公开(公告)号：US20210332474A1

公开(公告)日：2021-10-28

申请号：US16619840

申请日：2018-09-28

Applicant: VIAVI Solutions Inc.

Inventor： Zhao YUAN ,  Markus K. TILSCH ,  Georg J. OCKENFUSS ,  Marius GRIGONIS ,  Andrew CLARK ,  Donggong PENG ,  Yinxiang XIA ,  Eric NYBANK ,  Neil PINKERTON

IPC: C23C14/54 ,  C23C14/35 ,  G05B15/02

Abstract: A device may include one or more memories and one or more processors, communicatively coupled to the one or more memories, to receive design information, wherein the design information identifies desired values for a set of layers of an optical element to be generated during one or more runs; receive or obtain historic information identifying a relationship between a parameter for the one or more runs and an observed value relating to the one or more runs or the optical element; determine layer information for the one or more runs based on the historic information, wherein the layer information identifies run parameters, for the set of layers, to achieve the desired values; and cause the one or more runs to be performed based on the layer information.

公开(公告)号：US20210002756A1

公开(公告)日：2021-01-07

申请号：US16459433

申请日：2019-07-01

Applicant: VIAVI Solutions Inc.

Inventor： Markus K. TILSCH ,  Benjamin F. CATCHING

IPC: C23C14/54

Abstract: A coating system may include a coating chamber; a substrate holder to move a substrate along a motion path; and a sensor device in the coating chamber, wherein the sensor device is configured to move along the motion path, and wherein the sensor device is to perform a spectral measurement on the substrate.

公开(公告)号：US20190218669A1

公开(公告)日：2019-07-18

申请号：US16250842

申请日：2019-01-17

Applicant: VIAVI SOLUTIONS INC.

Inventor： Adam Andrew PREUSS ,  Richard A. BRADLEY, JR. ,  Georg J. OCKENFUSS ,  Markus K. TILSCH ,  Andrew CLARK ,  Marius GRIGONIS ,  Andy SHKABKO ,  Nicolas Alexander DAVIS ,  Anthony Jay Kemp COTTRELL

IPC: C23C28/00 ,  C23C4/131 ,  C23C4/08 ,  C23C4/134 ,  C23C4/067 ,  C23C14/16 ,  C23C14/34

CPC classification number: C23C28/34 ,  C23C4/06 ,  C23C4/067 ,  C23C4/08 ,  C23C4/131 ,  C23C4/134 ,  C23C14/025 ,  C23C14/028 ,  C23C14/06 ,  C23C14/165 ,  C23C14/34 ,  C23C14/564 ,  C23C16/0281 ,  C23C16/24 ,  C23C16/4401 ,  C23C16/4407 ,  C23C16/4412 ,  C23C28/023 ,  C23C28/322 ,  H01J37/32477

Abstract: A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.