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公开(公告)号：US11792918B2
公开(公告)日：2023-10-17
申请号：US17455918
申请日：2021-11-21
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Heng-Ming Nien , Ching-Sheng Chen , Yi-Pin Lin , Shih-Liang Cheng
CPC classification number: H05K1/024 , H05K1/0222 , H05K1/112
Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.
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公开(公告)号：US20220232695A1
公开(公告)日：2022-07-21
申请号：US17711027
申请日：2022-04-01
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US20250056712A1
公开(公告)日：2025-02-13
申请号：US18930988
申请日：2024-10-29
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
Abstract: A manufacturing method of the circuit board includes the following. The third substrate has an opening and includes a first, a second and a third dielectric layers. The opening penetrates the first and the second dielectric layers, and the opening is fully filled with the third dielectric layer. The first, the second and the third substrates are press-fitted so that the second substrate is located between the first and the third substrates. Multiple conductive structures are formed so that the first, the second and the third substrates are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, and the third dielectric layer of the third substrate. The conductive via structure is electrically connected to the first and the third substrates to define a signal path. The ground path surrounds the signal path.
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Patent Agency Ranking
公开(公告)号：US12177964B2
公开(公告)日：2024-12-24
申请号：US17711027
申请日：2022-04-01
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
IPC: H05K1/02 , H01L23/498 , H05K1/11 , H05K3/00 , H05K3/42
Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US12144113B2
公开(公告)日：2024-11-12
申请号：US17938977
申请日：2022-09-07
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin , Jun-Rui Huang
Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
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公开(公告)号：US11895772B2
公开(公告)日：2024-02-06
申请号：US17377280
申请日：2021-07-15
Applicant: Unimicron Technology Corp.
Inventor： Chi-Min Chang , Ching-Sheng Chen , Jun-Rui Huang , Wei-Yu Liao , Yi-Pin Lin
CPC classification number: H05K1/115 , H05K1/181 , H05K3/423 , H05K2201/09545
Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
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公开(公告)号：US20230262893A1
公开(公告)日：2023-08-17
申请号：US17894128
申请日：2022-08-23
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Jun-Rui Huang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin
CPC classification number: H05K1/116 , H05K3/4644 , H05K3/0094 , H05K1/024 , H05K3/4038 , H05K2201/0187
Abstract: A circuit board, including a first dielectric material, a second dielectric material, a third dielectric material, a fourth dielectric material, a first external circuit layer, a second external circuit layer, a conductive structure, a first conductive via, and multiple second conductive vias, is provided. The first conductive via at least passes through the first dielectric material and the fourth dielectric material, and is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias pass through the first dielectric material, the second dielectric material, the third dielectric material, and a part of the conductive structure, and surround the first conductive via. The second conductive vias are electrically connected to the first external circuit layer, the conductive structure, and the second external circuit layer to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US20230262890A1
公开(公告)日：2023-08-17
申请号：US17938977
申请日：2022-09-07
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin , Jun-Rui Huang
CPC classification number: H05K1/115 , H05K1/0222 , H05K2201/0195 , H05K2201/09536 , H05K2201/09809
Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.
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