摘要:
An object of the present invention is to provide a silver compound paste which can be easily applied without containing resin, and which produces a conductive film having a low electric resistivity by heating under conditions substantially equivalent to those in a conductive film containing a polymer type conductive paste. The present invention provides a silver compound paste containing silver oxide particles and a tertiary fatty acid silver salt.
摘要:
A conductive composition capable of producing a conductive coating with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 μm is used as the binder. Furthermore, the average particle diameter of the particulate silver compound may be from 0.01 to 10 μm.
摘要:
A conductive composition capable of producing a conductive paint with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 μm is used as the binder. Furthermore, the average particle diameter of the particulate silver compound is preferably from 0.01 to 10 μm.
摘要:
The present invention provides an electromagnetic wave shielding material that has high electromagnetic wave shielding effects, excellent transparency, and excellent see-through property, and a simple and inexpensive production process for the electromagnetic wave shielding material. Specifically, the present invention provides a process for producing an electromagnetic wave shielding material, the process comprising screen-printing in a geometric pattern a conductive paste containing a particulate silver oxide, a tertiary fatty acid silver salt, and a solvent, onto a transparent porous layer surface of a transparent resin substrate having a transparent porous layer containing as a main component at least one member selected from the group consisting of oxide ceramics, non-oxide ceramics, and metals; and performing heat treatment to form a conductive region with a geometric pattern on the transparent porous layer surface; and an electromagnetic wave shielding material produced by the production process.
摘要:
The present invention provides an electromagnetic wave shielding material that has high electromagnetic wave shielding effects, excellent transparency, and excellent see-through property, and a simple and inexpensive production process for the electromagnetic wave shielding material. Specifically, the present invention provides a process for producing an electromagnetic wave shielding material, the process comprising screen-printing in a geometric pattern a conductive paste containing a particulate silver oxide, a tertiary fatty acid silver salt, and a solvent, onto a transparent porous layer surface of a transparent resin substrate having a transparent porous layer containing as a main component at least one member selected from the group consisting of oxide ceramics, non-oxide ceramics, and metals; and performing heat treatment to form a conductive region with a geometric pattern on the transparent porous layer surface; and an electromagnetic wave shielding material produced by the production process.
摘要:
[Problem to be Solved] To improve the measurement accuracy of an interference measurement device which utilizes interference of light.[Means for Solution] An interference measurement device includes a light source 10 for emitting supercontinuum light (SC light), an optical fiber coupler 11 for splitting the SC light into measurement light and reference light, a dispersion compensation element 12, a drive unit 13 for moving the dispersion compensation element 12, and light-receiving means 14 for measuring an interference waveform produced as a result of interference between the measurement light and the reference light. A measurement object 15 to be measured is an Si substrate having a thickness of 800 μm. The dispersion compensation element 12 is an Si substrate having a thickness of 780 μm. Namely, the dispersion compensation element 12 is formed of the same material as that of the measurement object 15 and is 20 μm thinner than the measurement object 15. The interference caused by reflection on the back surface of the measurement object 15 and reflection on the back surface of the dispersion compensation element 12 has a narrow peak width because wavelength dispersion is cancelled almost completely. Thus, the accuracy in measuring the peak position improves. As a result, the accuracy in measuring temperature, etc., improves.
摘要:
[Problem to be Solved]To improve the measurement accuracy of an interference measurement device which utilizes interference of light.[Means for Solution]An interference measurement device includes a light source 10 for emitting supercontinuum light (SC light), an optical fiber coupler 11 for splitting the SC light into measurement light and reference light, a dispersion compensation element 12, a drive unit 13 for moving the dispersion compensation element 12, and light-receiving means 14 for measuring an interference waveform produced as a result of interference between the measurement light and the reference light. A measurement object 15 to be measured is an Si substrate having a thickness of 800 μm. The dispersion compensation element 12 is an Si substrate having a thickness of 780 μm. Namely, the dispersion compensation element 12 is formed of the same material as that of the measurement object 15 and is 20 μm thinner than the measurement object 15. The interference caused by reflection on the back surface of the measurement object 15 and reflection on the back surface of the dispersion compensation element 12 has a narrow peak width because wavelength dispersion is cancelled almost completely. Thus, the accuracy in measuring the peak position improves. As a result, the accuracy in measuring temperature, etc., improves.