摘要:
Monoclonal antibodies are revealed which bind to the gp 120 protein on the envelope of HIV-1. These antibodies neutralize HIV-1. They inhibit the infection of T cells, and also inhibit syncytium formation. Further, the antibodies are group-specific and neutralize different strains and isolates of HIV-1. These antibodies have a variety of uses, including the treatment and prevention of AIDS and ARC. The antibodies are used in immunotoxins which are specifically toxic to HIV-1 infected T cells.
摘要:
Monoclonal antibodies are revealed which bind to the gp 120 protein on the envelope of HIV-1. These antibodies neutralize HIV-1. They inhibit the rate of infection of T cells, and also inhibit syncytium formation. Further, the antibodies are group-specific and neutralize different strains and isolates of HIV-1. These antibodies have a variety of uses, including the treatment and prevention of AIDS and ARC.
摘要:
A method of preparing simultaneously monoclonal antibodies specific for different cell-free products of activated human T lymphocytes is disclosed. Human T cells are activated in a medium supplemented with mouse serum rather than conventional calf serum. A supernatant prepared from the activated T cells is used to immunize mice. The dominant immunogens in the supernatant are the cell-free products of human T lymphocytes. The yield of hybrid cells which produce products reactive with cell-free products of human T lymphocytes is enhanced by injecting the immunized mice with a supernatant from mitogen-activated murine splenocytes. In addition, a novel radioimmunoadsorbent assay for screening hybrids to detect production of monoclonal antibodies reactive with cell-free products of human T lymphocytes is disclosed.
摘要:
A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
摘要:
The invention pertains to topical pharmaceutical formulations of berberine and its biologically equivalent analogues, such as palmatine and coptisine, for the treatment of rosacea and other red face-related skin disorders. The topical pharmaceutical formulations of this invention contain purified berberine as the primary active drug ingredient at concentrations higher than 0.1%. The invention also pertains to methods of treating rosacea and other red face related skin disorders, such as steroid-induced rosacea-like dermatitis, comprising the administration of topical pharmaceutical formulations that contain berberine or its biologically equivalent analogues, such as palmatine.
摘要:
A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
摘要:
Provided is an antibody against enterovirus 71 comprising the amino acid sequence shown in SEQ ID NOS: 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, or 26 or functionally active homologues thereof. Also provided are methods for obtaining the antibody comprising (a) selecting a yeast expressing such an antibody from a yeast library, (b) culturing the yeast under conditions that the antibody is expressed, and (c) recovering the antibody from the culture. Also provided is a process for producing the antibody comprising (a) culturing a host cell under conditions that the antibody is expressed, (b) recovering the antibody from the culture, wherein the host cells are transformed or transfected for expressing the antibody against enterovirus 71. Also provided are pharmaceutical compositions comprising an antibody against enterovirus 71 and a pharmaceutically acceptable carrier or diluent, wherein the antibody has an anti-virus agent or detectable label attached thereto.
摘要翻译:本发明提供了包含SEQ ID NO:14,15,16,17,18,19,20,21,22,23,24,25或26所示氨基酸序列的肠道病毒71抗体或其功能活性同系物。 还提供了获得抗体的方法,其包括(a)从酵母文库中选择表达这种抗体的酵母,(b)在表达抗体的条件下培养酵母,和(c)从培养物中回收抗体。 还提供了制备抗体的方法,其包括(a)在表达抗体的条件下培养宿主细胞,(b)从培养物中回收抗体,其中宿主细胞被转化或转染用于表达针对肠道病毒的抗体71 还提供了包含针对肠病毒71的抗体和药学上可接受的载体或稀释剂的药物组合物,其中所述抗体具有附着于其上的抗病毒剂或可检测标记。
摘要:
The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.
摘要:
This invention relates to a novel immunoassay device and method for the determination of antigenic substances. The device essentially comprises a pattern or array of minute antibody-coated spots on the surface of a support. The array of antibody-coated spots is preferably in the form of a rectangular matrix. Each antibody-coated spot is made up of antibodies of a different and distinct specificity. A large number of different antibody-coated spots can be assembled on a very small portion of the surface of the support. The spots serve as tiny, specific immunoadsorbents of cells. The expression of particular surface antigen by cells may be detected by determining to which antibody-coated spot the cells bind.
摘要:
The invention pertains to topical pharmaceutical formulations of berberine and its biologically equivalent analogs, such as palmatine and coptisine, for the treatment of rosacea and other red face-related skin disorders. The topical pharmaceutical formulations of this invention contain purified berberine as the primary active drug ingredient at concentrations higher than 0.1%. The invention also pertains to methods of treating rosacea and other red face related skin disorders, such as steroid-induced rosacea-like dermatitis, comprising the administration of topical pharmaceutical formulations that contain berberine or its biologically equivalent analogs, such as palmatine.