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    Electronic device packaging and curable resin composition
    2.
    发明申请
    Electronic device packaging and curable resin composition 审中-公开
    电子器件封装和固化树脂组合物

    公开(公告)号：US20040132888A1

    公开(公告)日：2004-07-08

    申请号：US10735708

    申请日：2003-12-16

    申请人： Ube Industries, Ltd.

    发明人： Masahiro Naiki ,  Masayuki Kinouchi ,  Seiji Ishikawa ,  Yuji Matsui ,  Yoshiki Tanaka

    IPC分类号： B05D005/12 ,  B05D001/36 ,  C08K003/34

    CPC分类号： H05K3/285 ,  H01L23/296 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/3452 ,  H05K2201/0162 ,  Y10T29/49171 ,  Y10T29/49224 ,  H01L2224/0401

    摘要： A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent; (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

    摘要翻译： 包装电子装置的方法采用由一种或多种树脂组合物制成的绝缘保护树脂层：（1）100份具有聚硅氧烷骨架和极性基团的有机溶剂可溶性树脂，0.5〜30份 环氧当量大于800的环氧化合物和有机溶剂; （2）将100份具有聚硅氧烷骨架和极性基团的有机溶剂可溶性树脂，0.1〜10份环氧当量为100〜800的环氧化合物，2〜30重量份的多价异氰酸酯化合物，以及 有机溶剂; 和（3）100份具有聚硅氧烷骨架和极性基团的有机溶剂可溶性树脂，0.1〜20份环氧当量大于800的环氧化合物，2〜30份多价异氰酸酯化合物，以及 有机溶剂。