公开(公告)号：US20140027925A1

公开(公告)日：2014-01-30

申请号：US13845625

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L23/48 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US20150187692A1

公开(公告)日：2015-07-02

申请号：US14641901

申请日：2015-03-09

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L23/498 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US08981570B2

公开(公告)日：2015-03-17

申请号：US13845625

申请日：2013-03-18

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US09111818B2

公开(公告)日：2015-08-18

申请号：US14018757

申请日：2013-09-05

Applicant: Unimicron Technology Corporation

Inventor： Chun-Ting Lin ,  Yu-Chung Hsieh ,  Ying-Tung Wang ,  Ying-Chih Chan

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40

CPC classification number: H01L24/13 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/1132 ,  H01L2224/11422 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2924/351 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/4007 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Abstract translation: 提供一种封装基板，包括具有多个导电焊盘的基板主体，形成在基板主体上用于要暴露的导电焊盘的绝缘保护层，以及设置在导电焊盘上的多个导电柱。 每个导电柱具有比底端窄的底端和顶端，从而形成不具有翼结构的锥形结构。 因此，接触点之间的距离减小，满足细间距和多关节的要求。

公开(公告)号：US20140182912A1

公开(公告)日：2014-07-03

申请号：US14018757

申请日：2013-09-05

Applicant: Unimicron Technology Corporation

Inventor： Chun-Ting Lin ,  Yu-Chung Hsieh ,  Ying-Tung Wang ,  Ying-Chih Chan

IPC: H05K1/11

CPC classification number: H01L24/13 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/1132 ,  H01L2224/11422 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2924/351 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/4007 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Abstract translation: 提供一种封装基板，包括具有多个导电焊盘的基板主体，形成在基板主体上用于要暴露的导电焊盘的绝缘保护层，以及设置在导电焊盘上的多个导电柱。 每个导电柱具有比底端窄的底端和顶端，从而形成不具有翼结构的锥形结构。 因此，接触点之间的距离减小，满足细间距和多关节的要求。

公开(公告)号：US20150179476A1

公开(公告)日：2015-06-25

申请号：US14641887

申请日：2015-03-09

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US20150179475A1

公开(公告)日：2015-06-25

申请号：US14641918

申请日：2015-03-09

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US20130249083A1

公开(公告)日：2013-09-26

申请号：US13753906

申请日：2013-01-30

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Dyi-Chung Hu ,  Ying-Chih Chan ,  Chun-Ting Lin

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A packaging substrate is provided, wherein a plurality of conductive posts together with a conductive bonding layer formed thereon form a plurality of external connection structures with the same height, thereby preventing tilted stack structures and poor coplanarity in a subsequent stacking process.

Abstract translation: 提供了一种封装基板，其中多个导电柱与其上形成的导电接合层一起形成具有相同高度的多个外部连接结构，从而防止在随后的堆叠过程中倾斜的堆叠结构和差的共面性。

公开(公告)号：US09460992B2

公开(公告)日：2016-10-04

申请号：US14641901

申请日：2015-03-09

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H05K1/11 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US09337136B2

公开(公告)日：2016-05-10

申请号：US14641887

申请日：2015-03-09

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L21/4763 ,  H01L23/498 ,  H01L23/48 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H05K1/11 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增大， 导电凝胶和插层的可靠性。