ANTIREFLECTION STRUCTURE FORMATION METHOD AND ANTIREFLECTION STRUCTURE
    1.
    发明申请
    ANTIREFLECTION STRUCTURE FORMATION METHOD AND ANTIREFLECTION STRUCTURE 有权
    抗逆结构形成方法与抗逆结构

    公开(公告)号:US20090176015A1

    公开(公告)日:2009-07-09

    申请号:US12347187

    申请日:2008-12-31

    IPC分类号: B05D5/02 B05C19/00 G02B1/11

    摘要: The present invention provides such a formation method that an antireflection structure having excellent antireflection functions can be formed in a large area and at small cost. Further, the present invention also provides an antireflection structure formed by that method. In the formation method, a base layer and particles placed thereon are subjected to an etching process. The particles on the base layer serve as an etching mask in the process, and hence they are more durable against etching than the base layer. The etching rate ratio of the base layer to the particles is more than 1 but not more than 5. The etching process is stopped before the particles disappear. It is also possible to produce an antireflection structure by nanoimprinting method employing a stamper. The stamper is formed by use of a master plate produced according to the above formation method.

    摘要翻译: 本发明提供这样一种形成方法,即可以大面积且成本低的方式形成具有优异的抗反射功能的抗反射结构。 此外,本发明还提供了通过该方法形成的抗反射结构。 在形成方法中,对基底层和放置在其上的颗粒进行蚀刻处理。 基层上的颗粒在该过程中用作蚀刻掩模,因此它们比基层更耐腐蚀。 基层与颗粒的蚀刻速率比大于1但不大于5.蚀刻过程在颗粒消失之前停止。 也可以通过使用压模的纳米压印方法制造抗反射结构。 通过使用根据上述形成方法制造的母版形成压模。

    Antireflection structure formation method and antireflection structure
    3.
    发明授权
    Antireflection structure formation method and antireflection structure 有权
    抗反射结构形成方法和抗反射结构

    公开(公告)号:US08840258B2

    公开(公告)日:2014-09-23

    申请号:US13723374

    申请日:2012-12-21

    摘要: The present invention provides such a formation method that an antireflection structure having excellent antireflection functions can be formed in a large area and at small cost. Further, the present invention also provides an antireflection structure formed by that method. In the formation method, a base layer and particles placed thereon are subjected to an etching process. The particles on the base layer serve as an etching mask in the process, and hence they are more durable against etching than the base layer. The etching rate ratio of the base layer to the particles is more than 1 but not more than 5. The etching process is stopped before the particles disappear. It is also possible to produce an antireflection structure by nanoimprinting method employing a stamper. The stamper is formed by use of a master plate produced according to the above formation method.

    摘要翻译: 本发明提供这样一种形成方法,即可以大面积且成本低的方式形成具有优异的抗反射功能的抗反射结构。 此外,本发明还提供了通过该方法形成的抗反射结构。 在形成方法中,对基底层和放置在其上的颗粒进行蚀刻处理。 基层上的颗粒在该过程中用作蚀刻掩模,因此它们比基层更耐腐蚀。 基层与颗粒的蚀刻速率比大于1但不大于5.蚀刻过程在颗粒消失之前停止。 也可以通过使用压模的纳米压印方法制造抗反射结构。 通过使用根据上述形成方法制造的母版形成压模。

    Antireflection structure formation method and antireflection structure
    4.
    发明授权
    Antireflection structure formation method and antireflection structure 有权
    抗反射结构形成方法和抗反射结构

    公开(公告)号:US08361339B2

    公开(公告)日:2013-01-29

    申请号:US12347187

    申请日:2008-12-31

    IPC分类号: C25F3/00 C03C15/00 C03C25/00

    摘要: The present invention provides such a formation method that an antireflection structure having excellent antireflection functions can be formed in a large area and at small cost. Further, the present invention also provides an antireflection structure formed by that method. In the formation method, a base layer and particles placed thereon are subjected to an etching process. The particles on the base layer serve as an etching mask in the process, and hence they are more durable against etching than the base layer. The etching rate ratio of the base layer to the particles is more than 1 but not more than 5. The etching process is stopped before the particles disappear. It is also possible to produce an antireflection structure by nanoimprinting method employing a stamper. The stamper is formed by use of a master plate produced according to the above formation method.

    摘要翻译: 本发明提供这样一种形成方法,即可以大面积且成本低的方式形成具有优异的抗反射功能的抗反射结构。 此外,本发明还提供了通过该方法形成的抗反射结构。 在形成方法中,对基底层和放置在其上的颗粒进行蚀刻处理。 基层上的颗粒在该过程中用作蚀刻掩模,因此它们比基层更耐腐蚀。 基层与颗粒的蚀刻速率比大于1但不大于5.蚀刻过程在颗粒消失之前停止。 也可以通过使用压模的纳米压印方法制造抗反射结构。 通过使用根据上述形成方法制造的母版形成压模。