摘要:
A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n−1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n−1) connecting hinges.
摘要:
A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n−1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n−1) connecting hinges.
摘要:
A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n−1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n−1) connecting hinges.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
摘要:
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.