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    Layout and Method of Singulating Miniature Ultrasonic Transducers
    8.
    发明申请
    Layout and Method of Singulating Miniature Ultrasonic Transducers 审中-公开

    公开(公告)号：US20140184027A1

    公开(公告)日：2014-07-03

    申请号：US14106899

    申请日：2013-12-16

    Applicant: VOLCANO CORPORATION

    Inventor： Cheryl Rice ,  Dongjuan Chris Xi

    IPC: H01L41/04 ,  H01L41/332 ,  H01L41/16

    CPC classification number: H01L41/332 ,  B06B1/0651 ,  B06B1/0685 ,  H01L41/098 ,  H01L41/193 ,  H01L41/338

    Abstract: The present disclosure provides a method of singulating a plurality of miniature ultrasound transducers from a wafer. The method includes receiving a wafer on which a plurality of miniature ultrasound transducers is formed. The miniature ultrasound transducers each include a transducer membrane containing a piezoelectric material. The method includes etching, from a front side of the wafer, a plurality of trenches into the wafer. Each trench at least partially encircles a respective one of the miniature ultrasound transducers in a top view. Each trench includes an approximately rounded segment. The method includes thinning the wafer from a back side opposite the front side. The thinning the wafer is performed such that the trenches are open to the back side. The method includes performing a dicing process to the wafer to separate the miniature ultrasound transducers from one another. The dicing process is performed without making crossing cuts in the wafer.

    Layout and Method of Singulating Miniature Ultrasonic Transducers
    9.
    发明申请
    Layout and Method of Singulating Miniature Ultrasonic Transducers 审中-公开
    微型超声波传感器的布局和方法

    公开(公告)号：US20140184023A1

    公开(公告)日：2014-07-03

    申请号：US14105902

    申请日：2013-12-13

    Applicant: Volcano Corporation

    Inventor： Cheryl Rice ,  Dongjuan Chris Xi

    IPC: H01L41/04 ,  H01L41/332 ,  B06B1/06 ,  H01L41/053 ,  H01L41/16

    CPC classification number: H01L41/332 ,  B06B1/0651 ,  B06B1/0685 ,  H01L41/098 ,  H01L41/193 ,  H01L41/338

    Abstract: The present disclosure provides a method of singulating a plurality of miniature ultrasound transducers from a wafer. The method includes receiving a wafer on which a plurality of miniature ultrasound transducers is formed. The miniature ultrasound transducers each include a transducer membrane containing a piezoelectric material. The method includes etching, from a front side of the wafer, a plurality of trenches into the wafer. Each trench at least partially encircles a respective one of the miniature ultrasound transducers in a top view. Each trench includes an approximately rounded segment. The method includes thinning the wafer from a back side opposite the front side. The thinning the wafer is performed such that the trenches are open to the back side. The method includes performing a dicing process to the wafer to separate the miniature ultrasound transducers from one another. The dicing process is performed without making crossing cuts in the wafer.

    Abstract translation: 本公开提供了一种从晶片分离多个微型超声换能器的方法。 该方法包括接收其上形成有多个微型超声换能器的晶片。 微型超声波换能器包括含有压电材料的换能器膜。 该方法包括从晶片的前侧蚀刻多个沟槽进入晶片。 在顶视图中，每个沟槽至少部分地围绕相应的一个微型超声换能器。 每个沟槽包括近似圆形的段。 该方法包括从与前侧相反的背面使晶片变薄。 执行晶片的薄化，使得沟槽向后侧开放。 该方法包括对晶片执行切割处理以将微型超声换能器彼此分离。 切割过程在晶片上不进行交叉切割的情况下进行。

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