawa ,  Shigeaki Sakatani ,  Taichi Nakamura ,  Takahiro Matsuo

发明人： Akio Furusawa ,  Shigeaki Sakatani ,  Taichi Nakamura ,  Takahiro Matsuo

IPC分类号： H01L29/43

CPC分类号： B23K1/0016 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/264 ,  B23K2101/40 ,  C22C12/00 ,  C22C19/03 ,  H01L23/488 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/29101 ,  H01L2224/29113 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.

摘要翻译： 接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。 接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及 设置在镍层和焊料层之间的阻挡层。 这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。

公开(公告)号：USD647549S1

公开(公告)日：2011-10-25

申请号：US29323537

申请日：2008-08-27

申请人： Taichi Nakamura

设计人： Taichi Nakamura

公开(公告)号：US20100200800A1

公开(公告)日：2010-08-12

申请号：US12304932

申请日：2008-09-12

申请人： Tadamasa Fujimura ,  Taichi Nakamura ,  Shigeru Shiozaki

发明人： Tadamasa Fujimura ,  Taichi Nakamura ,  Shigeru Shiozaki

IPC分类号： C09K5/00

CPC分类号： A47G9/007 ,  A47G9/02 ,  D01F1/10 ,  D01F2/08 ,  D06M11/74 ,  D06M11/83 ,  D06M23/08 ,  Y10T428/29

摘要： Fibers containing nano-sized diamond and platinum nanocolloid, and bedding formed thereby.

摘要翻译： 含有纳米尺寸金刚石和铂纳米胶体的纤维，以及由此形成的床上用品。