摘要:
The ultra wideband communication system comprises: a pulse generation section for generating a pulse signal based on a data signal; a first optical phase modulation section for performing optical phase modulation in accordance with the pulse signal, and outputting a resultant signal as an optical pulse signal; an optical transmission path for propagating the optical pulse signal; a template generation section for outputting a template signal; a second optical phase modulation section for performing optical phase modulation on the optical pulse signal in accordance with the template signal, and outputting a resultant signal as an optical phase demodulation signal; an optical phase intensity conversion section for converting information about an optical phase of the optical phase demodulation signal into information about an optical intensity thereof, and outputting a resultant signal as an optical correlation signal; an optical-electrical conversion section for performing optical-electrical conversion on the optical correlation signal, and outputting a resultant signal as a correlation signal; and a signal identification section for identifying the correlation signal outputted from the optical-electrical conversion section, thereby detecting the data signal.
摘要:
A first transmitting section frequency-multiplexes a data signal and a monitor signal, and then converts the resultant signal to an optical signal for output. A first receiving section converts the optical signal transmitted via a first optical transmission path and a wavelength demultiplexer into an electrical signal, and then extracts the monitor signal. A difference detector compares a monitor signal level with a predetermined reference level, and then outputs wavelength information to a second optical transmission path. Based on the wavelength information transmitted via the second optical transmission path, a first wavelength controller adjusts the wavelength of the optical signal for stabilization at a predetermined wavelength. Thus, it is possible to achieve a wavelength division multiplex transmission system capable of controlling the wavelength of the optical signal at low cost.
摘要:
An optical switching system that switches the output port of an optical signal as indicated by address information (a label) that is contained in optical data packets constituting the optical signal. The optical switching system reads the address information by detecting the electric power level of a label signal that has been subjected to an optical angular modulation, passed through an optical filter and been subjected to an optical detection.
摘要:
The present invention provides a low-cost optical transmission system using a plurality of subscriber lines which is capable of efficiently utilizing an optical transmission path. A communication status observing section 116 in a transmitting device 1 classifies subscribers into a plurality of groups based on a communication status at each subscriber end, and outputs constellation level information and level information which are different for each group. For each constant cycle, a modulation control section 117 and a gain control section 118 respectively set a QAM constellation level and a signal level which are different for each group and used in a basic modulating section 103.
摘要:
In a transmitter (11), a peak detection section (104) detects a peak factor of a frequency division multiplexed signal which is output from a frequency division multiplex section (103). A spurious calculation section (105) instructs a gain adjustment section (106) to adjust the signal level of the frequency division multiplexed signal so that the level of spurious components (e.g., adjacent channel leakage power ratio (ACLR)) is equal to or less than a predetermined level, based on the peak factor.
摘要:
It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.
摘要:
It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.
摘要:
It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.