公开(公告)号：US20060241813A1

公开(公告)日：2006-10-26

申请号：US11338323

申请日：2006-01-23

申请人： Venkatesh Babu ,  Russell Kaplan ,  Tetsuya Ishikawa

发明人： Venkatesh Babu ,  Russell Kaplan ,  Tetsuya Ishikawa

IPC分类号： G05B19/04

CPC分类号： G05B19/41825 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087

摘要： The present invention relates to apparatus and method of collision avoidance in a cluster tool having a plurality of processing stations and at least two robots. In one embodiment of the invention, the system is configured such that each of the processing stations is accessible by only one of the at least two robots. For each of the at least two robots, a set of trajectories is determined so that each robot is capable of transferring substrates among the corresponding processing stations, wherein the envelope formed by the set of trajectories of each robot does not overlap.

摘要翻译： 本发明涉及具有多个处理站和至少两个机器人的群集工具中的防碰撞装置和方法。 在本发明的一个实施例中，系统被配置为使得每个处理站仅由至少两个机器人中的一个可访问。 对于至少两个机器人中的每一个，确定一组轨迹，使得每个机器人能够在相应的处理站之间传送基板，其中由每个机器人的一组轨迹形成的包络不重叠。

公开(公告)号：US6096567A

公开(公告)日：2000-08-01

申请号：US980595

申请日：1997-12-01

申请人： Russell Kaplan ,  Ralph Scherp

发明人： Russell Kaplan ,  Ralph Scherp

IPC分类号： G01R1/06 ,  G01R31/28 ,  H01L21/66

CPC分类号： G01R31/2831 ,  G01R31/2887

摘要： An improved method and apparatus for automatically aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a pattern of contact electrodes is located using a low magnification image of a number of contact electrodes. A shape representative of a contact electrode point is then fitted to each of the number of contact electrodes using a high magnification image of the contact electrodes and a centroid of that fitted shape is determined. The position of the centroid is compared to the position of each of the number of pads, and the pads and contact electrodes are moved relative to each other to a position for contact between the pads and contact electrodes. Other aspects and other embodiments are also described.

摘要翻译： 提供了一种用于将晶片探针自动对准半导体器件的焊盘的改进的方法和装置。 在本发明的一个方面的一个实施例中，使用多个接触电极的低倍率图像来定位接触电极的图案。 然后，使用接触电极的高倍率图像将代表接触电极点的形状拟合到多个接触电极中的每一个上，并确定该拟合形状的质心。 将质心的位置与每个焊盘的位置进行比较，并且焊盘和接触电极相对于彼此移动到焊盘和接触电极之间的接触位置。 还描述了其它方面和其他实施例。