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5 条记录 (耗时 0.017 秒)

    Circuit board and method of manufacturing the same
    1.
    发明授权
    Circuit board and method of manufacturing the same 失效
    电路板及其制造方法

    公开(公告)号：US07423222B2

    公开(公告)日：2008-09-09

    申请号：US10203970

    申请日：2002-01-11

    申请人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

    发明人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

    IPC分类号： H05K1/11 ,  H01R12/04

    CPC分类号： H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T428/24917

    摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

    摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。

    Circuit board and method of manufacturing the same
    2.
    发明申请
    Circuit board and method of manufacturing the same 审中-公开
    电路板及其制造方法

    公开(公告)号：US20100025099A1

    公开(公告)日：2010-02-04

    申请号：US12461320

    申请日：2009-08-07

    申请人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

    发明人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

    IPC分类号： H05K1/02 ,  H05K3/10

    CPC分类号： H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T428/24917

    摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

    摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。

    Multilayer printed wiring board and electronic equipment
    4.
    发明授权
    Multilayer printed wiring board and electronic equipment 有权
    多层印刷线路板和电子设备

    公开(公告)号：US06492008B1

    公开(公告)日：2002-12-10

    申请号：US09686931

    申请日：2000-10-12

    申请人： Shigeo Amagi ,  Satoshi Murakawa

    发明人： Shigeo Amagi ,  Satoshi Murakawa

    IPC分类号： B32B300

    CPC分类号： H05K3/4688 ,  B32B7/02 ,  B32B15/08 ,  H05K1/0271 ,  H05K2201/029 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09318 ,  Y10S428/901 ,  Y10T428/24917

    摘要： The thermal expansion coefficient of a composite insulator layer is adjusted in order to suppress warping deformation in a multilayer printed wiring board caused by temperature change. The thicknesses and the covering ratios on the both sides of the electric conductor layer composing the multilayer printed wiring board are asymmetric with respect to the central plane. A multilayer printed wiring board is formed by laminating composite insulation layers and laminated bodies, the composite insulation layer being made of a cloth a resin impregnated into the cloth, the laminated body being composed of electric conductor layers formed by coating on a surface of the composite insulation layer. The thermal expansion coefficient of the composite insulation layer having a conductor layer with a higher covering ratio is set to be smaller than the thermal expansion coefficient of the composite insulation layer having a conductor layer with a lower covering ratio.

    摘要翻译： 调整复合绝缘体层的热膨胀系数，以抑制由温度变化引起的多层印刷电路板中的翘曲变形。 构成多层印刷电路板的导电体层的两面的厚度和覆盖率相对于中心面不对称。 多层印刷线路板是通过层压复合绝缘层和层叠体形成的，复合绝缘层由浸渍在布中的树脂制成，层叠体由通过在复合材料的表面上涂覆而形成的导电体层构成 绝缘层。 将具有较高覆盖率的导体层的复合绝缘层的热膨胀系数设定为小于具有较低覆盖率的导体层的复合绝缘层的热膨胀系数。