公开(公告)号：US07700494B2

公开(公告)日：2010-04-20

申请号：US11024747

申请日：2004-12-30

申请人： Vaidyanathan Balasubramaniam ,  Masaaki Hagihara ,  Eiichi Nishimura ,  Koichiro Inazawa ,  Rie Inazawa, legal representative

发明人： Vaidyanathan Balasubramaniam ,  Masaaki Hagihara ,  Eiichi Nishimura ,  Koichiro Inazawa

IPC分类号： H01L21/302

CPC分类号： H01L21/31138 ,  G03F7/427 ,  H01L21/02063

摘要： A method is provided for low-pressure plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an oxygen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluoro-carbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. A chamber pressure less than 20 mTorr is utilized in the second cleaning step. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.

摘要翻译： 提供了一种用于低压等离子体灰化以去除光刻胶残余物和蚀刻在电介质层的先前等离子体蚀刻期间形成的残留物的方法。 灰化方法使用包含含氧气体的两步等离子体工艺，其中在第一清洁步骤中向衬底施加低或零偏压，以除去蚀刻之外的大量光致抗蚀剂残余物和蚀刻残留物 并从室表面除去有害的氟碳残余物。 在第二清洗步骤中对衬底施加增加的偏压以除去光刻胶的残余物并从衬底上蚀刻残留物。 在第二清洗步骤中使用小于20mTorr的室压力。 两步法减少了常规一步灰化过程中常见的记忆效应。 端点检测方法可用于监测灰化过程。

公开(公告)号：US20060154486A1

公开(公告)日：2006-07-13

申请号：US11032021

申请日：2005-01-11

申请人： Vaidyanathan Balasubramaniam ,  Yasunori Hatamura ,  Masaaki Hagihara ,  Eiichi Nishimura ,  Koichiro Inazawa ,  Rie Inazawa

发明人： Vaidyanathan Balasubramaniam ,  Yasunori Hatamura ,  Masaaki Hagihara ,  Eiichi Nishimura ,  Koichiro Inazawa ,  Rie Inazawa

IPC分类号： H01L21/461 ,  H01L21/302

CPC分类号： H01L21/02063 ,  G03F7/427 ,  H01J37/32082 ,  H01J2237/3342 ,  H01L21/31138 ,  H01L22/26

摘要： A method is provided for plasma ashing to remove photoresist remnants and etch residues formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving a hydrogen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluorocarbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. A chamber pressure less than 20 mTorr is utilized in the second cleaning step. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.

摘要翻译： 提供了一种用于等离子体灰化以去除光刻胶残余物和蚀刻在介电层的先前等离子体蚀刻期间形成的残留物的方法。 灰化方法使用涉及含氢气体的两步等离子体工艺，其中在第一清洁步骤中向衬底施加低或零偏压，以除去蚀刻之外的大量光致抗蚀剂残余物和蚀刻残留物 并从室表面除去有害的碳氟化合物残留物。 在第二清洗步骤中对衬底施加增加的偏压以除去光刻胶的残余物并从衬底上蚀刻残留物。 在第二清洗步骤中使用小于20mTorr的室压力。 两步法减少了常规一步灰化过程中常见的记忆效应。 端点检测方法可用于监测灰化过程。

公开(公告)号：US20060144817A1

公开(公告)日：2006-07-06

申请号：US11024747

申请日：2004-12-30

申请人： Vaidyanathan Balasubramaniam ,  Masaaki Hagihara ,  Eiichi Nishimura ,  Koichiro Inazawa ,  Rie Inazawa

发明人： Vaidyanathan Balasubramaniam ,  Masaaki Hagihara ,  Eiichi Nishimura ,  Koichiro Inazawa ,  Rie Inazawa

IPC分类号： G01L21/30 ,  G01R31/00 ,  B44C1/22 ,  H01L21/302

CPC分类号： H01L21/31138 ,  G03F7/427 ,  H01L21/02063

摘要： A method is provided for low-pressure plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an oxygen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluoro-carbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. A chamber pressure less than 20 mTorr is utilized in the second cleaning step. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.

摘要翻译： 提供了一种用于低压等离子体灰化以去除光致抗蚀剂残余物和蚀刻在介电层的先前等离子体蚀刻期间形成的残留物的方法。 灰化方法使用包含含氧气体的两步等离子体工艺，其中在第一清洁步骤中向衬底施加低或零偏压，以除去蚀刻之外的大量光致抗蚀剂残余物和蚀刻残留物 并从室表面除去有害的氟碳残余物。 在第二清洗步骤中对衬底施加增加的偏压以除去光刻胶的残余物并从衬底上蚀刻残留物。 在第二清洗步骤中使用小于20mTorr的室压力。 两步法减少了常规一步灰化过程中常见的记忆效应。 端点检测方法可用于监测灰化过程。

公开(公告)号：US07465673B2

公开(公告)日：2008-12-16

申请号：US10736782

申请日：2003-12-17

申请人： Yoshiki Igarashi ,  Kouichiro Inazawa ,  Kimihiro Higuchi ,  Vaidyanathan Balasubramaniam ,  Eiichi Nishimura ,  Ralph Kim ,  Philip Sansone ,  Masaaki Hagihara

发明人： Yoshiki Igarashi ,  Kouichiro Inazawa ,  Kimihiro Higuchi ,  Vaidyanathan Balasubramaniam ,  Eiichi Nishimura ,  Ralph Kim ,  Philip Sansone ,  Masaaki Hagihara

IPC分类号： H01L21/00

CPC分类号： H01L21/31138 ,  G03F7/091 ,  H01L21/31144 ,  H01L21/76802

摘要： A method for etching an organic anti-reflective coating (ARC) layer on a substrate in a plasma processing system comprising: introducing a process gas comprising nitrogen (N), hydrogen (H), and oxygen (O); forming a plasma from the process gas; and exposing the substrate to the plasma. The process gas can, for example, constitute an NH3/O2, N2/H2/O2, N2/H2/CO, NH3/CO, or NH3/CO/O2 based chemistry. Additionally, the process chemistry can further comprise the addition of helium. The present invention further presents a method for forming a bilayer mask for etching a thin film on a substrate, wherein the method comprises: forming the thin film on the substrate; forming an ARC layer on the thin film; forming a photoresist pattern on the ARC layer; and transferring the photoresist pattern to the ARC layer with an etch process using a process gas comprising nitrogen (N), hydrogen (H), and oxygen (O).

摘要翻译： 一种用于在等离子体处理系统中蚀刻衬底上的有机抗反射涂层（ARC）层的方法，包括：引入包含氮（N），氢（H）和氧（O）的工艺气体; 从工艺气体形成等离子体; 并将衬底暴露于等离子体。 工艺气体可以例如构成基于NH 3 / O 2，N 2 / H 2 / O 2，N 2 / H 2 / CO，NH 3 / CO或NH 3 / CO / O 2的化学。 另外，工艺化学可以进一步包括添加氦。 本发明还提供一种用于形成用于在衬底上蚀刻薄膜的双层掩模的方法，其中所述方法包括：在所述衬底上形成所述薄膜; 在薄膜上形成ARC层; 在ARC层上形成光刻胶图案; 以及使用包含氮（N），氢（H）和氧（O）的工艺气体的蚀刻工艺将光致抗蚀剂图案转移到ARC层。

公开(公告)号：US06670276B1

公开(公告)日：2003-12-30

申请号：US09691202

申请日：2000-10-19

申请人： Tomoki Suemasa ,  Vaidyanathan Balasubramaniam ,  Koichiro Inazawa

发明人： Tomoki Suemasa ,  Vaidyanathan Balasubramaniam ,  Koichiro Inazawa

IPC分类号： H01L2120

CPC分类号： H01L21/31116 ,  G03F7/427 ,  H01J2237/3342 ,  H01L21/31138 ,  H01L21/67069

摘要： A wafer W is placed on a lower electrode 106 provided inside a processing chamber 102 of a plasma processing apparatus 100. A film constituted an organic polysiloxane, which is a Low-K material is formed at the wafer W. Plasma is generated inside the processing chamber 102 to implement an etching process by using a photoresist film on the organic polysiloxane film as a mask and an opening pattern in which a portion of the organic polysiloxane film is exposed is formed. After the etching process, the wafer W is left inside the processing chamber 102. The pressure inside the processing chamber 102 is set at a level within the range of 30 mTorr (4.00 Pa)˜150 mTorr (20.0 Pa) by inducing a processing gas into the processing chamber 102 and evacuating the gas from the processing chamber 102. At the pressure level the set, the gas inside the processing chamber 102 is raised to plasma and the photoresist film is ashed. Thus, a plasma processing method which makes it possible to remove the photoresist film on the organic polysiloxane film without compromising the low dielectric constant characteristics of the organic polysiloxane film is achieved.

摘要翻译： 将晶片W放置在设置在等离子体处理设备100的处理室102内部的下电极106上。构成有机聚硅氧烷，其是在晶片W上形成的低K材料。等离子体在处理 通过使用有机聚硅氧烷膜上的光致抗蚀剂膜作为掩模来实现蚀刻工艺，并且形成有机聚硅氧烷膜的暴露部分的开口图案。 在蚀刻处理之后，将晶片W留在处理室102的内部。处理室102内的压力通过引入处理气体而设定在30mTorr（4.00Pa）〜150mTorr（20.0Pa）的范围内的水平 进入处理室102并从处理室102排出气体。在压力水平下，处理室102内的气体升高到等离子体，并且光致抗蚀剂膜被灰化。 因此，可以实现能够在不损害有机聚硅氧烷膜的低介电常数特性的情况下除去有机聚硅氧烷膜上的光致抗蚀剂膜的等离子体处理方法。

公开(公告)号：US08048325B2

公开(公告)日：2011-11-01

申请号：US11970062

申请日：2008-01-07

申请人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa ,  Rie Inazawa ,  Rich Wise ,  Arpan Mahorawala ,  Siddhartha Panda

发明人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa ,  Rie Inazawa ,  Rich Wise ,  Arpan Mahorawala ,  Siddhartha Panda

IPC分类号： B44C1/22

CPC分类号： H01L21/67069 ,  H01L21/31138

摘要： A method for etching an organic anti-reflective coating (ARC) layer on a substrate in a plasma processing system comprising: introducing a process gas comprising ammonia (NH3), and a passivation gas; forming a plasma from the process gas; and exposing the substrate to the plasma. The process gas can, for example, constitute NH3 and a hydrocarbon gas such as at least one of C2H4, CH4, C2H2, C2H6, C3H4, C3H6, C3H8, C4H6, C4H8, C4H10, C5H8, C5H10, C6H6, C6H10, and C6H12. Additionally, the process chemistry can further comprise the addition of helium. The present invention further presents a method for forming a bilayer mask for etching a thin film on a substrate, wherein the method comprises: forming the thin film on the substrate; forming an ARC layer on the thin film; forming a photoresist pattern on the ARC layer; and transferring the photoresist pattern to the ARC layer with an etch process using a process gas comprising ammonia (NH3), and a passivation gas.

摘要翻译： 一种在等离子体处理系统中蚀刻衬底上的有机抗反射涂层（ARC）层的方法，包括：引入包含氨（NH 3）和钝化气体的工艺气体; 从工艺气体形成等离子体; 并将衬底暴露于等离子体。 处理气体可以例如构成NH 3和烃气体，例如C 2 H 4，CH 4，C 2 H 2，C 2 H 6，C 3 H 4，C 3 H 6，C 3 H 8，C 4 H 6，C 4 H 8，C 4 H 10，C 5 H 8，C 5 H 10，C 6 H 6，C 6 H 10和C 6 H 12中的至少一种 。 另外，工艺化学可以进一步包括添加氦。 本发明还提供一种用于形成用于在衬底上蚀刻薄膜的双层掩模的方法，其中所述方法包括：在所述衬底上形成所述薄膜; 在薄膜上形成ARC层; 在ARC层上形成光刻胶图案; 以及使用包含氨（NH 3）和钝化气体的工艺气体的蚀刻工艺将光致抗蚀剂图案转移到ARC层。

公开(公告)号：US07344991B2

公开(公告)日：2008-03-18

申请号：US10640577

申请日：2003-08-14

申请人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa ,  Rich Wise ,  Arpan Mahorowala ,  Siddhartha Panda

发明人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa ,  Rich Wise ,  Arpan Mahorowala ,  Siddhartha Panda

IPC分类号： H01L21/461 ,  H01L21/302

CPC分类号： H01L21/0276 ,  A61M2025/024 ,  A61M2025/028 ,  H01L21/31138 ,  H01L21/31144

摘要： A method for etching an organic anti-reflective coating (ARC) layer on a substrate in a plasma processing system comprising: introducing a process gas comprising ammonia (NH3), and a passivation gas; forming a plasma from the process gas; and exposing the substrate to the plasma. The process gas can, for example, constitute NH3 and a hydrocarbon gas such as at least one of C2H4, CH4, C2H2, C2H6, C3H4, C3H6, C3H8, C4H6, C4H8, C4H10, C5H8, C5H10, C6H6, C6H10, and C6H12. Additionally, the process chemistry can further comprise the addition of helium. The present invention further presents a method for forming a bilayer mask for etching a thin film on a substrate, wherein the method comprises: forming the thin film on the substrate; forming an ARC layer on the thin film; forming a photoresist pattern on the ARC layer; and transferring the photoresist pattern to the ARC layer with an etch process using a process gas comprising ammonia (NH3), and a passivation gas.

公开(公告)号：US20050136681A1

公开(公告)日：2005-06-23

申请号：US10743275

申请日：2003-12-23

申请人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa

发明人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa

IPC分类号： G03F7/42 ,  H01L21/311 ,  C23F1/00 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  H01L21/302

CPC分类号： G03F7/427 ,  H01L21/31138

摘要： A method and system for removing photoresist from a substrate in a plasma processing system comprising: introducing a process gas comprising NxOy, wherein x, y represent integers greater than or equal to unity. Additionally, the process chemistry can further comprise the addition of an inert gas, such as a Noble gas (i.e., He, Ne, Ar, Kr, Xe, Rn). The present invention further presents a method for forming a feature in a thin film on a substrate, wherein the method comprises: forming a dielectric layer on a substrate; forming a photoresist pattern on the dielectric layer; transferring the photoresist pattern to the dielectric layer by etching; and removing the photoresist from the dielectric layer using a process gas comprising NxOy, wherein x and y are integers greater than or equal to unity.

摘要翻译： 一种用于在等离子体处理系统中从衬底去除光致抗蚀剂的方法和系统，包括：引入包含N x O x O y的工艺气体，其中x，y表示大于或等于 等于统一 另外，工艺化学可以进一步包括添加惰性气体，例如Noble气体（即He，Ne，Ar，Kr，Xe，Rn）。 本发明还提供了一种在衬底上形成薄膜中的特征的方法，其中所述方法包括：在衬底上形成电介质层; 在介电层上形成光致抗蚀剂图案; 通过蚀刻将光致抗蚀剂图案转印到电介质层; 以及使用包含N x O x O y的工艺气体从介电层除去光致抗蚀剂，其中x和y是大于或等于1的整数。

公开(公告)号：US20050136666A1

公开(公告)日：2005-06-23

申请号：US10787898

申请日：2004-02-27

申请人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa ,  Siddhartha Panda ,  Rich Wise ,  Arpan Mahorowala

发明人： Vaidyanathan Balasubramaniam ,  Koichiro Inazawa ,  Siddhartha Panda ,  Rich Wise ,  Arpan Mahorowala

IPC分类号： H01L21/027 ,  H01L21/311 ,  H01L21/768 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01J37/32935 ,  H01L21/0271 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/76802

摘要： A method and system for etching an organic layer on a substrate in a plasma processing system comprising: introducing a process gas comprising NxOy, wherein x, y represent integers greater than or equal to unity. Additionally, the process chemistry can further comprise the addition of an inert gas, such as a Noble gas (i.e., He, Ne, Ar, Kr, Xe, Rn). The present invention further presents a method for forming a bilayer mask for etching a thin film on a substrate, wherein the method comprises: forming the thin film on the substrate; forming an organic layer on the thin film; forming a photoresist pattern on the organic layer; and transferring the photoresist pattern to the organic layer with an etch process using a process gas comprising NxOy, wherein x, y represent integers greater than or equal to unity.

摘要翻译： 一种用于在等离子体处理系统中蚀刻衬底上的有机层的方法和系统，包括：引入包含N x O O y O y的工艺气体，其中x，y表示更大的整数 大于或等于统一 另外，工艺化学可以进一步包括添加惰性气体，例如Noble气体（即He，Ne，Ar，Kr，Xe，Rn）。 本发明还提供一种用于形成用于在衬底上蚀刻薄膜的双层掩模的方法，其中所述方法包括：在所述衬底上形成所述薄膜; 在薄膜上形成有机层; 在有机层上形成光致抗蚀剂图案; 以及使用包括N x O x O y X y的工艺气体的蚀刻工艺将光致抗蚀剂图案转移到有机层，其中x，y表示大于或等于1的整数。

公开(公告)号：US07169440B2

公开(公告)日：2007-01-30

申请号：US10259768

申请日：2002-09-30

申请人： Vaidyanathan Balasubramaniam ,  Masaaki Hagiwara ,  Eiichi Nishimura ,  Kouichiro Inazawa

发明人： Vaidyanathan Balasubramaniam ,  Masaaki Hagiwara ,  Eiichi Nishimura ,  Kouichiro Inazawa

IPC分类号： B05D5/06

CPC分类号： H01L21/02063 ,  G03F7/427 ,  H01L21/31138

摘要： A method is provided for plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an oxygen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluoro-carbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.

摘要翻译： 提供了一种用于等离子体灰化以去除光刻胶残留物的蚀刻残留物和蚀刻在电介质层的先前等离子体蚀刻期间形成的残留物的方法。 灰化方法使用包含含氧气体的两步等离子体工艺，其中在第一清洁步骤中向衬底施加低或零偏压，以除去蚀刻之外的大量光致抗蚀剂残余物和蚀刻残留物 并从室表面除去有害的氟碳残余物。 在第二清洗步骤中对衬底施加增加的偏压以除去光刻胶的残余物并从衬底上蚀刻残留物。 两步法减少了常规一步灰化过程中常见的记忆效应。 端点检测方法可用于监测灰化过程。