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公开(公告)号：US20060179648A1
公开(公告)日：2006-08-17
申请号：US11345902
申请日：2006-02-02
申请人： Toshiaki Sawada , Makoto Yamazaki
发明人： Toshiaki Sawada , Makoto Yamazaki
IPC分类号： A41H37/06
CPC分类号： A44B19/62 , A44B19/60 , Y10T29/49782 , Y10T29/49783 , Y10T29/49785 , Y10T29/53291 , Y10T29/53296 , Y10T29/533
摘要： The invention is a continuous finishing apparatus for a slide fastener having a slider introduction portion for successively introducing a slider by intermittently running a slide fastener chain, wherein, a slider introduction member thrusts into the space portion when the slider held by a slider holding member is brought into a space portion and set therein, moves downstream of the slide fastener chain within the space portion, holds an engaging element disposed at a downstream end portion of the space portion, and then, continues to move to the downstream for carrying the slide fastener chain, and wherein the slider is introduced and set along the same chain upon this carriage. Because the slider introduction member carries the slide fastener by holding the engaging elements on an edge of the fastener tape, which is least elongated, no disagreement occurs in position of corresponding right and left engaging elements.
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公开(公告)号：US07549218B2
公开(公告)日：2009-06-23
申请号：US11345902
申请日：2006-02-02
申请人： Toshiaki Sawada , Makoto Yamazaki
发明人： Toshiaki Sawada , Makoto Yamazaki
CPC分类号： A44B19/62 , A44B19/60 , Y10T29/49782 , Y10T29/49783 , Y10T29/49785 , Y10T29/53291 , Y10T29/53296 , Y10T29/533
摘要： The invention is a continuous finishing apparatus for a slide fastener having a slider introduction portion for successively introducing a slider by intermittently running a slide fastener chain, wherein, a slider introduction member thrusts into the space portion when the slider held by a slider holding member is brought into a space portion and set therein, moves downstream of the slide fastener chain within the space portion, holds an engaging element disposed at a downstream end portion of the space portion, and then, continues to move to the downstream for carrying the slide fastener chain, and wherein the slider is introduced and set along the same chain upon this carriage. Because the slider introduction member carries the slide fastener by holding the engaging elements on an edge of the fastener tape, which is least elongated, no disagreement occurs in position of corresponding right and left engaging elements.
摘要翻译： 本发明是一种用于拉链的连续精整装置，具有滑块引导部分，用于通过间歇地运行拉链链条来连续引入滑块，其中当滑块保持构件保持的滑块为滑块引导构件时，滑块导入构件推入空间部分 进入空间部分并设置在其中，在空间部分内移动拉链链条的下游，保持设置在空间部分的下游端部处的接合元件，然后继续移动到下游以承载拉链 链，并且其中滑块在该托架上沿着相同的链条被引入和设置。 由于滑块引导构件通过将接合元件保持在拉链带的最不细长的边缘上来承载拉链，所以在相应的右和左接合元件的位置上不会发生不一致。
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公开(公告)号：US06941882B2
公开(公告)日：2005-09-13
申请号：US10731497
申请日：2003-12-08
申请人： Toshiaki Sawada , Makoto Yamazaki
发明人： Toshiaki Sawada , Makoto Yamazaki
CPC分类号： D05B41/00 , D05B35/064 , D05B37/04 , D05D2305/12
摘要： In a slide fastener chain sewing apparatus, a continuously supplied slide fastener chain is successively sewn onto a pair of left and right cloth pieces. A chain cutter cuts the slide fastener chain between the cloth pieces which are moved continuously over a sewn product transfer device table and suspending from a front end of the table. A sewn product receiving section has sewn product transfer means for receiving, in a lower part, a sewn product cut away from the succeeding cloth piece having the fastener chain sewn thereto. The sewn product transfer device transfers the sewn product to a rear end of the table through a lower space portion of the table.
摘要翻译： 在拉链链条缝纫装置中，将连续供给的拉链链连续地缝合到一对左右的布料上。 链条切割机在连接在缝合产品传送装置台上并从桌子前端悬挂的布料之间切割拉链链条。 缝制产品接收部分具有缝合产品传送装置，用于在下部接收从其上缝合有紧固链的后续布料切下的缝合产品。 缝制产品传送装置通过桌子的下部空间部分将缝制产品传送到桌子的后端。
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公开(公告)号：US07849576B2
公开(公告)日：2010-12-14
申请号：US11404005
申请日：2006-04-13
申请人： Toshiaki Sawada , Makoto Yamazaki
发明人： Toshiaki Sawada , Makoto Yamazaki
IPC分类号： B29D5/00
CPC分类号： A44B19/42 , Y10T29/49782 , Y10T29/49785 , Y10T29/5101 , Y10T29/53291
摘要： An apparatus and method for manufacturing a slide fastener. The apparatus may provide a chain transfer path inclined downward for transferring a fastener chain, a chain cutting portion disposed at a middle of the transfer path and a feed portion disposed on an upstream side of the chain cutting portion of the chain transfer path. A control portion may also be provided for a) stopping to transfer the fastener chain by the feed portion and b) operating the chain cutting portion. A pivoting section may also be provided, which pivots the chain cutting portion by a predetermined angle on the chain transfer path around an axis line orthogonal to the transfer path.
摘要翻译： 用于制造拉链的装置和方法。 该装置可以提供向下倾斜的链条传送路径，用于传送拉链链条，设置在传送路径中间的链条切割部分和设置在链条传送路径的链条切割部分的上游侧的进给部分。 也可以设置控制部分，用于a）停止通过进给部分传送拉链链条，以及b）操作链条切割部分。 还可以设置枢转部分，该枢转部分围绕与传送路径正交的轴线在链条传送路径上枢转链条切割部分预定的角度。
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5.发明申请公开(公告)号：US20060242815A1
公开(公告)日：2006-11-02
申请号：US11404005
申请日：2006-04-13
申请人： Toshiaki Sawada , Makoto Yamazaki
发明人： Toshiaki Sawada , Makoto Yamazaki
CPC分类号： A44B19/42 , Y10T29/49782 , Y10T29/49785 , Y10T29/5101 , Y10T29/53291
摘要： A method of manufacturing a slide fastener by cutting a long fastener chain, alternately having in a longitudinal direction thereof a pair of element rows meshing with each other and an interval portion lacking the element row, at a predetermined position of the interval portion, the method including the steps of: arranging a feed portion of the fastener chain on an upstream side of a chain cutting portion; positively transferring the fastener chain successively by the feed portion to the chain cutting portion along an inclined transfer path inclined downward; operating the chain cutting portion after awaiting for stopping to transfer the fastener chain and cutting the slide faster chain in a cross direction at the predetermined position of the interval portion; and making the slide fastener cut to be separated by the chain cutting portion slide down by a self weight thereof along the transfer path.
摘要翻译： 通过切割长的链条来制造拉链的方法，所述方法在所述间隔部分的预定位置处交替地沿其长度方向具有彼此相互啮合的一对元件列和缺少所述元件列的间隔部分，所述方法 包括以下步骤：将链条的进给部分布置在链条切割部分的上游侧; 沿着向下倾斜的倾斜传送路径将紧固链条依次由进给部分正向传递到链条切割部分; 在所述间隔部分的预定位置等待停止后传送所述链条并在所述交叉方向切割所述滑块更快的链条来操作所述链条切割部分; 并且通过链条切割部分使拉链切割成分开的方式沿着传送路径自身向下滑动。
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公开(公告)号：US20070120573A1
公开(公告)日：2007-05-31
申请号：US10572185
申请日：2004-09-15
申请人： Toshiaki Sawada
发明人： Toshiaki Sawada
IPC分类号： G01R27/08
CPC分类号： G01R31/31926 , G01R31/31924
摘要： First, second, and third semiconductor switches are connected in series terminal between input and output terminals and first and second voltage application means are connected in parallel to the first and third semiconductor switches, whereby providing semiconductor switch circuit. Each voltage application means is composed of a series-connected circuit of first or second voltage application semiconductor switch and direct current amplifier having gain state of approximately +1 and whose input side is connected to the input or output terminal. One end of the first or second voltage application semiconductor switch is connected to the junction J of the first and second semiconductor switches, or to the junction K of the second and third semiconductor switches, respectively. When first through third semiconductor switches are turned OFF, first and second voltage application semiconductor switches are turned on to apply the potential of input and output terminals to the junctions J and K.
摘要翻译： 第一，第二和第三半导体开关串联在输入和输出端之间，第一和第二电压施加装置并联连接到第一和第三半导体开关，从而提供半导体开关电路。 每个电压施加装置由第一或第二电压施加半导体开关的串联电路和具有大约+1的增益状态的直流放大器组成，其输入侧连接到输入或输出端子。 第一或第二电压施加半导体开关的一端分别连接到第一和第二半导体开关的结J，或者连接到第二和第三半导体开关的接点K. 当第一至第三半导体开关断开时，第一和第二电压施加半导体开关导通，以将输入和输出端子的电位施加到接点J和K。
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公开(公告)号：US4608745A
公开(公告)日：1986-09-02
申请号：US659528
申请日：1984-10-10
CPC分类号： D05B35/064 , Y10T29/49782
摘要： In a method for automatically attaching successive fly strips to a continuous slide fastener chain, the successive strips are fed to a standby point one after another by a conveyor horizontally spaced from a sewing machine by a gap in which the standby point is disposed. A preceding strip is supplied from the standby point to the sewing machine with its trailing end portion hanging in the gap, while a succeeding strip is kept waiting at the standby point for a subsequent supply. When the trailing end of the preceding strip has passed a fixed point downstream of the standby point in the gap as the sewing of the preceding strip progresses, the succeeding strip is supplied at a speed higher than the rate at which the sewing of the preceding strip progresses.
摘要翻译： 在将连续的飞带自动地连接到连续的拉链链条上的方法中，连续的条带通过与缝纫机水平间隔的输送机一个接一个地输送到备用点，该输送机设置有备用点。 从待机点将前一条带从缝纫机提供到缝纫机的后端部分，而随后的条带则在待机点处等待随后的供给。 当前一条带的尾端随着前一条带的缝合进行而经过间隙中待机点下游的固定点时，后续条带以比前一条带的缝合速率高的速度提供 进步。
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公开(公告)号：US08314502B2
公开(公告)日：2012-11-20
申请号：US13081208
申请日：2011-04-06
申请人： Masami Koketsu , Toshiaki Sawada
发明人： Masami Koketsu , Toshiaki Sawada
IPC分类号： H01L23/544
CPC分类号： H01L23/544 , H01L23/5226 , H01L23/5283 , H01L23/535 , H01L23/585 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L27/124 , H01L27/1248 , H01L29/78 , H01L2223/5442 , H01L2223/54426 , H01L2223/5448 , H01L2224/16 , H01L2224/8113 , H01L2224/8185 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01054 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/04941 , H01L2924/0781 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/1426 , H01L2924/1433 , H01L2924/15788 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： To provide a technique capable of positioning of a semiconductor chip and a mounting substrate with high precision by improving visibility of an alignment mark. In a semiconductor chip constituting an LCD driver, a mark is formed in an alignment mark formation region over a semiconductor substrate. The mark is formed in the same layer as that of an uppermost layer wiring (third layer wiring) in an integrated circuit formation region. Then, in the lower layer of the mark and a background region surrounding the mark, patterns are formed. At this time, the pattern P1a is formed in the same layer as that of a second layer wiring and the pattern P1b is formed in the same layer as that of a first layer wiring. Further, the pattern P2 is formed in the same layer as that of a gate electrode, and the pattern P3 is formed in the same layer as that of an element isolation region.
摘要翻译： 通过提高对准标记的可视性，提供能够高精度地定位半导体芯片和安装基板的技术。 在构成LCD驱动器的半导体芯片中，在半导体衬底上的对准标记形成区域中形成标记。 标记形成在与集成电路形成区域中的最上层布线（第三层布线）相同的层中。 然后，在标记的下层和标记周围的背景区域形成图案。 此时，图案P1a形成在与第二层布线相同的层中，并且图案P1b形成在与第一层布线相同的层中。 此外，图案P2形成在与栅极电极相同的层中，并且图案P3形成在与元件隔离区域相同的层中。
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公开(公告)号：US20110180877A1
公开(公告)日：2011-07-28
申请号：US13081208
申请日：2011-04-06
申请人： Masami KOKETSU , Toshiaki Sawada
发明人： Masami KOKETSU , Toshiaki Sawada
IPC分类号： H01L23/544 , H01L23/48 , H01L23/498
CPC分类号： H01L23/544 , H01L23/5226 , H01L23/5283 , H01L23/535 , H01L23/585 , H01L24/13 , H01L24/29 , H01L24/81 , H01L24/83 , H01L27/124 , H01L27/1248 , H01L29/78 , H01L2223/5442 , H01L2223/54426 , H01L2223/5448 , H01L2224/16 , H01L2224/8113 , H01L2224/8185 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01054 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/04941 , H01L2924/0781 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/1426 , H01L2924/1433 , H01L2924/15788 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： To provide a technique capable of positioning of a semiconductor chip and a mounting substrate with high precision by improving visibility of an alignment mark. In a semiconductor chip constituting an LCD driver, a mark is formed in an alignment mark formation region over a semiconductor substrate. The mark is formed in the same layer as that of an uppermost layer wiring (third layer wiring) in an integrated circuit formation region. Then, in the lower layer of the mark and a background region surrounding the mark, patterns are formed. At this time, the pattern P1a is formed in the same layer as that of a second layer wiring and the pattern P1b is formed in the same layer as that of a first layer wiring. Further, the pattern P2 is formed in the same layer as that of a gate electrode, and the pattern P3 is formed in the same layer as that of an element isolation region.
摘要翻译： 通过提高对准标记的可视性，提供能够高精度地定位半导体芯片和安装基板的技术。 在构成LCD驱动器的半导体芯片中，在半导体衬底上的对准标记形成区域中形成标记。 标记形成在与集成电路形成区域中的最上层布线（第三层布线）相同的层中。 然后，在标记的下层和标记周围的背景区域形成图案。 此时，图案P1a形成在与第二层布线相同的层中，并且图案P1b形成在与第一层布线相同的层中。 此外，图案P2形成在与栅极电极相同的层中，并且图案P3形成在与元件隔离区域相同的层中。
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公开(公告)号：US20070184634A1
公开(公告)日：2007-08-09
申请号：US11649297
申请日：2007-01-04
IPC分类号： H01L21/00
CPC分类号： H01L21/78
摘要： A semiconductor device manufacturing method is disclosed wherein a semiconductor integrated circuit is formed in each of plural semiconductor chip regions of a semiconductor wafer which regions are to become semiconductor chips later and then the semiconductor wafer is cut along scribing regions each provided between adjacent semiconductor chip regions. The semiconductor chip regions are each in a rectangular shape having long sides and short sides. The scribing regions include a first scribing region in contact with the short sides and a second scribing region in contact with the long sides. The width of the second scribing region is smaller than the width of the first scribing region. In a photolithography process, first and second alignment patterns for making alignment in both X and Y directions are all formed in the first scribing region and not formed in the second scribing region. Both improvement of the alignment accuracy and reduction of the semiconductor device manufacturing cost can be attained.
摘要翻译： 公开了一种半导体器件制造方法，其中半导体集成电路形成在半导体晶片的多个半导体芯片区域的每一个中，这些区域将在稍后成为半导体芯片，然后半导体晶片沿着划分区域切割，每个划分区域设置在相邻的半导体芯片区域 。 半导体芯片区域各自具有长边和短边的矩形。 划线区域包括与短边接触的第一划线区域和与长边接触的第二划线区域。 第二划线区域的宽度小于第一划线区域的宽度。 在光刻工艺中，在第一划线区域中都形成用于在X和Y方向上进行取向的第一和第二对准图案，而不形成在第二划刻区域中。 可以实现对准精度的提高和半导体器件制造成本的降低。
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