Homogeneous multiple band gap devices
    2.
    发明授权
    Homogeneous multiple band gap devices 有权
    均质多带隙器件

    公开(公告)号:US08624222B2

    公开(公告)日:2014-01-07

    申请号:US13656565

    申请日:2012-10-19

    IPC分类号: H01L27/142

    摘要: An electrical device comprising (A) a substrate having a surface and (B) a nanohole superlattice superimposed on a portion of the surface is provided. The nanohole superlattice comprises a plurality of sheets having an array of holes defined therein. The array of holes is characterized by a band gap or band gap range. The plurality of sheets forms a first edge and a second edge. A first lead comprising a first electrically conductive material forms a first junction with the first edge. A second lead comprising a second electrically conductive material forms a second junction with the second edge. The first junction is a Schottky barrier with respect to a carrier. In some instances a metal protective coating covers all or a portion of a surface of the first lead. In some instances, the first lead comprises titanium, the second lead comprises palladium, and the metal protective coating comprises gold.

    摘要翻译: 提供了一种电气装置,其包括(A)具有表面的基板和(B)叠加在所述表面的一部分上的纳米孔超晶格。 纳米孔超晶格包括多个具有限定在其中的孔阵列的片材。 孔阵列的特征在于带隙或带隙范围。 多个片材形成第一边缘和第二边缘。 包括第一导电材料的第一引线与第一边缘形成第一结。 包括第二导电材料的第二引线与第二边缘形成第二结。 第一个结是相对于载体的肖特基势垒。 在一些情况下,金属保护涂层覆盖第一引线的表面的全部或一部分。 在一些情况下,第一引线包括钛,第二引线包括钯,金属保护涂层包括金。

    HOMOGENEOUS MULTIPLE BAND GAP DEVICES
    3.
    发明申请
    HOMOGENEOUS MULTIPLE BAND GAP DEVICES 有权
    均质多重带隙设备

    公开(公告)号:US20130099205A1

    公开(公告)日:2013-04-25

    申请号:US13656565

    申请日:2012-10-19

    IPC分类号: H01L31/0352 H01L33/06

    摘要: An electrical device comprising (A) a substrate having a surface and (B) a nanohole superlattice superimposed on a portion of the surface is provided. The nanohole superlattice comprises a plurality of sheets having an array of holes defined therein. The array of holes is characterized by a band gap or band gap range. The plurality of sheets forms a first edge and a second edge. A first lead comprising a first electrically conductive material forms a first junction with the first edge. A second lead comprising a second electrically conductive material forms a second junction with the second edge. The first junction is a Schottky barrier with respect to a carrier. In some instances a metal protective coating covers all or a portion of a surface of the first lead. In some instances, the first lead comprises titanium, the second lead comprises palladium, and the metal protective coating comprises gold.

    摘要翻译: 提供了一种电气装置,其包括(A)具有表面的基板和(B)叠加在所述表面的一部分上的纳米孔超晶格。 纳米孔超晶格包括多个具有限定在其中的孔阵列的片材。 孔阵列的特征在于带隙或带隙范围。 多个片材形成第一边缘和第二边缘。 包括第一导电材料的第一引线与第一边缘形成第一结。 包括第二导电材料的第二引线与第二边缘形成第二结。 第一个结是相对于载体的肖特基势垒。 在一些情况下,金属保护涂层覆盖第一引线的表面的全部或一部分。 在一些情况下,第一引线包括钛,第二引线包括钯,金属保护涂层包括金。