公开(公告)号：US5846335A

公开(公告)日：1998-12-08

申请号：US844903

申请日：1997-04-22

申请人： Toshiro Maekawa ,  Koji Ono ,  Motoaki Okada ,  Tamami Takahashi ,  Shiro Mishima ,  Masako Kodera ,  Atsushi Shigeta ,  Riichiro Aoki ,  Gisuke Kouno

发明人： Toshiro Maekawa ,  Koji Ono ,  Motoaki Okada ,  Tamami Takahashi ,  Shiro Mishima ,  Masako Kodera ,  Atsushi Shigeta ,  Riichiro Aoki ,  Gisuke Kouno

IPC分类号： B08B1/00 ,  B08B1/04 ,  B08B3/08 ,  B24B37/34 ,  B24D3/32 ,  H01L21/00 ,  H01L21/306 ,  B08B1/02 ,  B08B3/04 ,  B08B7/04

CPC分类号： H01L21/02046 ,  B08B1/007 ,  B08B1/04 ,  B08B3/08 ,  B24B37/345 ,  B24D3/32 ,  H01L21/02052 ,  H01L21/67046 ,  Y10S134/902

摘要： A semiconductor cleaning method includes scrubbing a semiconductor wafer using a cleaning member made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores have an average diameter ranging from 10 to 200 .mu.m. The cleaning member may be made of either polyurethane foam or non-woven fabric composed of fibers bound together by urethane resin. By this scrubbing step, particles that are strongly attached to the surface of a substrate such as the semiconductor wafer can easily be removed. During cleaning of the substrate, surface irregularities and crystalline protrusions on the surface of a substrate such as a semiconductor wafer can be scraped off to adjust the surface roughness of the semiconductor wafer to a desired degree for making the semiconductor wafer surface flat.

摘要翻译： 半导体清洁方法包括使用主要由聚氨酯制成并且在与半导体晶片接触的表面中具有微孔的清洁部件来擦洗半导体晶片。 微孔的平均直径为10〜200μm。 清洁构件可以由聚氨酯泡沫或由聚氨酯树脂粘合在一起的纤维组成的无纺织物制成。 通过该洗涤步骤，可以容易地除去强烈附着到诸如半导体晶片的基板的表面的颗粒。 在清洁基板期间，可以刮掉诸如半导体晶片的基板的表面上的表面不规则和晶体突起，以将半导体晶片的表面粗糙度调整到期望的程度，以使半导体晶片表面平坦。

公开(公告)号：US5704827A

公开(公告)日：1998-01-06

申请号：US544534

申请日：1995-10-18

申请人： Toyomi Nishi ,  Manabu Tsujimura ,  Tamami Takahashi ,  Hiromi Yajima ,  Riichiro Aoki ,  Yukio Imoto ,  Shoichi Kodama ,  Kazuaki Himukai ,  Gisuke Kouno ,  Takanobu Nishimura

发明人： Toyomi Nishi ,  Manabu Tsujimura ,  Tamami Takahashi ,  Hiromi Yajima ,  Riichiro Aoki ,  Yukio Imoto ,  Shoichi Kodama ,  Kazuaki Himukai ,  Gisuke Kouno ,  Takanobu Nishimura

IPC分类号： B24B37/20 ,  B24B37/24 ,  H01L21/304 ,  B24B5/00

CPC分类号： B24B37/12

摘要： A polishing apparatus includes a detachable light weight cloth cartridge which shows little deformation under uneven loading during a polishing operation. Either mechanical or non-mechanical fixation of the cloth cartridge to a turntable is achieved. Mechanical fixation involves attaching the cloth cartridge to the turntable at peripheral and center sections of the cloth cartridge. Non-mechanical fixation involves attaching the cloth cartridge to the turntable by a vacuum arrangement. The assembly of the cloth cartridge and the turntable not only produces excellent flatness on polished semiconductor wafers by maintaining a level polishing surface, but also improves the production yield by preventing breakage of wafers during the polishing process.

摘要翻译： 抛光装置包括可拆卸轻量布料筒，其在抛光操作期间在不均匀载荷下几乎不变形。 实现了布料盒到转台的机械或非机械固定。 机械固定包括将布料盒连接到布料盒周边和中心部分的转台上。 非机械固定包括通过真空装置将布料盒附接到转台上。 布料盒和转盘的组装不仅通过保持抛光表面而在抛光的半导体晶片上产生优异的平整度，而且还通过防止抛光过程中的晶片破损而提高了生产率。

公开(公告)号：US5830041A

公开(公告)日：1998-11-03

申请号：US743361

申请日：1996-11-04

申请人： Tamami Takahashi ,  Fumihiko Sakata ,  Norio Kimura ,  Masako Kodera ,  Atsushi Shigeta

发明人： Tamami Takahashi ,  Fumihiko Sakata ,  Norio Kimura ,  Masako Kodera ,  Atsushi Shigeta

IPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/16 ,  B24B7/22

CPC分类号： B24B37/013 ,  B24B49/16

摘要： A method and apparatus for determining a planar end point on a workpiece such as a semiconductor wafer in a polishing process for polishing the workpiece to a flat mirror finish. The workpiece having an uneven surface is held by a top ring and pressed against a polishing platen. The workpiece is moved relative to the polishing platen to polish the workpiece, and a change in a frictional force between the workpiece and the polishing platen is detected. A reference time when the workpiece having an uneven surface is polished to a flat surface is determined based on the change of the frictional force between the workpiece and the polishing platen. The time when a certain period of polishing time from the reference time elapses is determined as an endpoint on the workpiece.

摘要翻译： 一种用于在用于将工件抛光到平面镜面抛光的抛光工艺中确定诸如半导体晶片的工件上的平面终点的方法和装置。 具有不平坦表面的工件由顶环保持并压靠在研磨台板上。 工件相对于研磨台板移动以抛光工件，并且检测到工件和抛光台板之间的摩擦力的变化。 基于工件和研磨台板之间的摩擦力的变化，确定具有不平坦表面的工件被抛光到平坦表面的参考时间。 从参考时间经过一定时间的抛光时间经过的时间被确定为工件上的端点。

公开(公告)号：US20090017730A1

公开(公告)日：2009-01-15

申请号：US11665001

申请日：2005-10-12

申请人： Takeo Kubota ,  Atsushi Shigeta ,  Gen Toyota ,  Tamami Takahashi ,  Daisaku Fukuoka ,  Kenya Ito

发明人： Takeo Kubota ,  Atsushi Shigeta ,  Gen Toyota ,  Tamami Takahashi ,  Daisaku Fukuoka ,  Kenya Ito

IPC分类号： B24B1/00 ,  B24B21/00

CPC分类号： H01L21/02021 ,  B24B9/065 ,  B24B21/002

摘要： A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).

摘要翻译： 抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22） ）和用于从所述接触部分（30）卷绕所述研磨带（21）的卷取卷轴（23）。 抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241），以及具有引导表面的第二引导部分（25） 研磨带（21）卷绕在卷取卷轴（23）上。 第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

公开(公告)号：US08506362B2

公开(公告)日：2013-08-13

申请号：US12667891

申请日：2008-07-08

申请人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B7/26

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

摘要翻译： 抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光 胶带沿其纵向行进。 压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

公开(公告)号：US20110003537A1

公开(公告)日：2011-01-06

申请号：US12667891

申请日：2008-07-08

申请人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B21/16 ,  B24B21/22

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus according to the present invention includes a substrate holder (32) configured to hold and rotate a substrate (W), a press pad (50) configured to press a polishing tape (41) having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a hard member (51) having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member (53) for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

摘要翻译： 根据本发明的抛光装置包括：衬底保持器（32），其被构造成保持和旋转衬底（W），压垫（50）被构造成将具有抛光表面的抛光带（41）压靠在衬底 由基板保持器保持的基板和构造成使研磨带沿其纵向方向行进的进给机构（45）。 压垫（50）包括具有用于通过研磨带挤压基板的斜面部分的按压表面（51a）的硬质构件（51）和用于将硬构件压靠在斜面上的至少一个弹性构件（53） 通过带状抛光工具的基底部分。

公开(公告)号：US07744445B2

公开(公告)日：2010-06-29

申请号：US11665001

申请日：2005-10-12

申请人： Takeo Kubota ,  Atsushi Shigeta ,  Gen Toyota ,  Tamami Takahashi ,  Daisaku Fukuoka ,  Kenya Ito

发明人： Takeo Kubota ,  Atsushi Shigeta ,  Gen Toyota ,  Tamami Takahashi ,  Daisaku Fukuoka ,  Kenya Ito

IPC分类号： B24B1/00

CPC分类号： H01L21/02021 ,  B24B9/065 ,  B24B21/002

摘要： A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).

摘要翻译： 抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22） ）和用于从所述接触部分（30）卷绕所述研磨带（21）的卷取卷轴（23）。 抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241），以及具有引导表面的第二引导部分（25） 研磨带（21）卷绕在卷取卷轴（23）上。 第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

公开(公告)号：US09138854B2

公开(公告)日：2015-09-22

申请号：US12379983

申请日：2009-03-05

申请人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

发明人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B9/02 ,  B24B21/00 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04 ,  B24B41/06

摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

公开(公告)号：US08506363B2

公开(公告)日：2013-08-13

申请号：US12654561

申请日：2009-12-23

申请人： Tamami Takahashi ,  Hiroaki Kusa ,  Masaya Seki

发明人： Tamami Takahashi ,  Hiroaki Kusa ,  Masaya Seki

IPC分类号： B24B29/02

CPC分类号： H01L21/68792 ,  B23Q3/088 ,  B24B37/30 ,  B24B41/068 ,  H01L21/6838 ,  H01L21/6875

摘要： A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.

摘要翻译： 衬底保持器是用于通过真空抽吸来保持待抛光的衬底的机构。 衬底保持器包括具有用于衬底的吸入表面的衬底保持台和选择性​​地耦合到真空源和流体供应源的流体通道。 抽吸面具有由凸部包围的多个封闭部分，并且流体通道包括分别和独立地与多个封闭部分流体连通的多个连通通道。

公开(公告)号：US20110165825A1

公开(公告)日：2011-07-07

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00

CPC分类号： B24B9/065

摘要： A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).

摘要翻译： 根据本发明的研磨装置是通过使研磨工具（41）与所述基板（W）滑动接触来研磨基板（W）的周边（斜面部，切口部，边缘切断部）的研磨装置 衬底周边。 抛光装置包括：基板保持架（20），其构造成保持基板（W）; 以及抛光头（42），其被配置为使用所述抛光工具（41）抛光由所述基板保持器（20）保持的所述基板（W）的周边。 抛光头（42）包括用于将抛光工具（41）压靠在基板（W）的周边上的压垫（50）和构造成使压垫（50）往复运动的直线电动机（90）。