公开(公告)号：US20230124913A1

公开(公告)日：2023-04-20

申请号：US17705405

申请日：2022-03-28

Applicant: Unimicron Technology Corp.

Inventor： Heng-Ming Nien ,  Chih-Chiang Lu ,  Chih-Kai Chan ,  Shih-Lian Cheng

IPC: C25D5/00 ,  C25D21/12

Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.

公开(公告)号：US20230335506A1

公开(公告)日：2023-10-19

申请号：US18338273

申请日：2023-06-20

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Chih-Kai Chan

IPC: H01L23/552 ,  H01L23/66 ,  H01L21/52 ,  H01Q1/22 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/4817 ,  H01L21/52 ,  H01L23/66 ,  H01Q1/2283 ,  H01L23/49822

Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.

公开(公告)号：US11859302B2

公开(公告)日：2024-01-02

申请号：US17705405

申请日：2022-03-28

Applicant: Unimicron Technology Corp.

Inventor： Heng-Ming Nien ,  Chih-Chiang Lu ,  Chih-Kai Chan ,  Shih-Lian Cheng

IPC: C25D5/00 ,  C25D21/12 ,  H05K3/18

CPC classification number: C25D5/007 ,  C25D21/12 ,  H05K3/188

Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.

公开(公告)号：US20240414850A1

公开(公告)日：2024-12-12

申请号：US18404845

申请日：2024-01-04

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Chih-Kai Chan ,  Shih-Lian Cheng

IPC: H05K3/18 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/34

Abstract: A circuit board structure includes a core layer, at least one electroplating metal layer, at least one dielectric layer and at least one conductive metal layer. The core layer includes at least one dielectric portion and at least one metal portion. The electroplating metal layer is disposed on at least one of a first surface and a second surface of the core layer, exposing a portion of at least one of the first surface and the second surface and at least connecting the at least one metal part. The dielectric layer is disposed on at least one of the first surface and the second surface and on the electroplating metal layer. The dielectric layer has at least one opening exposing a portion of the electroplating metal layer. The conductive metal layer is disposed in the opening of the dielectric layer and is correspondingly connected to the electroplating metal layer.

公开(公告)号：US20230335466A1

公开(公告)日：2023-10-19

申请号：US18337438

申请日：2023-06-20

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Chih-Kai Chan ,  Jun-Ho Chen

IPC: H01L23/48 ,  H01L23/66 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC classification number: H01L23/481 ,  H01L23/66 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4697 ,  H05K1/0216 ,  H01L2223/6677 ,  H05K2201/10098 ,  H05K2201/0154 ,  H05K2201/09809

Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.