Platform power management based on latency guidance
    5.
    发明授权
    Platform power management based on latency guidance 有权
    基于延迟指导的平台电源管理

    公开(公告)号:US08631257B2

    公开(公告)日:2014-01-14

    申请号:US13445809

    申请日:2012-04-12

    IPC分类号: G06F1/16

    CPC分类号: G06F1/3203

    摘要: Embodiments of a system for receiving power management guidelines from a first plurality of components of a system, and developing a power management policy to manage one or more of a second plurality of components of the system based at least in part on the received power management guidelines. Other embodiments are described.

    摘要翻译: 用于从系统的第一多个组件接收功率管理指南的系统的实施例,以及至少部分地基于所接收的功率管理指南来开发用于管理系统的第二多个组件中的一个或多个的功率管理策略 。 描述其他实施例。

    PLATFORM POWER MANAGEMENT BASED ON LATENCY GUIDANCE
    7.
    发明申请
    PLATFORM POWER MANAGEMENT BASED ON LATENCY GUIDANCE 有权
    基于LATENCY指导的平台电源管理

    公开(公告)号:US20120198248A1

    公开(公告)日:2012-08-02

    申请号:US13445809

    申请日:2012-04-12

    IPC分类号: G06F1/00

    CPC分类号: G06F1/3203

    摘要: Embodiments of a system for receiving power management guidelines from a first plurality of components of a system, and developing a power management policy to manage one or more of a second plurality of components of the system based at least in part on the received power management guidelines. Other embodiments are described.

    摘要翻译: 用于从系统的第一多个组件接收功率管理指南的系统的实施例,以及至少部分地基于所接收的功率管理指南来开发用于管理系统的第二多个组件中的一个或多个的功率管理策略 。 描述其他实施例。

    METHOD AND APPARATUS FOR ON-DIE TEMPERATURE SENSING AND CONTROL
    8.
    发明申请
    METHOD AND APPARATUS FOR ON-DIE TEMPERATURE SENSING AND CONTROL 审中-公开
    用于温度传感和控制的方法和装置

    公开(公告)号:US20100205464A1

    公开(公告)日:2010-08-12

    申请号:US12651435

    申请日:2009-12-31

    IPC分类号: G06F1/00

    摘要: For one disclosed embodiment, a plurality of processor cores may be on a semiconductor die. The processor cores may have at least one corresponding temperature sensor. Circuitry on the semiconductor die may generate thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. A thermal event indication may indicate that a sensed temperature exceeds a temperature point. Central management logic on the semiconductor die may receive thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. The central management logic may modify operation of one or more of the processor cores in response to a thermal event indication. Other embodiments are also disclosed.

    摘要翻译: 对于一个公开的实施例,多个处理器核可以在半导体管芯上。 处理器核可以具有至少一个对应的温度传感器。 基于多个处理器核心的多个温度传感器的感测温度,半导体管芯上的电路可产生热事件指示。 热事件指示可以指示感测的温度超过温度点。 基于多个处理器核心的多个温度传感器的感测温度,半导体管芯上的中央管理逻辑可以接收热事件指示。 中央管理逻辑可以响应于热事件指示来修改一个或多个处理器核的操作。 还公开了其他实施例。

    Deferring peripheral traffic with sideband control
    9.
    发明授权
    Deferring peripheral traffic with sideband control 有权
    通过边带控制延迟外设流量

    公开(公告)号:US07606962B2

    公开(公告)日:2009-10-20

    申请号:US11975841

    申请日:2007-10-22

    IPC分类号: G06F13/20 G06F12/14

    摘要: In some embodiments, a system comprises a host system comprising an industry standard interface, a peripheral device coupled to the host device via the industry standard interface, and logic in the host system to confirm that the host device supports an enhanced feature, identify at least one pin on the industry standard interface on which the enhanced feature may be implemented, enable support for the enhanced feature on the at least one pin, and route communication traffic associated with the enhanced feature to the at least one pin. Other embodiments may be described.

    摘要翻译: 在一些实施例中,系统包括主机系统,其包括工业标准接口,经由工业标准接口耦合到主机设备的外围设备以及主机系统中的逻辑,以确认主机设备支持增强特征,至少识别 可以在其上实现增强特征的工业标准接口上的一个引脚,使得能够支持至少一个引脚上的增强特征,并将与增强特征相关联的通信流量路由到至少一个引脚。 可以描述其他实施例。