公开(公告)号：US20100277872A1

公开(公告)日：2010-11-04

申请号：US12834073

申请日：2010-07-12

申请人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

发明人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

IPC分类号： H05K7/20 ,  B32B37/02 ,  B32B27/04

CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T156/10 ,  Y10T428/24372 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/049 ,  H01L2924/045 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.

摘要翻译： 绝缘片包括热固性树脂的粘合剂组分并且包含填充构件。 绝缘片的粘合面区域的导热率小于绝缘片的内部区域的导热率。

公开(公告)号：US5939472A

公开(公告)日：1999-08-17

申请号：US841312

申请日：1997-04-30

申请人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

发明人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

IPC分类号： B29C39/10 ,  B29K63/00 ,  B29L31/34 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/30 ,  C08G59/40 ,  C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/56 ,  C08L63/00 ,  H01B3/40 ,  C08L63/02

CPC分类号： H01B3/40 ,  C08G59/226 ,  C08G59/245 ,  C08G59/26 ,  C08G59/30 ,  C08G59/42 ,  C08L63/00

摘要： Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

摘要翻译： 环氧树脂（A），酸酐（B），固化促进剂（C），偶联剂（D）和填料（E））的模塑用环氧树脂组合物，用于制备由环氧树脂 用于模塑的树脂组合物和通过制备模制产品的方法制备的模塑产品。 环氧树脂组合物具有机械强度高，韧性高，耐热性优异的机械性能优异，制备成型体的方法可以提供由环氧树脂组合物制成的模制品，并且生产的模制产品具有优异的抗裂性和高 可靠性。

公开(公告)号：US5880179A

公开(公告)日：1999-03-09

申请号：US774068

申请日：1996-12-23

申请人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

发明人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

IPC分类号： B29C39/10 ,  B29K63/00 ,  B29L31/34 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/30 ,  C08G59/40 ,  C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/56 ,  C08L63/00 ,  H01B3/40 ,  C08L63/02 ,  H01F27/30 ,  H02K1/04

CPC分类号： H01B3/40 ,  C08G59/226 ,  C08G59/245 ,  C08G59/26 ,  C08G59/30 ,  C08G59/42 ,  C08L63/00

摘要： "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

摘要翻译： “包含环氧树脂（A），酸酐（B），固化促进剂（C），至少一种偶联剂（D）和填料（E））的成型用环氧树脂组合物的高压设备用成型体 ）。 环氧树脂（A）是双官能溴化双酚A或溴化双酚F“环氧树脂和至少一种双酚A，双酚F或双酚环氧树脂”。 偶联剂（D）选自环氧硅烷型偶联剂，苯基氨基硅烷型偶联剂，巯基硅烷型偶联剂和钛酸酯型偶联剂，其平均粒径不大于60μm，其中 直径不大于5μm的颗粒的含量不小于5重量％。 填料（E）包括二氧化硅填料或氧化铝填料中的至少一种。 酸酐（B）的酸酐基与环氧树脂（A）的环氧基数的比例为0.5〜1.5; 相对于100重量份的环氧树脂（A），固化促进剂（C）的使用量为0.5〜10重量份。 相对于100重量份的填料（E），偶联剂（D）的量为0.05〜5重量份。 填料（E）的含量为树脂组合物的35〜95重量％。 环氧树脂组合物具有优异的机械强度和韧性等机械性能，耐热性优异。

公开(公告)号：US5661223A

公开(公告)日：1997-08-26

申请号：US476578

申请日：1995-06-07

申请人： Seiji Oka ,  Mitsuhiro Nonogaki ,  Takumi Kikuchi ,  Takashi Takahama ,  Hiroyuki Nakajima ,  Michio Futakuchi

发明人： Seiji Oka ,  Mitsuhiro Nonogaki ,  Takumi Kikuchi ,  Takashi Takahama ,  Hiroyuki Nakajima ,  Michio Futakuchi

IPC分类号： C08G59/06 ,  C08G59/30 ,  C08G59/32 ,  C08L63/00 ,  H05K1/03 ,  C08L63/02

CPC分类号： C08L63/00 ,  C08G59/063 ,  C08G59/30 ,  C08G59/3218 ,  H05K1/0326

摘要： A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

摘要翻译： 用于层压体的树脂组合物包含100重量份通过（i）（1）缩水甘油化由溴化双酚A和双酚A或溴化双酚A和甲醛的共混物形成的聚合物的多官能环氧树脂（I） 或（2）多官能环氧树脂和双酚A-高级环氧树脂与羟基：环氧当量比为0.05-0.5:1的溴化双酚A反应的混合物和（ii）双酚A-甲醛酚醛树脂，其具有 相对于环氧树脂（i），羟基：环氧当量比为0.7-1.2:1的重均分子量为1,000-10,000; 和（II）1-60重量份的直链聚合物（c）如聚（醚）砜，芳族聚酯，苯氧基树脂，聚对苯二甲酸，聚醚酰亚胺或聚苯硫醚。

公开(公告)号：US08007897B2

公开(公告)日：2011-08-30

申请号：US12834073

申请日：2010-07-12

申请人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

发明人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

IPC分类号： B32B5/16 ,  H05K7/20

CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T156/10 ,  Y10T428/24372 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/049 ,  H01L2924/045 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.

摘要翻译： 绝缘片包括热固性树脂的粘合剂组分并且包含填充构件。 绝缘片的粘合面区域的导热率小于绝缘片的内部区域的导热率。

公开(公告)号：US06836006B2

公开(公告)日：2004-12-28

申请号：US09447945

申请日：1999-11-29

申请人： Hirotaka Muto ,  Takeshi Ohi ,  Takumi Kikuchi ,  Toshiyuki Kikunaga

发明人： Hirotaka Muto ,  Takeshi Ohi ,  Takumi Kikuchi ,  Toshiyuki Kikunaga

IPC分类号： H01L2302

CPC分类号： H01L25/18 ,  H01L24/33 ,  H01L24/34 ,  H01L24/37 ,  H01L24/73 ,  H01L25/074 ,  H01L2224/0603 ,  H01L2224/37147 ,  H01L2224/3718 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： In an IGBT module which contains an IGBT device and a diode device connected to each other and accommodated in a case and which radiates heat generated in operation through a radiation board, an object is to reduce the area of the module in the lateral direction to achieve size reduction. The collector electrode surface of an IGBT device is provided on a radiation board, and an element connecting conductor is bonded with conductive resin on the emitter electrode surface. The anode electrode surface of a diode device is bonded on it with the conductive resin. The IGBT device and the diode device are thus stacked and connected in the vertical direction.

摘要翻译： 在包含IGBT器件和二极管器件的IGBT模块中，其彼此连接并容纳在壳体中并且通过辐射板辐射在工作中产生的热量，其目的是减小模块在横向上的面积以实现 尺寸缩小。 IGBT器件的集电极表面设置在辐射板上，元件连接导体与发射极电极表面上的导电树脂结合。 二极管器件的阳极电极表面与导电树脂接合在其上。 因此，IGBT器件和二极管器件在垂直方向上堆叠并连接。

公开(公告)号：US06215185B1

公开(公告)日：2001-04-10

申请号：US09456403

申请日：1999-12-08

申请人： Takumi Kikuchi ,  Hirofumi Fujioka ,  Toshiyuki Kikunaga ,  Hirotaka Muto ,  Shinichi Kinouchi ,  Osamu Usui ,  Takeshi Ohi

发明人： Takumi Kikuchi ,  Hirofumi Fujioka ,  Toshiyuki Kikunaga ,  Hirotaka Muto ,  Shinichi Kinouchi ,  Osamu Usui ,  Takeshi Ohi

IPC分类号： H01L2348

CPC分类号： H01L24/72 ,  H01L23/49579 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48491 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An object is to obtain long-term reliability of an electric connection in a power semiconductor module. In a power semiconductor module, the main circuit interconnection directly connected to a power semiconductor chip (3) is formed of a busbar (6) and the power semiconductor chip (3) and the busbar electrode (6a) of the busbar (6) are electrically connected through a conductive resin (12). A member (13) having lower thermal expansion than the busbar electrode (6a) is joined to the busbar electrode (6a) in the part adjacent to said power semiconductor chip (3).

摘要翻译： 目的在于获得功率半导体模块中的电连接的长期可靠性。 在功率半导体模块中，直接连接到功率半导体芯片（3）的主电路互连由母线（6）和母线（6）的功率半导体芯片（3）和母线电极（6a）形成 通过导电树脂（12）电连接。 具有比母线电极（6a）低的​​热膨胀的部件（13）在与所述功率半导体芯片（3）相邻的部分中与汇流条电极（6a）接合。

公开(公告)号：US20060165978A1

公开(公告)日：2006-07-27

申请号：US11340867

申请日：2006-01-27

申请人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

发明人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

IPC分类号： B31B1/60 ,  D04H13/00

CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T156/10 ,  Y10T428/24372 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/049 ,  H01L2924/045 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating sheet includes an adhesive component of essentially a thermosetting resin and a filler member infiltrated into the component. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region, other than the adhesive face region of the insulating sheet.

摘要翻译： 绝缘片包括基本上是热固性树脂的粘合剂组分和渗透到组分中的填料构件。 除了绝缘片的粘合面区域之外，绝缘片的粘合面区域的导热率小于内部区域的导热率。

公开(公告)号：US06399110B1

公开(公告)日：2002-06-04

申请号：US09485300

申请日：2000-04-27

申请人： Takumi Kikuchi ,  Kouichi Hirano

发明人： Takumi Kikuchi ,  Kouichi Hirano

IPC分类号： A01N5900

CPC分类号： A61M1/287 ,  A61K45/06 ,  A61M1/282

摘要： A neutral glucose-containing preparation with excellent stability and a near physiological pH, as a transfusion preparation with minimal glucose degradation by-products and a greatly reduced formic acid content; specifically, a glucose-containing preparation comprising separately housed first and second solutions, the first and second solutions satisfying the following conditions: (a) the first solution contains 2-50% glucose, and its pH is adjusted to 3-5 with an organic acid buffer solution; (b) the second solution contains an alkalizing agent, and has a pH value of 8-13 as a pH adjustor for the first solution; and (c) the glucose concentration is 1-15% in the preparation solution obtained by mixing the first solution and second solution, and the pH of the solution is in a range of 6-8. It is used particularly as a peritoneal perfusate, such as a perfusate for Continuous Ambulatory Peritoneal Dialysis (CAPD).

摘要翻译： 具有优异的稳定性和接近生理pH的中性含葡萄糖制剂，作为具有最低葡萄糖降解副产物和大大降低的甲酸含量的输液制剂; 具体地说，包含单独容纳的第一和第二溶液的含葡萄糖的制剂，第一和第二溶液满足以下条件：（a）第一溶液含有2-50％的葡萄糖，其pH值用有机物调节至3-5 酸缓冲溶液;（b）第二溶液含有碱化剂，pH值为8-13作为第一溶液的pH调节剂; 和（c）在通过混合第一溶液和第二溶液获得的制剂溶液中葡萄糖浓度为1-15％，溶液的pH在6-8的范围内。特别是用作腹膜灌洗液， 例如连续动态腹膜透析（CAPD）的灌注液。