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    Power module substrate, method of producing the same, and semiconductor device including the substrate
    1.
    发明授权
    Power module substrate, method of producing the same, and semiconductor device including the substrate 有权
    功率模块用基板及其制造方法以及包含该基板的半导体装置

    公开(公告)号：US06483185B1

    公开(公告)日：2002-11-19

    申请号：US09401410

    申请日：1999-09-22

    申请人： Toshiyuki Nagase ,  Yoshiyuki Nagatomo ,  Kazuaki Kubo ,  Shoichi Shimamura ,  Koichi Goshi

    发明人： Toshiyuki Nagase ,  Yoshiyuki Nagatomo ,  Kazuaki Kubo ,  Shoichi Shimamura ,  Koichi Goshi

    IPC分类号： H01L2348

    CPC分类号： H01L23/4006 ,  H01L23/24 ,  H01L23/473 ,  H01L2023/4056 ,  H01L2023/4087 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A power module substrate includes a ceramic substrate having a circuit pattern formed thereon, and a metal frame with which the ceramic substrate can be joined to a water-cooling type heat sink. The metal frame has a thickness equal to that of the ceramic substrate or the ceramic substrate having the circuit pattern, and is provided with plural perforations formed therein. Metal thin sheets having through-holes in communication with the corresponding perforations, and containing contacting portions having the undersides thereof contacted to at least a part of the circumferential surface of the ceramic substrate are disposed on the surface of the metal frame. In a semiconductor device, a semiconductor element is mounted onto the circuit pattern, and the power module substrate is joined directly to the water-cooling type heat sink by inserting male screws through the through-holes and the perforations, and screwing the male screws in the female screws of the water-cooling type heat sink.

    摘要翻译： 功率模块基板包括其上形成有电路图案的陶瓷基板和可以将陶瓷基板与水冷式散热器接合的金属框架。 金属框架的厚度等于具有电路图案的陶瓷基板或陶瓷基板的厚度，并且在其中形成有多个穿孔。 具有与相应穿孔连通的通孔的金属薄片，并且包含其下侧的接触部分与陶瓷基板的周向表面的至少一部分接触的金属薄片设置在金属框架的表面上。 在半导体装置中，将半导体元件安装在电路图案上，并且通过将外螺纹穿过通孔和穿孔将功率模块基板直接接合到水冷式散热器，并将外螺纹 水冷式散热器的内螺纹。

    Power module substrate
    2.
    发明授权
    Power module substrate 有权
    电源模块基板

    公开(公告)号：US06310775B1

    公开(公告)日：2001-10-30

    申请号：US09531489

    申请日：2000-03-20

    申请人： Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Kazuaki Kubo ,  Shoichi Shimamura

    发明人： Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Kazuaki Kubo ,  Shoichi Shimamura

    IPC分类号： H05K720

    CPC分类号： H05K1/0271 ,  C04B2237/407 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0355 ,  H05K2201/068 ,  Y10S428/901

    摘要： The present invention for solving the problem of suppressing the load caused by heat stress applied on an insulation substrate, reducing the manufacturing coat of a power module substrate, and improving productivity provides a power module substrate in which a buffer layer having a surface area one to three times as large as the surface area of the insulation substrate is laminated and bonded between the insulation substrate and the heat sink, wherein the buffer layer is formed using a material having a thermal expansion coefficient between the thermal expansion coefficients of the insulation substrate and the heat sink, the insulation substrate being preferably formed using AlN, Si3N4 or Al2O3, the buffer layer being preferably formed using AlSiC, and a carbon plate or a composite material of AlC, besides the thickness of the buffer layer being preferably 1.5 to 50 times as large as the thickness of the insulation substrate, and the insulation substrate, the buffer layer and the heat sink being preferably laminated via a brazing foil by bonding.

    摘要翻译： 本发明解决了由施加在绝缘基板上的热应力引起的负载的抑制问题，降低功率模块基板的制造涂层以及提高生产率的本发明提供了一种功率模块用基板，其中，缓冲层的表面积为1〜 将绝缘基板的表面积的3倍层叠并结合在绝缘基板和散热片之间，其中缓冲层使用具有绝热基板的热膨胀系数和 散热器，优选使用AlN，Si 3 N 4或Al 2 O 3形成绝缘基板，缓冲层优选使用AlSiC形成，并且碳板或AlC的复合材料除了缓冲层的厚度之外优选为1.5〜50倍 绝缘基板的厚度大，绝缘基板，缓冲层和热量大 水槽优选通过粘合通过钎焊箔层压。

    Power module and power module with heat sink
    3.
    发明授权
    Power module and power module with heat sink 有权
    电源模块和电源模块带散热片

    公开(公告)号：US07019975B2

    公开(公告)日：2006-03-28

    申请号：US10343857

    申请日：2001-08-09

    申请人： Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Shoichi Shimamura

    发明人： Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Shoichi Shimamura

    IPC分类号： H05K7/20

    CPC分类号： H01L24/32 ,  C04B2237/407 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/0132 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/0058 ,  Y10T428/12007 ,  H01L2924/01014 ,  H01L2924/00

    摘要： The present invention relates to a power module in which an insulated circuit board is fixed to one main surface of a heat discharge plate. It is an object thereof to provide a power module in which the heat discharge characteristics are improved without any marked warping being generated, and that has an extended heat cycle longevity.In the power module 10 of the present invention, a square insulated circuit board 12 is fixed to one main surface of a heat discharge plate 11. The heat discharge plate 11 is formed of an Al based alloy plate having a thickness A of 3 to 10 mm, and the insulated circuit board 12 having a side B of 30 mm or less in length is brazed directly onto the heat discharge plate 11. It is-preferable that the brazing material used is one or two or more brazing materials selected from Al—Si, Al—Ge, Al—Cu, Al—Mg, and Al—Mn based brazing materials. It is also preferable that the insulated circuit board 12 is formed by a ceramic substrate 12a and Al plates 12b and 12c that are bonded to both surfaces thereof, and that the Al plate 12b has a purity of 99.98 or greater percent by weight.

    摘要翻译： 本发明涉及一种功率模块，其中绝缘电路板固定在放热板的一个主表面上。 其目的在于提供一种功率模块，其中散热特性得到改善而没有产生任何明显的翘曲，并且具有延长的热循环寿命。 在本发明的功率模块10中，将正方形绝缘电路基板12固定在散热板11的一个主面上。 散热板11由厚度为3〜10mm的Al系合金板形成，并且具有长度为30mm以下的B侧的绝缘电路基板12直接钎焊在散热板11上。 所使用的钎料优选为选自Al-Si，Al-Ge，Al-Cu，Al-Mg和Al-Mn基钎焊材料中的一种或两种以上钎焊材料。 绝缘电路板12也优选由陶瓷基板12a和Al板12b和12c形成，并且Al板12b的纯度达到99.98或更高的百分比。 重量。

    Liquid-cooled heat sink and manufacturing method thereof
    4.
    发明授权
    Liquid-cooled heat sink and manufacturing method thereof 有权

    公开(公告)号：US06563709B2

    公开(公告)日：2003-05-13

    申请号：US09907805

    申请日：2001-07-19

    申请人： Takeshi Negishi ,  Toshiyuki Nagase ,  Yoshiyuki Nagatomo ,  Shoichi Shimamura ,  Asao Tokiwa

    发明人： Takeshi Negishi ,  Toshiyuki Nagase ,  Yoshiyuki Nagatomo ,  Shoichi Shimamura ,  Asao Tokiwa

    IPC分类号： H05K720

    CPC分类号： F28F3/025 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink is obtained that has high thermal conductivity as well as satisfactory moldability and corrosion resistance by using a malleable material made of aluminum or aluminum alloy. Liquid cooled heat sink 11 has a passage 23 in which coolant is able to pass, and is joined to a ceramic substrate. A plurality of through holes 12 extending from one end to the other end are formed by a plurality of dividing walls 13 through 15 in flat casing 12 of which both ends are open, and notches 16 are formed on one or both ends of the plurality of dividing walls. Corrugated fins 17 are respectively inserted into each of the plurality of through holes, and each through hole is demarcated into a plurality of slots 12b extending from one end to the other end of the casing by these fins. Both ends of the casing are closed by a pair of covers 18 and 19, and coolant inlet 18a and outlet 18b are formed in the covers. The above passage is formed by communication of the notches and slots, and the above inlet and outlet are positioned on both ends of the passage.