利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.028 秒)

    Recombinant enterovirus 71 neutralizing antibodies and applications thereof
    2.
    发明授权
    Recombinant enterovirus 71 neutralizing antibodies and applications thereof 有权
    重组肠病毒71中和抗体及其应用

    公开(公告)号：US07482006B2

    公开(公告)日：2009-01-27

    申请号：US11404770

    申请日：2006-04-17

    申请人： Tse-Wen Chang ,  Jim Jinn-Chyuan Sheu ,  Lee-Hwa Lo ,  Nien-Yi Chen ,  Young-Sun Lin

    发明人： Tse-Wen Chang ,  Jim Jinn-Chyuan Sheu ,  Lee-Hwa Lo ,  Nien-Yi Chen ,  Young-Sun Lin

    IPC分类号： A61K39/42 ,  C12P21/08 ,  C12N15/13 ,  C07K16/10

    CPC分类号： C07K16/1009 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/52 ,  C07K2317/622 ,  C07K2319/00

    摘要： Provided is an antibody against enterovirus 71 comprising the amino acid sequence shown in SEQ ID NOS: 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, or 26 or functionally active homologues thereof. Also provided are methods for obtaining the antibody comprising (a) selecting a yeast expressing such an antibody from a yeast library, (b) culturing the yeast under conditions that the antibody is expressed, and (c) recovering the antibody from the culture. Also provided is a process for producing the antibody comprising (a) culturing a host cell under conditions that the antibody is expressed, (b) recovering the antibody from the culture, wherein the host cells are transformed or transfected for expressing the antibody against enterovirus 71. Also provided are pharmaceutical compositions comprising an antibody against enterovirus 71 and a pharmaceutically acceptable carrier or diluent, wherein the antibody has an anti-virus agent or detectable label attached thereto.

    摘要翻译： 本发明提供了包含SEQ ID NO：14,15,16,17,18,19,20,21,22,23,24,25或26所示氨基酸序列的肠道病毒71抗体或其功能活性同系物。 还提供了获得抗体的方法，其包括（a）从酵母文库中选择表达这种抗体的酵母，（b）在表达抗体的条件下培养酵母，和（c）从培养物中回收抗体。 还提供了制备抗体的方法，其包括（a）在表达抗体的条件下培养宿主细胞，（b）从培养物中回收抗体，其中宿主细胞被转化或转染用于表达针对肠道病毒的抗体71 还提供了包含针对肠病毒71的抗体和药学上可接受的载体或稀释剂的药物组合物，其中所述抗体具有附着于其上的抗病毒剂或可检测标记。

    Sensor-type semiconductor package and fabrication method thereof
    3.
    发明申请
    Sensor-type semiconductor package and fabrication method thereof 有权
    传感器型半导体封装及其制造方法

    公开(公告)号：US20080105942A1

    公开(公告)日：2008-05-08

    申请号：US11982516

    申请日：2007-11-02

    申请人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

    发明人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

    IPC分类号： H01L31/0203 ,  H01L31/18

    CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012

    摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

    摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。

    Compositions Containing Berberine or Analogs Thereof for Treating Rosacea or Red Face Related Skin Disorders
    4.
    发明申请
    Compositions Containing Berberine or Analogs Thereof for Treating Rosacea or Red Face Related Skin Disorders 有权
    包含小檗碱或类似物治疗红斑痤疮或红脸相关皮肤疾病的组合物

    公开(公告)号：US20120165357A1

    公开(公告)日：2012-06-28

    申请号：US13379604

    申请日：2010-06-30

    申请人： Shuen-Iu Hung ,  Wen-Hung Chung ,  Tse-Wen Chang

    发明人： Shuen-Iu Hung ,  Wen-Hung Chung ,  Tse-Wen Chang

    IPC分类号： A61K31/4745 ,  A61P17/10 ,  A61P31/12 ,  A61P31/04 ,  A61P31/10 ,  A61P29/00 ,  A61P17/00 ,  A61P31/00

    CPC分类号： A61K9/0014 ,  A61K31/4375 ,  A61K45/06

    摘要： The invention pertains to topical pharmaceutical formulations of berberine and its biologically equivalent analogues, such as palmatine and coptisine, for the treatment of rosacea and other red face-related skin disorders. The topical pharmaceutical formulations of this invention contain purified berberine as the primary active drug ingredient at concentrations higher than 0.1%. The invention also pertains to methods of treating rosacea and other red face related skin disorders, such as steroid-induced rosacea-like dermatitis, comprising the administration of topical pharmaceutical formulations that contain berberine or its biologically equivalent analogues, such as palmatine.

    摘要翻译： 本发明涉及小檗碱及其生物等效类似物如巴马汀和黄连碱的局部药物制剂，用于治疗红斑痤疮和其他与红色面部相关的皮肤疾病。 本发明的局部药物制剂含有浓度高于0.1％的纯化小檗碱作为主要活性药物成分。 本发明还涉及治疗酒渣鼻和其他与红脸相关的皮肤病症如类固醇诱导的红斑痤疮样皮炎的方法，其包括施用含有小檗碱或其生物等效类似物如巴马汀的局部药物制剂。

    Sensor-type semiconductor package and fabrication method thereof
    5.
    发明授权
    Sensor-type semiconductor package and fabrication method thereof 有权
    传感器型半导体封装及其制造方法

    公开(公告)号：US07858446B2

    公开(公告)日：2010-12-28

    申请号：US11982516

    申请日：2007-11-02

    申请人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

    发明人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

    IPC分类号： H01L21/48 ,  H01L21/50 ,  H01L21/78

    CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012

    摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

    摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。

    Sensor-type semiconductor package and fabrication
    6.
    发明申请
    Sensor-type semiconductor package and fabrication 审中-公开
    传感器型半导体封装和制造

    公开(公告)号：US20080105941A1

    公开(公告)日：2008-05-08

    申请号：US11982514

    申请日：2007-11-02

    申请人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    发明人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L31/0203 ,  H01L21/00

    CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.

    摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。

    Matrix of antibody-coated spots for determination of antigens
    7.
    发明授权
    Matrix of antibody-coated spots for determination of antigens 失效
    用于测定抗原的抗体包被点的基质

    公开(公告)号：US4591570A

    公开(公告)日：1986-05-27

    申请号：US463188

    申请日：1983-02-02

    申请人： Tse-Wen Chang

    发明人： Tse-Wen Chang

    IPC分类号： A61K39/00 ,  C40B60/14 ,  G01N33/543 ,  G01N33/545 ,  G01N33/552 ,  G01N33/569

    CPC分类号： G01N33/543 ,  G01N33/54366 ,  G01N33/545 ,  G01N33/552 ,  G01N33/569 ,  G01N33/56977 ,  B01J2219/00367 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/0063 ,  B01J2219/00659 ,  C40B60/14 ,  Y10S435/965 ,  Y10S435/975 ,  Y10S436/809 ,  Y10S436/815

    摘要： This invention relates to a novel immunoassay device and method for the determination of antigenic substances. The device essentially comprises a pattern or array of minute antibody-coated spots on the surface of a support. The array of antibody-coated spots is preferably in the form of a rectangular matrix. Each antibody-coated spot is made up of antibodies of a different and distinct specificity. A large number of different antibody-coated spots can be assembled on a very small portion of the surface of the support. The spots serve as tiny, specific immunoadsorbents of cells. The expression of particular surface antigen by cells may be detected by determining to which antibody-coated spot the cells bind.

    摘要翻译： 本发明涉及用于测定抗原物质的新型免疫测定装置和方法。 该装置基本上包括在载体表面上的微小抗体包被点的图案或阵列。 抗体包被斑点的阵列优选为矩形矩阵的形式。 每个抗体包被的斑点由不同和不同特异性的抗体组成。 可以在载体表面的非常小的一部分上组装大量不同的抗体包被的斑点。 这些斑点作为细胞的特异性免疫吸附剂。 可以通过确定细胞结合于哪个抗体包被的位点来检测细胞对特定表面抗原的表达。

    Compositions containing berberine or analogs thereof for treating rosacea or red face related skin disorders
    8.
    发明授权
    Compositions containing berberine or analogs thereof for treating rosacea or red face related skin disorders 有权
    含有小檗碱或其类似物用于治疗红斑痤疮或红脸相关皮肤病的组合物

    公开(公告)号：US09486402B2

    公开(公告)日：2016-11-08

    申请号：US13379604

    申请日：2010-06-30

    申请人： Shuen-Iu Hung ,  Wen-Hung Chung ,  Tse-Wen Chang

    发明人： Shuen-Iu Hung ,  Wen-Hung Chung ,  Tse-Wen Chang

    IPC分类号： A61K9/14 ,  A61K31/4375 ,  A61K45/06 ,  A61K9/00

    CPC分类号： A61K9/0014 ,  A61K31/4375 ,  A61K45/06

    摘要： The invention pertains to topical pharmaceutical formulations of berberine and its biologically equivalent analogs, such as palmatine and coptisine, for the treatment of rosacea and other red face-related skin disorders. The topical pharmaceutical formulations of this invention contain purified berberine as the primary active drug ingredient at concentrations higher than 0.1%. The invention also pertains to methods of treating rosacea and other red face related skin disorders, such as steroid-induced rosacea-like dermatitis, comprising the administration of topical pharmaceutical formulations that contain berberine or its biologically equivalent analogs, such as palmatine.

    摘要翻译： 本发明涉及小檗碱及其生物等效类似物如巴马汀和黄连碱的局部药物制剂，用于治疗酒渣鼻和其他与红脸相关的皮肤疾病。 本发明的局部药物制剂含有浓度高于0.1％的纯化小檗碱作为主要活性药物成分。 本发明还涉及治疗酒渣鼻和其它与红脸相关的皮肤病症如类固醇诱导的红斑痤疮样皮炎的方法，其包括施用含有小檗碱或其生物等效类似物如巴马汀的局部药物制剂。

    Sensor-type package and method for fabricating the same
    9.
    发明申请
    Sensor-type package and method for fabricating the same 审中-公开
    传感器型封装及其制造方法

    公开(公告)号：US20090039527A1

    公开(公告)日：2009-02-12

    申请号：US12221725

    申请日：2008-08-06

    申请人： Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chin-Huang Chang ,  Chih-Ming Huang

    发明人： Chang-Yueh Chan ,  Chien-Ping Huang ,  Tse-Wen Chang ,  Chin-Huang Chang ,  Chih-Ming Huang

    IPC分类号： H01L23/52 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

    摘要： A sensor-type package and a method for fabricating the same are provided. A wafer having a plurality of semiconductor chips is provided, wherein a plurality of holes are formed on a first surface of each of the semiconductor chips, and a plurality of metallic pillars formed in the holes and a plurality of bond pads connected to the metallic pillars form through silicon vias (TSVs). A groove is formed on a second surface of each of the semiconductor chips to expose the metallic pillars. A plurality of sensor chips having TSVs are stacked in the grooves of the semiconductor chips and electrically connected to the exposed metallic pillars. A transparent cover is mounted onto the second surfaces of the semiconductor chips to cover the grooves. A plurality of conductive components are implanted on the bond pads of the semiconductor chips. The wafer is cut along borders among the semiconductor chips.

    摘要翻译： 提供了一种传感器型封装及其制造方法。 提供具有多个半导体芯片的晶片，其中在每个半导体芯片的第一表面上形成多个孔，并且形成在孔中的多个金属柱和连接到金属柱的多个接合焊盘 通过硅通孔（TSV）形成。 在每个半导体芯片的第二表面上形成凹槽以暴露金属柱。 具有TSV的多个传感器芯片堆叠在半导体芯片的凹槽中并电连接到暴露的金属柱。 透明盖安装在半导体芯片的第二表面上以覆盖凹槽。 在半导体芯片的接合焊盘上注入多个导电元件。 在半导体芯片之间沿着边缘切割晶片。