Semiconductor device and etching apparatus
    1.
    发明授权
    Semiconductor device and etching apparatus 失效
    半导体器件和蚀刻装置

    公开(公告)号:US08125069B2

    公开(公告)日:2012-02-28

    申请号:US12830995

    申请日:2010-07-06

    IPC分类号: H01L23/48

    摘要: A method for manufacturing a semiconductor device comprises dry-etching a thin film using a resist mask carrying patterns in which at least one of the width of each pattern and the space between neighboring two patterns ranges from 32 to 130 nm using a halogenated carbon-containing compound gas with the halogen being at least two members selected from the group consisting of F, I and Br. The ratio of at least one of I and Br is not more than 26% of the total amount of the halogen atoms as expressed in terms of the atomic compositional ratio to transfer the patterns onto the thin film. Such etching of a thin film avoids causing damage to the resist mask used. The resulting thin film carrying the transferred patterns is used as a mask for subjecting the underlying material to dry-etching.

    摘要翻译: 一种用于制造半导体器件的方法包括使用具有图案的抗蚀剂掩模对薄膜进行干法蚀刻,其中每个图案的宽度和相邻两个图案之间的空间中的至少一个范围为32至130nm,使用含卤素的 具有卤素的复合气体是选自F,I和Br中的至少两种。 I和Br中的至少一个的比例不超过卤素原子总量的26%,如以将原料组成比转移到薄膜上的原子组成比来表示的。 这种薄膜的蚀刻避免了对所使用的抗蚀剂掩模的损害。 所得到的带有转印图案的薄膜用作对下面的材料进行干蚀刻的掩模。

    Semiconductor device and method for manufacturing the same, dry-etching process, method for making electrical connections, and etching apparatus
    2.
    发明申请
    Semiconductor device and method for manufacturing the same, dry-etching process, method for making electrical connections, and etching apparatus 审中-公开
    半导体装置及其制造方法,干法蚀刻工艺,电连接方法和蚀刻装置

    公开(公告)号:US20090102025A1

    公开(公告)日:2009-04-23

    申请号:US11664091

    申请日:2006-04-07

    IPC分类号: H01L21/461 H01L29/10

    摘要: A method for manufacturing a semiconductor device comprises dry-etching a thin film using a resist mask carrying patterns in which at least one of the width of each pattern and the space between neighboring two patterns ranges from 32 to 130 nm using a halogenated carbon-containing compound gas with the halogen being at least two members selected from the group consisting of F, I and Br. The ratio of at least one of I and Br is not more than 26% of the total amount of the halogen atoms as expressed in terms of the atomic compositional ratio to transfer the patterns onto the thin film. Such etching of a thin film avoids causing damage to the resist mask used. The resulting thin film carrying the transferred patterns is used as a mask for subjecting the underlying material to dry-etching.

    摘要翻译: 一种用于制造半导体器件的方法包括使用具有图案的抗蚀剂掩模对薄膜进行干法蚀刻,其中每个图案的宽度和相邻两个图案之间的空间中的至少一个范围为32至130nm,使用含卤素的 具有卤素的复合气体是选自F,I和Br中的至少两种。 I和Br中的至少一个的比例不超过卤素原子总量的26%,如以将原料组成比转移到薄膜上的原子组成比来表示的。 这种薄膜的蚀刻避免了对所使用的抗蚀剂掩模的损害。 所得到的带有转印图案的薄膜用作对下面的材料进行干蚀刻的掩模。

    Base sheet
    3.
    发明授权
    Base sheet 有权
    基板

    公开(公告)号:US08237622B2

    公开(公告)日:2012-08-07

    申请号:US12521244

    申请日:2007-12-14

    IPC分类号: H01Q1/36

    摘要: A base sheet 12 has a structure that stably couples a particular chip measuring 1 mm or less on paper with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without electrically bringing the chip and antenna line into contact with each other. The base sheet 12 includes a chip 11 having a spiral coil 13 with at least one turn disposed on a surface of the chip, or inside the chip and near the surface thereof and an antenna line 14 having a conductor part 14A orbiting around the coil 13A of the chip 11 or directly over or directly below the coil 13A so that the conductor part is magnetically coupled with the coil 13A. This base sheet has a structure that stably couples even a chip measuring 1 mm or less on paper or the like with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without physically bringing the chip and antenna line into contact with each other.

    摘要翻译: 基片12具有这样的结构,即通过仅将芯片和天线线设置成使得芯片和天线线彼此靠近的方式,将纸上的1mm或更小的特定芯片与天线线连接,而无需电气 使芯片和天线线路相互接触。 基片12包括具有螺旋线圈13的芯片11,其具有设置在芯片的表面上或芯片内部并且在其表面附近的至少一个匝,以及具有围绕线圈13A绕行的导体部件14A的天线线路14 或者直接位于线圈13A的正上方,使得导体部分与线圈13A磁耦合。 这种基片具有如下结构:通过仅使芯片和天线线路彼此靠近的方式设置芯片和天线线,即使将片状或1mm以下的芯片与天线相连, 而不会使芯片和天线相互物理接触。

    Method for manufacturing RF powder
    4.
    发明授权
    Method for manufacturing RF powder 有权
    RF粉末制造方法

    公开(公告)号:US08178415B2

    公开(公告)日:2012-05-15

    申请号:US12516493

    申请日:2007-11-26

    IPC分类号: H01L21/00

    摘要: A method for manufacturing RF powder wherein the RF powder is composed of a large amount of particles and used as collective RF powder (a powdery entity); and a large amount of RF powder particles can be obtained from a wafer in a stable manner and at a high yield is provided.The method for manufacturing RF powder is a method for manufacturing RF powder composed of a large amount of particles 11a each having a substrate 12 and a magnetic coupling circuit device 15. This method includes a step S11 of forming many antenna circuit devices 39 on a wafer 40; a gas dicing step S13 for drawing dicing grooves on a wafer to locate positions of separation of magnetic coupling circuit devices; a protection film formation step S14 for coating surrounding areas of the magnetic coupling circuit devices with a protection film; a reinforcement step S15 for attaching the wafer to a supporting plate using an adhesive sheet; a grinding step S16 for grinding the backside of the wafer until the dicing grooves are reached; and a separation step S17 for separating the circuit devices by removing the supporting plate.

    摘要翻译: 一种制造射频粉末的方法,其中RF粉末由大量的颗粒组成并用作集体RF粉末(粉末实体); 并且可以以稳定的方式从晶片获得大量的RF粉末颗粒,并以高产率提供。 RF粉末的制造方法是由具有基板12和磁耦合电路装置15的大量的粒子11a构成的RF粉末的制造方法。该方法包括在晶片上形成许多天线电路装置39的工序S11 40; 用于在晶片上吸引切割槽的气体切割步骤S13,以定位磁耦合电路器件的分离位置; 保护膜形成步骤S14,用于用保护膜涂覆磁耦合电路装置的周围区域; 加强步骤S15,用于使用粘合片将晶片附着在支撑板上; 用于研磨晶片的背面直到达到切割槽的研磨步骤S16; 以及用于通过移除支撑板来分离电路装置的分离步骤S17。

    BASE SHEET
    5.
    发明申请
    BASE SHEET 有权
    基片

    公开(公告)号:US20110063184A1

    公开(公告)日:2011-03-17

    申请号:US12521244

    申请日:2007-12-14

    IPC分类号: H01Q1/50

    摘要: A base sheet 12 has a structure that stably couples a particular chip measuring 1 mm or less on paper with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without electrically bringing the chip and antenna line into contact with each other. The base sheet 12 includes a chip 11 having a spiral coil 13 with at least one turn disposed on a surface of the chip, or inside the chip and near the surface thereof and an antenna line 14 having a conductor part 14A orbiting around the coil 13A of the chip 11 or directly over or directly below the coil 13A so that the conductor part is magnetically coupled with the coil 13A. This base sheet has a structure that stably couples even a chip measuring 1 mm or less on paper or the like with an antenna line by only disposing the chip and antenna line in such a manner that the chip and antenna line are close to each other, without physically bringing the chip and antenna line into contact with each other.

    摘要翻译: 基片12具有这样的结构,即通过仅将芯片和天线线设置成使得芯片和天线线彼此靠近的方式,将纸上的1mm或更小的特定芯片与天线线连接,而无需电气 使芯片和天线线路相互接触。 基片12包括具有螺旋线圈13的芯片11,其具有设置在芯片的表面上或芯片内部并且在其表面附近的至少一个匝,以及具有围绕线圈13A绕行的导体部件14A的天线线路14 或者直接位于线圈13A的正上方,使得导体部分与线圈13A磁耦合。 这种基片具有如下结构:通过仅使芯片和天线线以芯片和天线线彼此接近的方式设置芯片和天线线,即使将片状或1mm以下的芯片与天线相连, 而不会使芯片和天线相互物理接触。

    METHOD FOR ADDING RF POWDER AND RF POWDER-ADDED BASE SHEET
    7.
    发明申请
    METHOD FOR ADDING RF POWDER AND RF POWDER-ADDED BASE SHEET 有权
    用于添加射频粉末和RF粉末添加基片的方法

    公开(公告)号:US20100090925A1

    公开(公告)日:2010-04-15

    申请号:US12516497

    申请日:2007-11-26

    IPC分类号: B05D1/12 H01Q1/40 H01Q1/00

    摘要: A method is provided for adding an RF powder to a sheet-like object having a high property value, such as a variety of cards, paper money, and securities. The RF powder makes it very difficult to produce, for example, counterfeit cards, documents and bills. Also, an RF powder-added base sheet to which the RF powder has been added is provided. In the method for adding the RF powder, the RF powder includes a plurality of RF powder particles 11 and is disposed on a surface of a base sheet 10 to add the RF powder to the base sheet. Each RF powder particle 11 has a magnetic field coupling circuit element in a high frequency magnetic field having a specific frequency. The RF powder is disposed on a surface of a base sheet by a printing technique. The RF powder-added base sheet 10 includes an RF powder including a plurality of RF powder particles 11 disposed within a printed object on a surface of a base sheet. Each RF powder particle 11 has a magnetic field coupling circuit element in a high frequency magnetic field having a high frequency.

    摘要翻译: 提供了一种用于将RF粉末添加到诸如各种卡,纸币和证券等具有高属性值的片状物体的方法。 RF粉末很难生产例如伪造卡,文件和纸币。 另外,提供添加了RF粉末的RF粉末添加基片。 在添加RF粉末的方法中,RF粉末包括多个RF粉末颗粒11,并且设置在基片10的表面上,以将RF粉末添加到基片。 每个RF粉末颗粒11具有在具有特定频率的高频磁场中的磁场耦合电路元件。 RF粉末通过印刷技术设置在基片的表面上。 RF粉末添加基片10包括RF基片,其包括设置在基片的表面上的印刷对象物内的多个RF粉末粒子11。 每个RF粉末颗粒11在具有高频率的高频磁场中具有磁场耦合电路元件。

    RF POWDER PARTICLE, RF POWDER, AND RF POWDER-CONTAINING BASE
    8.
    发明申请
    RF POWDER PARTICLE, RF POWDER, AND RF POWDER-CONTAINING BASE 有权
    RF粉末颗粒,射频粉末和含有射频粉末的基座

    公开(公告)号:US20100067166A1

    公开(公告)日:2010-03-18

    申请号:US12516643

    申请日:2007-11-26

    IPC分类号: H03H7/00 G05B19/00

    摘要: Provided are an RF powder particle, an RF powder, and an RF powder-containing base that can make it difficult to fabricate, for example, forged documents or forged bank notes with respect to sheet-like objects having high proprietary values, such as bank notes, and that allow necessary information to be stored in each of the large number of particles which are each provided with a tank circuit having a predetermined resonant frequency.The RF powder particle includes a coil 24 (inductance element) as a magnetic filed coupling element and a condenser 25 (capacitance element) connected to the both ends of the coil on an insulating surface of a substrate 22 and is configured so as to form a tank circuit 31 by the inductance element and the capacitance element. The tank circuit 31 functions as a circuit in a resonance state or in a non-resonance state in accordance with conditions in response to a high-frequency magnetic field from outside.

    摘要翻译: 提供了RF粉末颗粒,RF粉末和含RF粉末的基底,其可以使得难以制造例如伪造文件或伪造钞票相对于具有高专利价值的片状物体,例如银行 并且允许将必要的信息存储在每个具有预定谐振频率的储能电路的大量颗粒中。 RF粉末颗粒包括作为磁场耦合元件的线圈24(电感元件)和在基板22的绝缘表面上连接到线圈两端的电容器25(电容元件),并且被构造成形成 电容元件和电容元件构成。 储能电路31根据来自外部的高频磁场的条件,作为谐振状态或非共振状态的电路发挥作用。

    MAGNETIC COUPLING DEVICE AND READING DEVICE
    10.
    发明申请
    MAGNETIC COUPLING DEVICE AND READING DEVICE 审中-公开
    磁耦合器件和读取器件

    公开(公告)号:US20100066619A1

    公开(公告)日:2010-03-18

    申请号:US12516648

    申请日:2007-11-26

    IPC分类号: H01Q11/12

    摘要: A magnetic coupling device that supplies a high-frequency electromagnetic field appropriate for sensing and reading of information to a fine magnetic coupling circuit component contained in/added to individual banknotes, securities, or any other valuable sheet-like or plate-like objects, ensures sufficient magnetic coupling, and supplies sufficient electric power; and a reading device having equivalent functions are provided.A scanning probe (a magnetic coupling device) 100 is a magnetic coupling device having a loop antenna for generation of a high-frequency electromagnetic field that resonates with and senses a tank circuit built into a fine magnetic coupling circuit component, and the loop antenna has a dielectric substrate 101, a first loop antenna 102A formed on the foreside of the dielectric substrate, a second loop antenna 102B formed on the backside of the dielectric substrate so as to be located in the same position and have the same diameter as the first loop antenna, and junctions (through holes) 108 and 110 connecting the first loop antenna and the second loop antenna in series.

    摘要翻译: 将适用于感测和读取信息的高频电磁场提供给包含在/添加到单个纸币,证券或任何其它有价值的片状或板状物体中的精细磁耦合电路部件的磁耦合装置确保 足够的磁耦合,并提供足够的电力; 并提供具有等效功能的读取装置。 扫描探针(磁耦合装置)100是具有用于产生高频电磁场的环形天线的磁耦合装置,其与内置于精细磁耦合电路部件中的谐振电路谐振并感测到谐振电路,并且环形天线具有 电介质基板101,形成在电介质基板的前面的第一环形天线102A,形成在电介质基板的背面上的第二环形天线102B,以便位于相同的位置并且具有与第一回路相同的直径 天线和连接第一环形天线和第二环形天线的结(通孔)108和110。