公开(公告)号：US06446326B1

公开(公告)日：2002-09-10

申请号：US09305862

申请日：1999-05-05

申请人： Ubaldo Mastromatteo ,  Bruno Murari ,  Benedetto Vigna ,  Sarah Zerbini

发明人： Ubaldo Mastromatteo ,  Bruno Murari ,  Benedetto Vigna ,  Sarah Zerbini

IPC分类号： G11B5127

CPC分类号： H02N1/006 ,  G11B5/5552 ,  G11B5/58 ,  Y10T29/49027 ,  Y10T29/49032 ,  Y10T29/49052 ,  Y10T29/49053

摘要： The method comprises the steps of: forming an integrated device including a microactuator in a semiconductor material wafer; forming an immobilization structure of organic material on the wafer; simultaneously forming a securing flange integral with the microactuator and electrical connections for connecting the integrated device to a read/write head; bonding a transducer supporting the read/write head to the securing flange; connecting the electrical connections to the read/write head; cutting the wafer into dices; bonding the microactuator to a suspension; and removing the immobilization structure.

摘要翻译： 该方法包括以下步骤：在半导体材料晶片中形成包括微​​致动器的集成器件; 在晶片上形成有机材料的固定结构; 同时形成与微致动器一体的固定凸缘和用于将集成装置连接到读/写头的电连接; 将支撑读/写头的换能器接合到固定凸缘; 将电气连接连接到读/写头; 将晶片切成骰子; 将微致动器粘合到悬浮液上; 并去除固定结构。

公开(公告)号：US20050009300A1

公开(公告)日：2005-01-13

申请号：US10893021

申请日：2004-07-16

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

IPC分类号： H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/482 ,  H01L21/44

CPC分类号： H01L24/01 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4827 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.

公开(公告)号：US06969637B2

公开(公告)日：2005-11-29

申请号：US10893021

申请日：2004-07-16

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

IPC分类号： H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/482 ,  H01L21/44 ,  H01L21/301 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/01 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4827 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.

摘要翻译： 电子器件形成在包括半导体材料体的模具中，该半导体材料体具有被覆盖结构覆盖的第一面和第二面。 在切割成骰子之前，在制造晶片期间，金属的整体散热器在第二面上电镀生长。 覆盖结构包括钝化区域和不透明聚酰亚胺的保护区域; 保护区域和钝化区域在接触焊盘上方打开以引导引线通过。

公开(公告)号：US06779247B1

公开(公告)日：2004-08-24

申请号：US09676017

申请日：2000-09-29

申请人： Bruno Murari ,  Benedetto Vigna ,  Ubaldo Mastromatteo

发明人： Bruno Murari ,  Benedetto Vigna ,  Ubaldo Mastromatteo

IPC分类号： G11B5127

CPC分类号： G11B7/22 ,  G11B5/53 ,  G11B7/122 ,  Y10T29/49021 ,  Y10T29/49041

摘要： A method of producing suspended elements for electrical connection between two portions of a micro-mechanism that can move relative to one another provides for the formation of a layer of sacrificial material, the formation of the electrical connection elements on the layer of sacrificial material, and the selective removal of the layer of sacrificial material beneath the electrical connecting elements, the layer of sacrificial material being a thin film with at least one adhesive side that can be applied dry to the surface of the micro-mechanism.

摘要翻译： 一种用于在微机构的两部分之间进行电连接的悬挂元件的制造方法，该微机构可以相对于彼此移动，从而形成牺牲材料层，在牺牲材料层上形成电连接元件，以及 选择性地去除电连接元件下面的牺牲材料层，牺牲材料层是具有至少一个可以干燥地施加到微机构表面的粘合剂侧的薄膜。

公开(公告)号：US06423938B1

公开(公告)日：2002-07-23

申请号：US09662984

申请日：2000-09-15

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

IPC分类号： H05B100

CPC分类号： H01L24/81 ,  H01L23/345 ,  H01L24/98 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16148 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2224/05599

摘要： A method for the electrical and/or mechanical interconnection of components of a microelectronic system includes at least one first component and at least one second component to be connected, and at least one local Joule-effect micro-heater is incorporated in one of the first and second components at a respective soldering point therebetween. The method includes supplying electrical energy to the micro-heater to utilize the heat produced therefrom by the Joule effect to solder the first and second components at the respective soldering point.

摘要翻译： 用于微电子系统的部件的电和/或机械互连的方法包括至少一个第一部件和要连接的至少一个第二部件，并且至少一个局部焦耳效应微加热器被并入第一部件 和在它们之间的相应焊接点处的第二部件。 该方法包括向微加热器提供电能以利用焦耳效应产生的热量来在相应焊接点处焊接第一和第二部件。

公开(公告)号：US06784522B2

公开(公告)日：2004-08-31

申请号：US09874381

申请日：2001-06-04

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

IPC分类号： H01L2972

CPC分类号： H01L24/01 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4827 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.

摘要翻译： 电子器件形成在包括半导体材料体的模具中，该半导体材料体具有被覆盖结构覆盖的第一面和第二面。 在切割成骰子之前，在制造晶片期间，金属的整体散热器在第二面上电镀生长。 覆盖结构包括钝化区域和不透明聚酰亚胺的保护区域; 保护区域和钝化区域在接触焊盘上方打开以引导引线通过。

公开(公告)号：US08466599B2

公开(公告)日：2013-06-18

申请号：US12533850

申请日：2009-07-31

申请人： Ubaldo Mastromatteo ,  Bruno Murari ,  Giulio Ricotti ,  Marco Marchesi

发明人： Ubaldo Mastromatteo ,  Bruno Murari ,  Giulio Ricotti ,  Marco Marchesi

IPC分类号： H02N1/00

CPC分类号： H02N1/004

摘要： In an electrostatic micromotor, a mobile substrate faces a fixed substrate and is suspended over the fixed substrate at a given distance of separation in an operative resting condition; an actuation unit is configured so as to give rise to a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement during an operative condition of actuation. The actuation unit is also configured so as to bring the mobile substrate and the fixed substrate substantially into contact and to keep them in contact during the operative condition of actuation. The electrostatic micromotor is provided with an electronic unit for reducing friction, configured so as to reduce a friction generated by the contact between the rotor substrate and the stator substrate during the relative movement.

摘要翻译： 在静电微电机中，移动基板面向固定的基板并且在操作的静止状态下以给定的分离距离悬挂在固定的基板上; 致动单元被构造成在致动的操作状态期间在移动方向上相对于固定基板产生相对移动。 致动单元还构造成使得移动基板和固定基板在操作的操作状态下基本接触并保持它们接触。 静电微电机设置有用于减少摩擦的电子单元，其被配置为在相对运动期间减小由转子基板和定子基板之间的接触产生的摩擦。

公开(公告)号：US20100026138A1

公开(公告)日：2010-02-04

申请号：US12533850

申请日：2009-07-31

申请人： Ubaldo Mastromatteo ,  Bruno Murari ,  Giulio Ricotti ,  Marco Marchesi

发明人： Ubaldo Mastromatteo ,  Bruno Murari ,  Giulio Ricotti ,  Marco Marchesi

IPC分类号： H02N11/00

CPC分类号： H02N1/004

摘要： In an electrostatic micromotor, a mobile substrate faces a fixed substrate and is suspended over the fixed substrate at a given distance of separation in an operative resting condition; an actuation unit is configured so as to give rise to a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement during an operative condition of actuation. The actuation unit is also configured so as to bring the mobile substrate and the fixed substrate substantially into contact and to keep them in contact during the operative condition of actuation. The electrostatic micromotor is provided with an electronic unit for reducing friction, configured so as to reduce a friction generated by the contact between the rotor substrate and the stator substrate during the relative movement.

摘要翻译： 在静电微电机中，移动基板面向固定的基板并且在操作的静止状态下以给定的分离距离悬挂在固定的基板上; 致动单元被构造成在致动的操作状态期间在移动方向上相对于固定基板产生相对移动。 致动单元还构造成使得移动基板和固定基板在操作的操作状态下基本接触并保持它们接触。 静电微电机设置有用于减少摩擦的电子单元，其被配置为在相对运动期间减小由转子基板和定子基板之间的接触产生的摩擦。

公开(公告)号：US20100026137A1

公开(公告)日：2010-02-04

申请号：US12533835

申请日：2009-07-31

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Giulio Ricotti

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Giulio Ricotti

IPC分类号： H02N11/00

CPC分类号： H02N1/004

摘要： In an electrostatic micromotor, a mobile substrate faces a fixed substrate, and electrostatic-interaction elements are provided to allow a relative movement of the mobile substrate with respect to the fixed substrate in a direction of movement. The electrostatic-interaction elements include electrodes arranged on a facing surface of the fixed substrate (2) facing the mobile substrate. The mobile substrate has indentations, which extend within the mobile substrate starting from a respective facing surface that faces the fixed substrate and define between them projections staggered with respect to the electrodes in the direction of movement. Side walls of the indentations have a first distance of separation at the respective facing surface, and a second distance of separation, greater than the first distance of separation, at an internal region of the indentations.

摘要翻译： 在静电微电机中，移动衬底面向固定衬底，并且提供静电相互作用元件以允许移动衬底相对于固定衬底在移动方向上的相对移动。 静电相互作用元件包括布置在面向移动基板的固定基板（2）的面对表面上的电极。 移动基板具有凹槽，其从移动基板的相对面朝向固定基板开始并且在它们之间限定在移动方向上相对于电极交错的凸起之间延伸的移动基板。 凹陷的侧壁在相应的相对表面处具有第一分离距离，并且在凹陷的内部区域处具有大于分离距离的第二距离。

公开(公告)号：US5855693A

公开(公告)日：1999-01-05

申请号：US571806

申请日：1995-12-13

申请人： Bruno Murari ,  Flavio Villa ,  Ubaldo Mastromatteo

发明人： Bruno Murari ,  Flavio Villa ,  Ubaldo Mastromatteo

IPC分类号： H01L21/02 ,  H01L21/20 ,  H01L27/00 ,  H01L27/12 ,  H01L21/265

CPC分类号： H01L21/2007 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01074 ,  H01L2924/14

摘要： A wafer of semiconductor material for fabricating integrated devices, including a stack of superimposed layers including first and second monocrystalline silicon layers separated by an intermediate insulating layer made of a material selected from the group comprising silicon carbide, silicon nitride and ceramic materials. An oxide bond layer is provided between the intermediate layer and the second silicon layer. The wafer is fabricated by forming the intermediate insulating layer on the first silicon layer in a heated vacuum chamber; depositing the oxide layer; and superimposing the second silicon layer. When the stack of silicon, insulating material, oxide and silicon layers is heat treated, the oxide reacts so as to bond the insulating layer to the second silicon layer. As a ceramic material beryllium oxide, aluminium nitride, boron nitride and alumina may be used.

摘要翻译： 一种用于制造集成器件的半导体材料晶片，包括由包括由碳化硅，氮化硅和陶瓷材料组成的材料制成的中间绝缘层分隔的第一和第二单晶硅层的叠加层。 在中间层和第二硅层之间设置氧化物接合层。 通过在加热的真空室中在第一硅层上形成中间绝缘层来制造晶片; 沉积氧化层; 并叠加第二硅层。 当硅，绝缘材料，氧化物和硅层的堆叠被热处理时，氧化物反应以将绝缘层粘合到第二硅层。 作为陶瓷材料氧化铍，可以使用氮化铝，氮化硼和氧化铝。