公开(公告)号：US07176756B2

公开(公告)日：2007-02-13

申请号：US11010327

申请日：2004-12-14

申请人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

发明人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

IPC分类号： H03F1/00 ,  H05K1/00

CPC分类号： H05K1/0265 ,  H01L2924/1423 ,  H03F3/195 ,  H03F2200/294 ,  H05K1/165 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0542

摘要： An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

摘要翻译： 本发明的电感器元件电路板包括多个导电层，以及在一个或多个导电层中具有电感器功能（电感器导体段）的导体，其中电感器导体段的至少一部分变厚 而不是设置在电路板内的其它导线。 电感器导体段的至少一部分延伸穿过设置在导电层之间的绝缘层，或者嵌入在绝缘层中，其中电感器导体段的一部分具有绝缘层的厚度的一半或更多的厚度 。 本发明的功率放大器模块包括多层电路板，在多层电路板中制造的半导体放大器和耦合到半导体放大器的输出的阻抗匹配电路。 阻抗匹配电路具有由电感器导体段形成的部分。

公开(公告)号：US07368998B2

公开(公告)日：2008-05-06

申请号：US11608609

申请日：2006-12-08

申请人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

发明人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

IPC分类号： H03F3/14 ,  H03H7/00

CPC分类号： H05K1/0265 ,  H01L2924/1423 ,  H03F3/195 ,  H03F2200/294 ,  H05K1/165 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0542

摘要： An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

摘要翻译： 本发明的电感器元件电路板包括多个导电层，以及在一个或多个导电层中具有电感器功能（电感器导体段）的导体，其中电感器导体段的至少一部分变厚 而不是设置在电路板内的其它导线。 电感器导体段的至少一部分延伸穿过设置在导电层之间的绝缘层，或者嵌入在绝缘层中，其中电感器导体段的一部分具有绝缘层的厚度的一半或更多的厚度 。 本发明的功率放大器模块包括多层电路板，在多层电路板中制造的半导体放大器和耦合到半导体放大器的输出的阻抗匹配电路。 阻抗匹配电路具有由电感器导体段形成的部分。

公开(公告)号：US20050140434A1

公开(公告)日：2005-06-30

申请号：US11010327

申请日：2004-12-14

申请人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

发明人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

IPC分类号： H01L23/12 ,  H03F3/195 ,  H03F3/60 ,  H03G3/30 ,  H05K1/02 ,  H05K1/16 ,  H05K3/24 ,  H05K3/46 ,  H03F1/00

CPC分类号： H05K1/0265 ,  H01L2924/1423 ,  H03F3/195 ,  H03F2200/294 ,  H05K1/165 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0542

摘要： An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

摘要翻译： 本发明的电感器元件电路板包括多个导电层，以及在一个或多个导电层中具有电感器功能（电感器导体段）的导体，其中电感器导体段的至少一部分变厚 而不是设置在电路板内的其它导线。 电感器导体段的至少一部分延伸穿过设置在导电层之间的绝缘层，或者嵌入在绝缘层中，其中电感器导体段的一部分具有绝缘层的厚度的一半或更多的厚度 。 本发明的功率放大器模块包括多层电路板，在多层电路板中制造的半导体放大器和耦合到半导体放大器的输出的阻抗匹配电路。 阻抗匹配电路具有由电感器导体段形成的部分。

公开(公告)号：US20070075767A1

公开(公告)日：2007-04-05

申请号：US11608609

申请日：2006-12-08

申请人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

发明人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

IPC分类号： H03F1/00

CPC分类号： H05K1/0265 ,  H01L2924/1423 ,  H03F3/195 ,  H03F2200/294 ,  H05K1/165 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0542

摘要： An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

摘要翻译： 本发明的电感器元件电路板包括多个导电层，以及在一个或多个导电层中具有电感器功能（电感器导体段）的导体，其中电感器导体段的至少一部分变厚 而不是设置在电路板内的其它导线。 电感器导体段的至少一部分延伸穿过设置在导电层之间的绝缘层，或者嵌入在绝缘层中，其中电感器导体段的一部分具有绝缘层的厚度的一半或更多的厚度 。 本发明的功率放大器模块包括多层电路板，在多层电路板中制造的半导体放大器和耦合到半导体放大器的输出的阻抗匹配电路。 阻抗匹配电路具有由电感器导体段形成的部分。

公开(公告)号：US07120394B2

公开(公告)日：2006-10-10

申请号：US10702645

申请日：2003-11-07

申请人： Yoshihiro Suzuki ,  Atsushi Ajioka ,  Masashi Katsumata

发明人： Yoshihiro Suzuki ,  Atsushi Ajioka ,  Masashi Katsumata

IPC分类号： H04B1/44

CPC分类号： H04B1/48 ,  H04B1/0475

摘要： A small-sized, front-end module is offered which is for use in a wireless communication device such as a mobile phone and which can suppress harmonics to a sufficiently low level. The front-end module has at least a switching circuit for switching one antenna between a transmiting system and a receiving system, a power amplifier for power-amplifying a transmission signal, and a low-pass filter inserted between the switching circuit and power amplifier. These components are integrated. A first kind of harmonics is produced from the switching circuit toward the power amplifier and reflected by the low-pass filter. A second kind of harmonics is produced from the power amplifier toward the antenna. A third kind of harmonics is produced from the switching circuit toward the antenna. The third kind of harmonics is canceled by the reflected first kind of harmonics and the second kind of harmonics.

摘要翻译： 提供了一种小型的前端模块，其用于诸如移动电话的无线通信设备中，并且可以将谐波抑制到足够低的水平。 前端模块至少具有用于在发送系统和接收系统之间切换一个天线的开关电路，用于对发送信号进行功率放大的功率放大器以及插入在开关电路和功率放大器之间的低通滤波器。 这些组件是集成的。 第一种谐波从开关电路产生到功率放大器并被低通滤波器反射。 从功率放大器向天线产生第二种谐波。 从开关电路向天线产生第三种谐波。 第三种谐波被反射的第一种谐波和第二种谐波消除。

公开(公告)号：US08842686B2

公开(公告)日：2014-09-23

申请号：US13571508

申请日：2012-08-10

申请人： Yoshihiro Suzuki

发明人： Yoshihiro Suzuki

IPC分类号： H04L12/28 ,  H04L29/06 ,  H04L29/12

CPC分类号： H04L61/6086 ,  H04L61/1511 ,  H04L61/1529 ,  H04L65/1006 ,  H04L65/102 ,  H04L69/14

摘要： A communication system (1) has a relay server (S) assigned to a wide area IP network (net1) and having a SIP function, a transmitting terminal (C1) transmitting over the relay server (S), and a receiving terminal (C2) receiving over the relay server (S); the transmitting terminal (C1) and the receiving terminal (C2) have a first IP address (21A) for communicating over the wide area IP network (net1) and a second IP address (21B) for communicating over a short circuit (XD) in an Internet network using XMPP as a communication protocol; and the transmitting terminal (C1) switches to the short circuit (XD) and communicates after communication with the receiving terminal (C2) is established over the wide area IP network (net1).

摘要翻译： 通信系统（1）具有分配给广域IP网络（net1）并具有SIP功能的中继服务器（S），通过中继服务器（S）发送的发送终端（C1）和接收终端 ）通过中继服务器（S）接收; 发送终端（C1）和接收终端（C2）具有用于通过广域IP网络（net1）通信的第一IP地址（21A）和用于通过短路（XD）进行通信的第二IP地址（21B） 使用XMPP作为通信协议的互联网网络; 发送终端（C1）切换到短路（XD），并且在与广域IP网络（net1）之间建立与接收终端（C2）的通信之后进行通信。

公开(公告)号：US08295544B2

公开(公告)日：2012-10-23

申请号：US12118038

申请日：2008-05-09

申请人： Kyoko Fukuda ,  Yoshihiro Suzuki ,  Hiroyuki Kinoshita ,  Yutaka Yoneda

发明人： Kyoko Fukuda ,  Yoshihiro Suzuki ,  Hiroyuki Kinoshita ,  Yutaka Yoneda

IPC分类号： G06K9/00

CPC分类号： G06K9/00234 ,  G06K9/6212 ,  H04N5/23219

摘要： An image processing apparatus includes an image clipping unit, a feature extracting unit, a candidate identifying unit, and a detecting unit. The image clipping unit clips a window image from a predetermined position of an original image. The feature extracting unit extracts a feature value of the window image on the basis of a predetermined criterion. The candidate identifying unit determines, on the basis of the feature value, whether the window image satisfies a predetermined condition for a candidate including a detection target. The detecting unit determines whether the window image includes the detection target if the window image satisfies the predetermined condition.

摘要翻译： 图像处理装置包括图像剪辑单元，特征提取单元，候选识别单元和检测单元。 图像剪辑单元从原始图像的预定位置剪辑窗口图像。 特征提取单元基于预定标准提取窗口图像的特征值。 候选识别单元基于特征值确定窗口图像是否满足包括检测目标的候选的预定条件。 如果窗口图像满足预定条件，则检测单元确定窗口图像是否包括检测对象。

公开(公告)号：US20100325695A1

公开(公告)日：2010-12-23

申请号：US12446555

申请日：2007-09-21

申请人： Yoshihiro Suzuki

发明人： Yoshihiro Suzuki

IPC分类号： G06F21/00 ,  G06F15/16

CPC分类号： H04N21/4334 ,  G06F21/10 ,  H04N7/162 ,  H04N21/2541 ,  H04N21/25841 ,  H04N21/25875 ,  H04N21/41407 ,  H04N21/4143 ,  H04N21/43615 ,  H04N21/4623 ,  H04N21/4753 ,  H04N21/64322

摘要： A foreign gateway (FGW) (105) of the present invention obtains, via a terminal device (107), authentication information which proves access authority with respect to a home gateway (HGW) (104). In a case where a player (106) plays back content stored in a media server (103), the FGW (105) is allowed to access the HGW (104) by presenting the authentication information to the HGW (104). If, after the content is viewed and listened to by a user, a certain condition is satisfied (a communication is interrupted between the FGW (105) and the mobile terminal (107), for example), the FGW (105) requests the HGW (104) not to permit access from the FGW (105), and the HGW (104) stops permitting the access from the FGW (105). This makes it possible to realize a gateway device which prevents unintended access from outside by nullifying, at appropriate timing, the access authority of a device outside a network to which the gateway device belongs.

摘要翻译： 本发明的外部网关（FGW）（105）经由终端装置（107）获得证明相对于家庭网关（HGW）的访问权限的认证信息（104）。 在播放器（106）播放存储在媒体服务器（103）中的内容的情况下，通过向HGW（104）呈现认证信息，允许FGW（105）访问HGW（104）。 如果在用户观看和收听内容之后，例如满足一定条件（FGW（105）和移动终端（107）之间的通信中断），FGW（105）请求HGW （104）不允许从FGW（105）访问，并且HGW（104）停止允许从FGW（105）的访问。 这使得可以实现网关设备，其通过在适当的定时将网关设备所属的网络之外的设备的访问权限置零而防止来自外部的意外访问。

公开(公告)号：US20090200656A1

公开(公告)日：2009-08-13

申请号：US12408890

申请日：2009-03-23

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/498

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装有半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3），多个引线（1a），其具有安装表面 （1d）暴露于密封部分（3）的后表面（3a）的周边部分和设置在其相对侧上的密封部分形成表面（1g）和用于连接焊盘（4）的焊丝（4） 2a）和引线（1a）之间的长度（M），其中引线（1a）的密封部分形成表面（1g）的内端（1h）之间的长度（M）设置为与 彼此形成为大于安装面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。

公开(公告)号：US20070110321A1

公开(公告)日：2007-05-17

申请号：US11599561

申请日：2006-11-14

申请人： Miyuki Okada ,  Yoshihiro Suzuki

发明人： Miyuki Okada ,  Yoshihiro Suzuki

IPC分类号： G06K9/62 ,  G06K9/32 ,  H04N5/228

CPC分类号： G06K9/00228 ,  G06K9/6857

摘要： An image processing apparatus includes: an image acquisition section which acquires an original image; a resolution conversion section which converts the resolution of the original image acquired by the image acquisition section and generates a plurality of reduced images having different resolutions; a detection section which processes by template matching the plurality of reduced images generated by the resolution conversion section and detects an area occupied by a picked-up image of a particular object corresponding to the template, from the reduced images; and a detection result processing section which detects the area occupied by the picked-up image of the particular object on the original image, by processing a detection result obtained by the detection section, the detection section detecting the area occupied by the picked-up image of the particular object by processing the plurality of reduced images in an order in which resolution sequentially varies on a step-by-step basis.

摘要翻译： 一种图像处理设备包括：图像获取部分，其获取原始图像; 分辨率转换部，其转换由图像获取部获取的原始图像的分辨率，并生成具有不同分辨率的多个缩小图像; 检测部，其通过模板匹配由所述分辨率转换部生成的多个缩小图像，并从所述缩小图像中检测与所述模板对应的特定对象的拍摄图像所占据的面积; 以及检测结果处理部，通过处理由检测部获得的检测结果来检测原始图像上的特定对象的拍摄图像所占据的区域，检测部检测拍摄图像占据的面积 通过以分步顺序依次改变分辨率的顺序处理多个缩小图像来实现特定对象。