摘要:
A location method and system for a mobile communication system having a plurality of zones and a plurality of sectors in each zone. The location method and system locate a zone and sector in a zone where a mobile station is located. In the location system a base station associated with each zone transmits a control channel signal and transmits a sector signal for each sector in the zone. Each control signal of a zone differs from control channel signals of other zones. Each sector signal differs from other sector signal and control channel signals. A mobile station controller associated with each mobile station receives the control channel signals, determines which zone the mobile station is in as a location zone based on the received control channel signals, receives sector signals for sectors within the location zone, and determines which sector of the location zone the mobile station is in as a location sector based on the received sector signals.
摘要:
Mobile stations are classified into a first grouped station which is portable, and a second ungrouped station which is carried by a vehicle. A grouped station receives a part of the time slots of a paging channel relating to the group which the station belongs, and an ungrouped station receives all the time slots of a paging channel. A base station having a plurality of buffer cells (1-n) relating to each group, stores the queue of the paging signals in each buffer cell, and broadcasts the content of each buffer cell in the related time slot of the paging channel. A paging signal for a grouped station is stored in the related buffer cell, and a paging signal for an ungrouped station is stored in the buffer cell which has the shortest queue. Thus, a grouped station saves battery power because of intermittently receiving a paging signal, while keeping a short waiting time for an ungrouped station, and small call loss ratio.
摘要:
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.
摘要:
A substrate processing apparatus detects malfunction of mechanisms in MFC. An inert gas supply line, a first shut-off valve shutting off the inert gas supply, a process gas supply line, and a second shut-off valve shutting off the process gas supply are installed upstream of the MFC. A gas supply pipe connected to a process chamber, a third shut-off valve shutting off gas supply to the gas supply pipe, an exhaust vent line which is exhaustible, and a fourth shut-off valve shutting off gas supply to the exhaust vent line are installed downstream of the MFC. A main control unit determines that the MFC is abnormal if a transition time exceeds a previously set time when the MFC transitions from a closed state to an opened state while the shut-off valves are in a closed state.
摘要:
A friction drive belt (B) includes a belt body (10) that is wrapped around pulleys in contact therewith to transmit power. At least a pulley contact portion (15) of the belt main body (10) is made of a rubber composition containing 30-80 parts by mass of at least one layered silicate selected from a smectite group and a vermiculite group, per 100 parts by mass of raw rubber containing an ethylene-α-olefin elastomer.
摘要:
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.
摘要:
An apparatus, method, etc. that in designing of the base sequence of, for example, siRNA, realize high-speed retrieval any genes containing analogous base sequences without omission. Accordingly, retrieval is carried out in such a manner that two partial sequences of given length and any extra part are identified from inputted base sequences, and that hamming distance being the number of corresponding bases incompatible with each other is divided and assigned to the partial sequences and extra part and out of the two partial sequences, one with an assigned number not greater is selected and retrieved.
摘要:
There is provided a layout verification method including a space acquisition step of, with a wiring connected to a gate through a via as a target wiring, acquiring a space between the target wiring and a wiring adjacent thereto, a calculation step of calculating an antenna ratio according to the space between the target wiring and the adjacent wiring, the area of the gate, and the area of the target wiring, and an output step of outputting an antenna damage error when the antenna ratio exceeds a predetermined value.
摘要:
It is intended to efficiently determine a base sequence specifically appearing in an expression gene. For this, providing that the expression gene consists of exons (301) . . . (306) and especially that exon (301) is united with exon (302) and exon (302) with exon (303), an aggregate of base sequences (401) (403) being a union of exon base sequences (301) . . . (305) and a boundary base sequence obtained by uniting together base sequences (404) and (405) and base sequences (406) and (407) respectively existing over boundaries between exon (301) and exon (302) and between exon (302) and exon (303) is formed, and the aggregate is searched. If a base sequence is one specifically appearing in the expression gene, the number of search results is 1 and otherwise, the number is plural.
摘要:
A high-strength protective member made of tungsten is disposed under a disconnecting point of a fuse. This protective member is formed simultaneously with formation of a via contact portion which connects the fuse with wiring, for example.