公开(公告)号：US5846335A

公开(公告)日：1998-12-08

申请号：US844903

申请日：1997-04-22

申请人： Toshiro Maekawa ,  Koji Ono ,  Motoaki Okada ,  Tamami Takahashi ,  Shiro Mishima ,  Masako Kodera ,  Atsushi Shigeta ,  Riichiro Aoki ,  Gisuke Kouno

发明人： Toshiro Maekawa ,  Koji Ono ,  Motoaki Okada ,  Tamami Takahashi ,  Shiro Mishima ,  Masako Kodera ,  Atsushi Shigeta ,  Riichiro Aoki ,  Gisuke Kouno

IPC分类号： B08B1/00 ,  B08B1/04 ,  B08B3/08 ,  B24B37/34 ,  B24D3/32 ,  H01L21/00 ,  H01L21/306 ,  B08B1/02 ,  B08B3/04 ,  B08B7/04

CPC分类号： H01L21/02046 ,  B08B1/007 ,  B08B1/04 ,  B08B3/08 ,  B24B37/345 ,  B24D3/32 ,  H01L21/02052 ,  H01L21/67046 ,  Y10S134/902

摘要： A semiconductor cleaning method includes scrubbing a semiconductor wafer using a cleaning member made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores have an average diameter ranging from 10 to 200 .mu.m. The cleaning member may be made of either polyurethane foam or non-woven fabric composed of fibers bound together by urethane resin. By this scrubbing step, particles that are strongly attached to the surface of a substrate such as the semiconductor wafer can easily be removed. During cleaning of the substrate, surface irregularities and crystalline protrusions on the surface of a substrate such as a semiconductor wafer can be scraped off to adjust the surface roughness of the semiconductor wafer to a desired degree for making the semiconductor wafer surface flat.

摘要翻译： 半导体清洁方法包括使用主要由聚氨酯制成并且在与半导体晶片接触的表面中具有微孔的清洁部件来擦洗半导体晶片。 微孔的平均直径为10〜200μm。 清洁构件可以由聚氨酯泡沫或由聚氨酯树脂粘合在一起的纤维组成的无纺织物制成。 通过该洗涤步骤，可以容易地除去强烈附着到诸如半导体晶片的基板的表面的颗粒。 在清洁基板期间，可以刮掉诸如半导体晶片的基板的表面上的表面不规则和晶体突起，以将半导体晶片的表面粗糙度调整到期望的程度，以使半导体晶片表面平坦。

公开(公告)号：US07198552B2

公开(公告)日：2007-04-03

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US20060084369A1

公开(公告)日：2006-04-20

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US06500051B1

公开(公告)日：2002-12-31

申请号：US08884410

申请日：1997-06-27

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US06997782B2

公开(公告)日：2006-02-14

申请号：US10255793

申请日：2002-09-27

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

公开(公告)号：US5679059A

公开(公告)日：1997-10-21

申请号：US563295

申请日：1995-11-28

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： H01L21/304 ,  B08B1/04 ,  B24B27/00 ,  B24B37/34 ,  B24B51/00 ,  B24B55/12 ,  F24F3/16 ,  H01L21/00 ,  B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US5704827A

公开(公告)日：1998-01-06

申请号：US544534

申请日：1995-10-18

申请人： Toyomi Nishi ,  Manabu Tsujimura ,  Tamami Takahashi ,  Hiromi Yajima ,  Riichiro Aoki ,  Yukio Imoto ,  Shoichi Kodama ,  Kazuaki Himukai ,  Gisuke Kouno ,  Takanobu Nishimura

发明人： Toyomi Nishi ,  Manabu Tsujimura ,  Tamami Takahashi ,  Hiromi Yajima ,  Riichiro Aoki ,  Yukio Imoto ,  Shoichi Kodama ,  Kazuaki Himukai ,  Gisuke Kouno ,  Takanobu Nishimura

IPC分类号： B24B37/20 ,  B24B37/24 ,  H01L21/304 ,  B24B5/00

CPC分类号： B24B37/12

摘要： A polishing apparatus includes a detachable light weight cloth cartridge which shows little deformation under uneven loading during a polishing operation. Either mechanical or non-mechanical fixation of the cloth cartridge to a turntable is achieved. Mechanical fixation involves attaching the cloth cartridge to the turntable at peripheral and center sections of the cloth cartridge. Non-mechanical fixation involves attaching the cloth cartridge to the turntable by a vacuum arrangement. The assembly of the cloth cartridge and the turntable not only produces excellent flatness on polished semiconductor wafers by maintaining a level polishing surface, but also improves the production yield by preventing breakage of wafers during the polishing process.

摘要翻译： 抛光装置包括可拆卸轻量布料筒，其在抛光操作期间在不均匀载荷下几乎不变形。 实现了布料盒到转台的机械或非机械固定。 机械固定包括将布料盒连接到布料盒周边和中心部分的转台上。 非机械固定包括通过真空装置将布料盒附接到转台上。 布料盒和转盘的组装不仅通过保持抛光表面而在抛光的半导体晶片上产生优异的平整度，而且还通过防止抛光过程中的晶片破损而提高了生产率。

公开(公告)号：US06595220B2

公开(公告)日：2003-07-22

申请号：US09797822

申请日：2001-03-05

申请人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

发明人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

IPC分类号： B08B300

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

摘要翻译： 一种用于在多个处理装置中处理工件时在处理装置之间输送用于输送工件（例如半导体晶片，玻璃基板或液晶面板）的工件的装置。 将工件表面上的液体量调整到预定量，并且保持预定量的液体的工件在工艺之间传送。 该调整包括在工件的处于一定状态的表面上提供足够量的液体，并从工件的表面去除一定量的液体。

公开(公告)号：US06221171B1

公开(公告)日：2001-04-24

申请号：US08868889

申请日：1997-06-04

申请人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

发明人： Toshiro Maekawa ,  Satomi Hamada ,  Riichiro Aoki ,  Shoichi Kodama ,  Hiromi Yajima

IPC分类号： G08B102

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： A method and apparatus for conveying workpiece is used for conveying a workpiece such as a semiconductor wafer, glass substrate or liquid crystal panel between processing apparatuses when the workpiece is processed in a plurality of processing apparatuses. The method includes adjusting the amount of liquid on a surface of a workpiece to a predetermined amount, and conveying the workpiece which retains the predetermined amount of liquid between processes. The surface of the workpiece is kept wet by the liquid on the workpiece. The adjusting includes supplying a sufficient amount of liquid onto the surface of the workpiece which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

摘要翻译： 当在多个处理装置中处理工件时，用于输送工件的方法和装置用于在处理装置之间输送诸如半导体晶片，玻璃基板或液晶面板的工件。 该方法包括将工件表面上的液体量调整到预定量，并且在工艺之间输送保留预定量液体的工件。 工件的表面被工件上的液体保持湿润。 该调整包括将足够量的液体供给到处于一定状态的工件的表面上，并从工件的表面去除一定量的液体。

公开(公告)号：US20080166949A1

公开(公告)日：2008-07-10

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。