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    Molded products for high voltage apparatus comprising brominated epoxy resins
    3.
    发明授权
    Molded products for high voltage apparatus comprising brominated epoxy resins 失效
    包含溴化环氧树脂的高压设备的成型产品

    公开(公告)号：US5880179A

    公开(公告)日：1999-03-09

    申请号：US774068

    申请日：1996-12-23

    申请人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

    发明人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

    IPC分类号： B29C39/10 ,  B29K63/00 ,  B29L31/34 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/30 ,  C08G59/40 ,  C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/56 ,  C08L63/00 ,  H01B3/40 ,  C08L63/02 ,  H01F27/30 ,  H02K1/04

    CPC分类号： H01B3/40 ,  C08G59/226 ,  C08G59/245 ,  C08G59/26 ,  C08G59/30 ,  C08G59/42 ,  C08L63/00

    摘要： "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

    摘要翻译： “包含环氧树脂（A），酸酐（B），固化促进剂（C），至少一种偶联剂（D）和填料（E））的成型用环氧树脂组合物的高压设备用成型体 ）。 环氧树脂（A）是双官能溴化双酚A或溴化双酚F“环氧树脂和至少一种双酚A，双酚F或双酚环氧树脂”。 偶联剂（D）选自环氧硅烷型偶联剂，苯基氨基硅烷型偶联剂，巯基硅烷型偶联剂和钛酸酯型偶联剂，其平均粒径不大于60μm，其中 直径不大于5μm的颗粒的含量不小于5重量％。 填料（E）包括二氧化硅填料或氧化铝填料中的至少一种。 酸酐（B）的酸酐基与环氧树脂（A）的环氧基数的比例为0.5〜1.5; 相对于100重量份的环氧树脂（A），固化促进剂（C）的使用量为0.5〜10重量份。 相对于100重量份的填料（E），偶联剂（D）的量为0.05〜5重量份。 填料（E）的含量为树脂组合物的35〜95重量％。 环氧树脂组合物具有优异的机械强度和韧性等机械性能，耐热性优异。