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    Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof
    2.
    发明申请
    Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof 审中-公开
    用于丝网印刷的感光油墨组合物及其使用形成正浮雕图案的方法

    公开(公告)号：US20090186295A1

    公开(公告)日：2009-07-23

    申请号：US12224593

    申请日：2007-03-02

    申请人： Maw Soe Win ,  Toshiyuki Goshima ,  Sigemasa Segawa ,  Shintaro Nakajima ,  Eika Kyo ,  Yoshikazu Nishikawa ,  Shuzo Waki

    发明人： Maw Soe Win ,  Toshiyuki Goshima ,  Sigemasa Segawa ,  Shintaro Nakajima ,  Eika Kyo ,  Yoshikazu Nishikawa ,  Shuzo Waki

    IPC分类号： G03F7/004 ,  G03F7/20

    CPC分类号： H05K3/287 ,  C08G73/106 ,  C08G77/455 ,  C08L79/08 ,  C08L83/10 ,  C09D11/101

    摘要： Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.

    摘要翻译： 公开了一种感光油墨，当用作丝网印刷的油墨时，可以形成绝缘性能，耐热性，低翘曲性，低弹性和与基材的粘合性优异的涂膜，并且使丝网堵塞，渗色 ，即使重复执行丝网印刷也不可能发生模糊，碎片等，从而在印刷中具有极好的处理容易性。 油墨组合物包含100重量份的有机溶剂可溶性聚酰亚胺嵌段共聚物和1至100重量份的光酸产生剂。 将聚酰亚胺嵌段共聚物和光酸产生剂溶解在有机溶剂中。 聚酰亚胺嵌段共聚物在其分子骨架中含有具有硅氧烷键的二胺和相对于氨基的邻位羟基和/或羧基的芳族二胺 组。

    Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof
    3.
    发明申请
    Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof 有权
    用于丝网印刷的感光油墨组合物及其使用形成正浮雕图案的方法

    公开(公告)号：US20110111351A1

    公开(公告)日：2011-05-12

    申请号：US13007373

    申请日：2011-01-14

    申请人： Maw Soe Win ,  Toshiyuki Goshima ,  Sigemasa Segawa ,  Shintaro Nakajima ,  Eika Kyo ,  Yoshikazu Nishikawa ,  Shuzo Waki

    发明人： Maw Soe Win ,  Toshiyuki Goshima ,  Sigemasa Segawa ,  Shintaro Nakajima ,  Eika Kyo ,  Yoshikazu Nishikawa ,  Shuzo Waki

    IPC分类号： G03F7/20 ,  G03C1/00

    CPC分类号： H05K3/287 ,  C08G73/106 ,  C08G77/455 ,  C08L79/08 ,  C08L83/10 ,  C09D11/101

    摘要： Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.

    摘要翻译： 公开了一种感光油墨，当用作丝网印刷的油墨时，可以形成绝缘性能，耐热性，低翘曲性，低弹性和与基材的粘合性优异的涂膜，并且使丝网堵塞，渗色 ，即使重复执行丝网印刷也不可能发生模糊，碎片等，从而在印刷中具有极好的处理容易性。 油墨组合物包含100重量份的有机溶剂可溶性聚酰亚胺嵌段共聚物和1至100重量份的光酸产生剂。 将聚酰亚胺嵌段共聚物和光酸产生剂溶解在有机溶剂中。 聚酰亚胺嵌段共聚物在其分子骨架中含有具有硅氧烷键的二胺和相对于氨基的邻位羟基和/或羧基的芳族二胺 组。

    Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof
    4.
    发明授权
    Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof 有权
    用于丝网印刷的感光性油墨组合物及其使用形成正浮雕图案的方法

    公开(公告)号：US08349537B2

    公开(公告)日：2013-01-08

    申请号：US13007373

    申请日：2011-01-14

    申请人： Maw Soe Win ,  Toshiyuki Goshima ,  Sigemasa Segawa ,  Shintaro Nakajima ,  Eika Kyo ,  Yoshikazu Nishikawa ,  Shuzo Waki

    发明人： Maw Soe Win ,  Toshiyuki Goshima ,  Sigemasa Segawa ,  Shintaro Nakajima ,  Eika Kyo ,  Yoshikazu Nishikawa ,  Shuzo Waki

    IPC分类号： G03F7/00 ,  G03F7/004 ,  C08G77/04

    CPC分类号： H05K3/287 ,  C08G73/106 ,  C08G77/455 ,  C08L79/08 ,  C08L83/10 ,  C09D11/101

    摘要： Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.

    摘要翻译： 公开了一种感光油墨，当用作丝网印刷的油墨时，可以形成绝缘性能，耐热性，低翘曲性，低弹性和与基材的粘合性优异的涂膜，并且使丝网堵塞，渗色 ，即使重复执行丝网印刷也不可能发生模糊，碎片等，从而在印刷中具有极好的处理容易性。 油墨组合物包含100重量份的有机溶剂可溶性聚酰亚胺嵌段共聚物和1至100重量份的光酸产生剂。 将聚酰亚胺嵌段共聚物和光酸产生剂溶解在有机溶剂中。 聚酰亚胺嵌段共聚物在其分子骨架中含有具有硅氧烷键的二胺和相对于氨基的邻位羟基和/或羧基的芳族二胺 组。

    Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices
    6.
    发明授权
    Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices 有权
    用于半导体器件的聚酰亚胺树脂组合物，使用其的半导体器件中形成膜的方法和半导体器件

    公开(公告)号：US08987376B2

    公开(公告)日：2015-03-24

    申请号：US13035536

    申请日：2011-02-25

    申请人： Toshiyuki Goshima ,  Sigemasa Segawa ,  Maw Soe Win ,  Junichi Yamashita ,  Ken Takanashi

    发明人： Toshiyuki Goshima ,  Sigemasa Segawa ,  Maw Soe Win ,  Junichi Yamashita ,  Ken Takanashi

    IPC分类号： C08G69/26 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  H01L23/31

    CPC分类号： C08G73/1042 ,  C08G73/106 ,  C08L79/08 ,  C09D179/08 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/00

    摘要： Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.

    摘要翻译： 公开了一种半导体器件的聚酰亚胺组合物，其具有适用于丝网印刷和分配涂料的流变特性，其具有改善的各种涂层基底的润湿性能，通过该组合物可获得500次以上的连续印刷， 在印刷和干燥之后或在干燥或固化期间不产生可以涂覆所需区域的发丝和针孔。 还公开了一种在半导体中形成膜的方法以及通过该方法形成的膜作为绝缘膜，保护膜等的半导体。 半导体器件用组合物含有第一有机溶剂（A）和第二有机溶剂（B）的混合溶剂。 和具有至少一个选自重复单元中的烷基和全氟烷基的基团并且具有触变性的聚酰亚胺树脂，聚酰亚胺树脂溶解在混合溶剂中。

    POLYIMIDE RESIN COMPOSITION FOR SEMICONDUCTOR DEVICES, METHOD OF FORMING FILM IN SEMICONDUCTOR DEVICES USING THE SAME AND SEMICONDUCTOR DEVICES
    7.
    发明申请
    POLYIMIDE RESIN COMPOSITION FOR SEMICONDUCTOR DEVICES, METHOD OF FORMING FILM IN SEMICONDUCTOR DEVICES USING THE SAME AND SEMICONDUCTOR DEVICES 有权
    用于半导体器件的聚酰亚胺树脂组合物，使用其和半导体器件在半导体器件中形成膜的方法

    公开(公告)号：US20110213075A1

    公开(公告)日：2011-09-01

    申请号：US13035536

    申请日：2011-02-25

    申请人： Toshiyuki GOSHIMA ,  Sigemasa Segawa ,  Maw Soe Win ,  Junichi Yamashita ,  Ken Takanashi

    发明人： Toshiyuki GOSHIMA ,  Sigemasa Segawa ,  Maw Soe Win ,  Junichi Yamashita ,  Ken Takanashi

    IPC分类号： C08L79/08 ,  C08L83/08 ,  H01L21/56

    CPC分类号： C08G73/1042 ,  C08G73/106 ,  C08L79/08 ,  C09D179/08 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/00

    摘要： Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.

    摘要翻译： 公开了一种半导体器件的聚酰亚胺组合物，其具有适用于丝网印刷和分配涂料的流变特性，其具有改善的各种涂层基底的润湿性能，通过该组合物可获得500次以上的连续印刷， 在印刷和干燥之后或在干燥或固化期间不产生可以涂覆所需区域的发丝和针孔。 还公开了一种在半导体中形成膜的方法以及通过该方法形成的膜作为绝缘膜，保护膜等的半导体。 半导体器件用组合物含有第一有机溶剂（A）和第二有机溶剂（B）的混合溶剂。 和具有至少一个选自重复单元中的烷基和全氟烷基的基团并且具有触变性的聚酰亚胺树脂，聚酰亚胺树脂溶解在混合溶剂中。

    Superconducting integrated circuit and method for fabrication thereof
    8.
    发明授权
    Superconducting integrated circuit and method for fabrication thereof 失效
    超导集成电路及其制造方法

    公开(公告)号：US06911665B2

    公开(公告)日：2005-06-28

    申请号：US10631791

    申请日：2003-08-01

    申请人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Hiroshi Itatani ,  Sigemasa Segawa

    发明人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Hiroshi Itatani ,  Sigemasa Segawa

    IPC分类号： H01L39/00 ,  H01L21/312 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/52 ,  H01L23/522 ,  H01L27/18 ,  H01L39/22 ,  H01L39/24

    CPC分类号： H01L39/223 ,  H01L27/18 ,  H01L39/2493

    摘要： A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

    摘要翻译： 超导集成电路包括基板，形成在基板上并由下部超导电极，隧道势垒和上部超导电极按顺序连接在一起的多层结构，以及穿孔以形成通孔的绝缘层 与下电极和上电极电接触。 绝缘层由高分辨率，光敏，溶剂可溶的有机绝缘材料形成。 超导集成电路是通过以下步骤制造的，所述方法包括以下步骤：将多层板沉积在基板上，将绝缘材料施加到包括多层板的基板的前表面，通过光刻技术在绝缘材料中形成通孔 与上下电极电接触的预期位置，以及布置用于通过通孔连接上电极和下电极的布线。

    Superconducting integrated circuit and method for fabrication thereof
    9.
    发明授权
    Superconducting integrated circuit and method for fabrication thereof 失效
    超导集成电路及其制造方法

    公开(公告)号：US07323348B2

    公开(公告)日：2008-01-29

    申请号：US11031995

    申请日：2005-01-11

    申请人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Hiroshi Itatani ,  Sigemasa Segawa

    发明人： Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Kazuhiko Tokoro ,  Katsuya Kikuchi ,  Hiroshi Itatani ,  Sigemasa Segawa

    IPC分类号： H01L21/00

    CPC分类号： H01L39/223 ,  H01L27/18 ,  H01L39/2493

    摘要： A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

    摘要翻译： 超导集成电路包括基板，形成在基板上并由下部超导电极，隧道势垒和上部超导电极按顺序连接在一起的多层结构，以及穿孔以形成通孔的绝缘层 与下电极和上电极电接触。 绝缘层由高分辨率，光敏，溶剂可溶的有机绝缘材料形成。 超导集成电路是通过以下步骤制造的，所述方法包括以下步骤：在衬底上沉积多层板，将绝缘材料施加到包括多层板的衬底的前表面，通过光刻技术在绝缘材料中形成通孔 与上下电极电接触的预期位置，以及布置用于通过通孔连接上电极和下电极的布线。