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公开(公告)号：US20230357561A1
公开(公告)日：2023-11-09
申请号：US18206386
申请日：2023-06-06
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Taiki Maeyama , Hiroaki Sakata
CPC classification number: C08L63/00 , C08J5/243 , C08J2363/00 , C08J2363/02 , C08J2463/00 , C08J2463/02 , C08J2481/06 , C08L2205/025 , C08L2205/03 , C08L2205/035
Abstract: A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×103 to 2.0×108 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin comprising a m- or p-aminophenol epoxy resin [b1] and either a glycidyl ether epoxy resin or a glycidyl amine epoxy resin [b2] that has two or more glycidyl groups in a molecule, [C] curing agent, and [D] thermoplastic resin.
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公开(公告)号：US20210122892A1
公开(公告)日：2021-04-29
申请号：US17253214
申请日：2019-06-25
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Taiki Maeyama , Daisuke Kido , Takashi Ikushima , Naofumi Hosokawa , Hirokazu Ohnishi
Abstract: A prepreg having a high processability and laminating performance in an automated lay-up device and serving to produce a cured product having good physical properties is described, and also a method for the production thereof, the prepreg comprising at least the components [A] to [E] listed blow and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but is substantially free of the component [E] and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E] and disposed adjacent to each surface of the first layer: [A] carbon fiber, [B] epoxy resin, [C] curing agent, [D] thermoplastic resin, and [E] particles containing a thermoplastic resin as primary component and having a volume-average particle diameter of 5 to 50 μm.
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公开(公告)号：US09676936B2
公开(公告)日：2017-06-13
申请号：US14759570
申请日：2014-01-24
Applicant: TORAY INDUSTRIES, INC.
Inventor： Yuko Shimizu , Hiroshi Kobayashi , Nobuyuki Tomioka , Hiroshi Takezaki , Shirou Honda
CPC classification number: C08L63/00 , C08J5/24 , C08J2363/00 , C08L29/04 , C08L77/00
Abstract: The invention provides a prepreg that can give a fiber-reinforced composite material exhibiting stable and excellent interlaminar fracture toughness and impact resistance under wide molding conditions. The prepreg includes at least a reinforcement fiber [A], a thermosetting resin [B], and the following component [C] wherein 90% or more of the material [C] is present inside a region of the prepreg that extends from any surface of the prepreg to a prepreg site having, from the surface, a depth of 20% of the thickness of the prepreg. The component [C] satisfies requirements that (i) the storage elastic modulus G′ of the material constituting the particles is more than 1 MPa, and 70 MPa or less at 180° C., and that (ii) the ratio of the storage elastic modulus G′ of the material constituting the particles at 160° C. to the storage elastic modulus G′ of the material at 200° C. ranges from 1 to 5; and is insoluble in the thermosetting resin [B].
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4.发明申请PROCESS OF PRODUCING POLYLACTIC ACID-BASED RESIN MICROPARTICLES AND POLYLACTIC ACID-BASED RESIN MICROPARTICLES 审中-公开生产基于聚酸的树脂微生物和基于聚酸的树脂微生物的方法公开(公告)号：US20150183928A1
公开(公告)日：2015-07-02
申请号：US14659791
申请日：2015-03-17
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Takezaki , Hiroshi Kobayashi , Makiko Saito , Itaru Asano
IPC: C08G63/81
CPC classification number: C08G63/81 , A61K8/0241 , A61K8/0279 , A61K8/85 , A61K2800/412 , A61Q1/02 , A61Q1/10 , C08G63/08 , C08J3/14 , C08J9/26 , C08J9/28 , C08J2367/04 , G03G9/0802 , G03G9/0804 , G03G9/0821 , G03G9/08722 , G03G9/08762 , G03G9/08775 , Y10T428/2982
Abstract: A process of producing polylactic acid-based resin microparticles includes a dissolving step that forms a system, which can cause phase separation into two phases of a solution phase mainly composed of polylactic acid-based resin (A) having an enthalpy of fusion of less than 5 J/g and a solution phase mainly composed of polymer (B) different from polylactic acid-based resin, by dissolving the polylactic acid-based resin (A) and the polymer (B) different from polylactic acid-based resin in an ether-based organic solvent (C); an emulsion-forming step that forms an emulsion by applying a shear force to the system; and a microparticle-forming step that precipitates polylactic acid-based resin microparticles by contacting the emulsion with a poor solvent which has lower solubility of the polylactic acid-based resin (A) than the ether-based organic solvent (C).
Abstract translation: 制造聚乳酸类树脂微粒的方法包括形成系统的溶解步骤，其能够相分离成主相由熔融焓小于等于的聚乳酸类树脂（A）构成的溶液相的两相 5J / g和主要由不同于聚乳酸类树脂的聚合物（B）组成的溶液相，通过将不同于聚乳酸类树脂的聚乳酸类树脂（A）和聚合物（B）溶解在醚中 的有机溶剂（C）; 通过向系统施加剪切力而形成乳液的乳液形成步骤; 以及通过使所述乳液与所述聚乳酸类树脂（A）比所述醚系有机溶剂（C）的溶解性低的不良溶剂接触来使聚乳酸类树脂微粒析出的微粒形成工序。
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公开(公告)号：US11939465B2
公开(公告)日：2024-03-26
申请号：US17253205
申请日：2019-03-27
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Taiki Maeyama , Daisuke Kido , Takashi Ikushima , Naofumi Hosokawa , Hirokazu Ohnishi
CPC classification number: C08L63/00 , C08J5/243 , C08J2363/02 , C08J2477/00 , C08J2481/06 , C08L2205/03
Abstract: A prepreg having high processability and laminating performance and a method to produce such a prepreg is described, the prepreg comprising at least the components [A] to [E] shown below, and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but which is substantially free of the component [E], and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E],
[A] carbon fiber,
[B] epoxy resin,
[C] curing agent,
[D] thermoplastic resin, and
[E] particles containing a thermoplastic resin as primary component and having a volume-average particle diameter of 5 to 50 μm.-
Patent Agency Ranking
公开(公告)号：US20150031834A1
公开(公告)日：2015-01-29
申请号：US14378817
申请日：2013-02-08
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Takahiko Otsubo , Hiroshi Takezaki
IPC: C08J3/14
CPC classification number: C08J3/14 , C08G73/1046 , C08G73/14 , C08J3/005 , C08J2329/04 , C08J2477/00 , C08J2477/02 , C08L77/02 , C08L77/06 , C08L101/00 , C08L29/04 , C08L79/08
Abstract: Composite polyamide fine particles include a polyamide (A1) which has a melting point or a glass transition temperature of over 100° C. and a polymer (A2) which is different from the polyamide (A1). The composite polyamide fine particles have: a dispersion structure in which a plurality of domains each having an average particle diameter of 0.05 to 100 μm whose main component is the polymer (A2) are dispersed in a polyamide (A1) based matrix; an average particle diameter of 0.1 to 500 μm; and a sphericity of 80 or more.
Abstract translation: 复合聚酰胺微粒包括熔点或玻璃化转变温度超过100℃的聚酰胺（A1）和不同于聚酰胺（A1）的聚合物（A2）。 复合聚酰胺微粒具有以主要成分为聚合物（A2）的平均粒径为0.05〜100μm的多个畴分散在聚酰胺（A1）系基体中的分散结构， 平均粒径为0.1〜500μm; 球形度为80以上。
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公开(公告)号：US20240400775A1
公开(公告)日：2024-12-05
申请号：US18692968
申请日：2022-09-29
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Masato Honma , Kotaro Shinohara , Hideki Hanabusa
Abstract: A prepreg and a fiber-reinforced resin molded article are provided that have excellent joint strength with other members, appropriately control the resin flow at the time of welding, and show excellent dimensional stability at the time of welding, where the prepreg includes a thermoplastic resin layer containing reinforcing fibers and a thermoplastic resin, in which the thermoplastic resin layer is present on at least one surface of the prepreg, and where the thermoplastic resin layer contains 65.0 to 99.5% by mass of a constituting unit of the thermoplastic resin and 0.5 to 35.0% by mass of a total amount of a constituting unit of a thermosetting resin and a constituting unit of a curing agent with respect to 100% by mass of a total amount of the constituting unit of the thermoplastic resin, the constituting unit of the thermosetting resin, and the constituting unit of the curing agent.
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公开(公告)号：US11708487B2
公开(公告)日：2023-07-25
申请号：US16475518
申请日：2018-01-18
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Taiki Maeyama , Hiroaki Sakata
CPC classification number: C08L63/00 , C08J5/243 , C08J2363/00 , C08J2363/02 , C08J2463/00 , C08J2463/02 , C08J2481/06 , C08L2205/025 , C08L2205/03 , C08L2205/035
Abstract: A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×103 to 2.0×108 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin, [C] curing agent, and [D] thermoplastic resin.
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公开(公告)号：US20190330433A1
公开(公告)日：2019-10-31
申请号：US16475518
申请日：2018-01-18
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Taiki Maeyama , Hiroaki Sakata
Abstract: A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×103 to 2.0×108 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin, [C] curing agent, and [D] thermoplastic resin.
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公开(公告)号：US20240166798A1
公开(公告)日：2024-05-23
申请号：US18280510
申请日：2022-03-24
Applicant: Toray Industries, Inc.
Inventor： Hiroshi Kobayashi , Benjamin Rutz , Koji Furukawa , Toshiya P. Kamae
CPC classification number: C08G59/3227 , C08G59/4035 , C08G59/5033 , C08G59/686 , C08G59/688 , C08J5/246 , C08J2363/00
Abstract: A first epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-1] at least a first hardener and [B-2] at least a second hardener different from the first hardener, and [C] at least one accelerator, wherein the epoxy resin composition satisfies 5.0>|T1−T2|, where [A], [B], [C], T1 and T2 are as defined. A second epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-1] at least one amine compound and [B-2] at least one organic acid hydrazide compound, and [C] at least one accelerator comprising [C-1] at least one organophosphorus compound, where [A], [B] and [C-1] are as defined. A prepreg comprising reinforcing fiber bundles impregnated with the first epoxy resin or the second epoxy resin is also described as well as a fiber-reinforced composite material.
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