LED package structure
    1.
    发明授权
    LED package structure 有权
    LED封装结构

    公开(公告)号:US09018648B2

    公开(公告)日:2015-04-28

    申请号:US13531462

    申请日:2012-06-22

    摘要: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.

    摘要翻译: 本发明涉及发光二极管(LED)的封装结构。 封装结构包括基板,设置在基板上的散热结构以及均匀地设置在散热结构上的多个LED芯片。 散热结构具有中心部分和围绕其的至少一个周边部分。 中心部分能够比周边部分散发更多的热量。 因此,可以减小设置在中心部分上的LED芯片与设置在周边部分上的LED芯片之间的温差。

    Lead frame assembly, lead frame and insulating housing combination, and led module having the same
    3.
    发明申请
    Lead frame assembly, lead frame and insulating housing combination, and led module having the same 有权
    引线框架组合,引线框架和绝缘外壳组合,以及具有相同功能的LED模块

    公开(公告)号:US20100072509A1

    公开(公告)日:2010-03-25

    申请号:US12585715

    申请日:2009-09-23

    IPC分类号: H01L33/00 H01L23/495

    摘要: A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.

    摘要翻译: 具有多个引线框组的单一引线框架组件每个包括第一引线框架单元。 第一引线框架单元具有沿着第一方向延伸并沿着不同于第一方向的第二方向彼此间隔开的一对第一和第二框架部分。 引线框组还包括设置在第一和第二框架部分之间并沿着第二方向彼此间隔开的至少两个第二引线框架单元。 每个第二引线框架单元与第一引线框架单元配合以限定其间的至少一个第一管芯接合区域。

    Lead frame assembly, lead frame and insulating housing combination, and led module having the same
    5.
    发明授权
    Lead frame assembly, lead frame and insulating housing combination, and led module having the same 有权
    引线框架组合,引线框架和绝缘外壳组合,以及具有相同功能的LED模块

    公开(公告)号:US08089140B2

    公开(公告)日:2012-01-03

    申请号:US12585715

    申请日:2009-09-23

    IPC分类号: H01L23/495

    摘要: A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.

    摘要翻译: 具有多个引线框组的单一引线框架组件每个包括第一引线框架单元。 第一引线框架单元具有沿着第一方向延伸并沿着不同于第一方向的第二方向彼此间隔开的一对第一和第二框架部分。 引线框组还包括设置在第一和第二框架部分之间并沿着第二方向彼此间隔开的至少两个第二引线框架单元。 每个第二引线框架单元与第一引线框架单元配合以限定其间的至少一个第一管芯接合区域。