公开(公告)号：US08696168B2

公开(公告)日：2014-04-15

申请号：US13447347

申请日：2012-04-16

申请人： Po-Wei Li ,  Tsung-Chi Lee ,  Shih-Chang Hsu ,  Chin Yin Yu

发明人： Po-Wei Li ,  Tsung-Chi Lee ,  Shih-Chang Hsu ,  Chin Yin Yu

IPC分类号： F21V29/00

CPC分类号： F21V29/773 ,  F21K9/23 ,  F21K9/238 ,  F21V3/00 ,  F21V23/006 ,  F21Y2115/10

摘要： An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.

摘要翻译： 提供具有增强的散热能力的照明装置。 照明装置包括散热器，LED模块，盖，LED驱动器和灯座。 LED模块设置在散热器的一端。 盖子覆盖了LED模块。 LED驱动器与LED模块连接，并且包括电路板和设置在电路板上的至少一个电接触构件。 灯座连接到散热器的另一端，并且包括绝缘单元，第一电极，第二电极和至少一个接触端口。 接触端口布置在绝缘单元的侧向内部，使得LED驱动器的电接触构件可以与灯座建立电连接。

公开(公告)号：US09028102B2

公开(公告)日：2015-05-12

申请号：US13296398

申请日：2011-11-15

申请人： Po-Wei Li ,  Tsung-Chi Lee ,  Shih-Chang Hsu ,  Chin-Yin Yu

发明人： Po-Wei Li ,  Tsung-Chi Lee ,  Shih-Chang Hsu ,  Chin-Yin Yu

IPC分类号： F21V29/00 ,  F21K99/00 ,  F21V3/02 ,  F21V23/00 ,  F21Y101/02

CPC分类号： F21K9/23 ,  F21K9/238 ,  F21V3/02 ,  F21V23/006 ,  F21V29/77 ,  F21V29/83 ,  F21Y2115/10

摘要： A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.

摘要翻译： 照明器包括基座，发光单元和灯罩。 底座包括第一管部分，具有小于第一管部分的内径的第二管部分和连接在第一和第二管部分之间的接头部分。 内流路由至少第一管部分，接头部分和第二管部分以同轴方式限定。 灯罩固定在基座上，用于覆盖发光单元。 因此，由发光单元加热的空气从内部流路流出，从而允许冷空气被吸入内部流路。

公开(公告)号：US08491156B2

公开(公告)日：2013-07-23

申请号：US13279271

申请日：2011-10-22

申请人： Tsung-Chi Lee ,  Shih-Chang Hsu

发明人： Tsung-Chi Lee ,  Shih-Chang Hsu

IPC分类号： F21V29/00 ,  F21V21/00

CPC分类号： F21V29/004 ,  F21V29/505 ,  F21V29/507 ,  F21V29/773 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.

摘要翻译： 照明装置包括光源模块和与散热器配合并被盖覆盖的外壳。 壳体具有由散热器的内侧壁围绕的第一壳体部分。 或者，外壳还可以具有布置在散热器的第一外壳部分和内侧壁之间的第二外壳部分。 第一壳体部分和第二壳体部分的相应端部被第一板部分和连接部分覆盖。 空腔由第一壳体部分和第一板部分限定，用于容纳光源模块。 在电路板，连接部分，盖子，第一壳体部分和第一板部分上形成有多个第一通孔，第二通孔，第三通孔，第四通孔和第五通孔， 分别。

公开(公告)号：US08801238B2

公开(公告)日：2014-08-12

申请号：US13494030

申请日：2012-06-12

申请人： Shih-Chang Hsu ,  Tsung-Chi Lee ,  Po-Wei Li

发明人： Shih-Chang Hsu ,  Tsung-Chi Lee ,  Po-Wei Li

IPC分类号： B60Q1/06

CPC分类号： H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H05K1/0206 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014

摘要： A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion. Hence, the instant disclosure can plan a heat-conduction path and an electric-conduction path for the light-emitting chip to effectively increase the heat-dissipating efficiency of the light-emitting element due to the design of placing the heat-conducting and electrically-insulating layer on the heat-dissipating portion.

摘要翻译： 发光装置包括发光元件和导热和电绝缘元件。 发光元件包括至少一个第一导电框架，其具有至少一个第一导电部分和至少一个散热部分，与第一导电框架相邻的至少一个第二导电框架， 导电部分，包围第一导电框架和第二导电框架的壳体以及设置在第一导电框架上的至少一个发光芯片。 导热和电绝缘元件包括设置在散热部分上用于使来自散热部分的电流绝缘的导热和电绝缘层。 因此，本公开可以规划发光芯片的热传导路径和导电路径，以有效地增加发光元件的散热效率，这是因为将导热和电 - 绝热层在散热部分上。

公开(公告)号：US08556465B2

公开(公告)日：2013-10-15

申请号：US13363478

申请日：2012-02-01

申请人： Tsung-Chi Lee ,  Po-Wei Li ,  Shih-Chang Hsu ,  Chin-Yin Yu

发明人： Tsung-Chi Lee ,  Po-Wei Li ,  Shih-Chang Hsu ,  Chin-Yin Yu

IPC分类号： F21S4/00 ,  F21V21/00

CPC分类号： F21V23/009 ,  F21K9/23 ,  F21V29/15 ,  F21V29/83

摘要： An illumination lamp comprises a lamp body, a light-emitting module, a power supply module, and a circuit module. The lamp body defines an inner space. The partitioning unit is disposed in the lamp body for dividing the inner space into a first space for receiving the power supply module, and a second space for receiving the circuit module. Due to the presence of the partitioning unit, thermal convection between the first and second spaces is prevented to reduce adverse influence of a high temperature of the circuit module on the power supply module.

摘要翻译： 照明灯包括灯体，发光模块，电源模块和电路模块。 灯体定义了内部空间。 分隔单元设置在灯体中，用于将内部空间分成用于接收电源模块的第一空间和用于接收电路模块的第二空间。 由于分隔单元的存在，防止了第一和第二空间之间的热对流，以减少电路模块的高温对电源模块的不利影响。

公开(公告)号：US09030084B2

公开(公告)日：2015-05-12

申请号：US13190609

申请日：2011-07-26

申请人： Tsung-Chi Lee

发明人： Tsung-Chi Lee

IPC分类号： H01J7/24 ,  H01L33/62 ,  H01L33/64 ,  H01L33/48 ,  G02F1/1335

CPC分类号： H01L33/62 ,  G02F1/133615 ,  G02F2001/133628 ,  H01L33/486 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively.

摘要翻译： 背光模块的光源装置包括背框单元和发光二极管（LED）封装结构。 后框架单元包括导热基板和具有与底板间隔开并平行的第一板的壳体部分。 LED封装结构设置在基板和第一板之间，并且包括具有发光表面的封装主体和分别面对基板和第一板的两个侧表面。 引线框架单元包括从封装主体的侧表面部分地露出的引线框架，以分别与基板和第一板形成第一和第二导热路径。

公开(公告)号：US08665597B2

公开(公告)日：2014-03-04

申请号：US13452802

申请日：2012-04-20

申请人： Tsung-Chi Lee

发明人： Tsung-Chi Lee

IPC分类号： H05K7/20 ,  F21V29/00

CPC分类号： F21V29/20 ,  F21K9/278 ,  F21V23/006 ,  F21V29/506 ,  F21V29/508 ,  F21V29/777 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2115/10

摘要： A tube includes a tube body and a heat-dissipating member. A light-emitting module and a first electronic component connected electrically to the light-emitting module are disposed in the tube body. At least one opening is formed on the tube body in correspondence to the first electronic component. The heat-dissipating member is placed over the opening. The heat-dissipating member provides a first heat-dissipating path for the first electronic component.

摘要翻译： 管包括管体和散热构件。 发光模块和与发光模块电连接的第一电子部件设置在管体中。 对应于第一电子部件，至少一个开口形成在管体上。 散热构件放置在开口上方。 散热构件为第一电子部件提供第一散热路径。

公开(公告)号：US09018648B2

公开(公告)日：2015-04-28

申请号：US13531462

申请日：2012-06-22

申请人： Kuo-Ming Chiu ,  Tsung-Chi Lee ,  Chia-Hao Wu ,  Meng-Sung Chou

发明人： Kuo-Ming Chiu ,  Tsung-Chi Lee ,  Chia-Hao Wu ,  Meng-Sung Chou

IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/64

CPC分类号： H01L25/0753 ,  H01L33/60 ,  H01L33/642 ,  H01L2924/00 ,  H01L2924/0002

摘要： The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.

摘要翻译： 本发明涉及发光二极管（LED）的封装结构。 封装结构包括基板，设置在基板上的散热结构以及均匀地设置在散热结构上的多个LED芯片。 散热结构具有中心部分和围绕其的至少一个周边部分。 中心部分能够比周边部分散发更多的热量。 因此，可以减小设置在中心部分上的LED芯片与设置在周边部分上的LED芯片之间的温差。