摘要:
A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate is provided with substrate contacts and conductive pathways that are electrically coupled to the die contacts and extend through the substrate. Electrical conductors surround the conductive pathways. A monitoring circuit detects a break in continuity of one or more of the electrical conductors, and preferably renders the assembly inoperable. Preferably, an epoxy encapsulation is provided to prevent probing tools from being able to reach the die or substrate contacts.
摘要:
A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate is provided with substrate contacts and conductive pathways that are electrically coupled to the die contacts and extend through the substrate. Electrical conductors surround the conductive pathways. A monitoring circuit detects a break in continuity of one or more of the electrical conductors, and preferably renders the assembly inoperable. Preferably, an epoxy encapsulation is provided to prevent probing tools from being able to reach the die or substrate contacts.
摘要:
A method and apparatus is disclosed for preventing the unintended retention of secret data caused by preferred state/burn in secure electronic modules. Sequentially storing the data, and its inverse on alternating clock cycles, and by actively overwriting it to destroy it, prevents SRAM devices from developing a preferred state. By encrypting a relatively large amount of secret data with a master encryption key, and storing said master key in this non-preferred state storage, the electronic module conveniently extends this protection scheme to a large amount of data, without the overhead of investing or actively erasing the larger storage area.
摘要:
A method and apparatus is disclosed for preventing the unintended retention of secret data caused by preferred state/burn-in in secure electronic modules. Sequentially storing the data and its inverse on alternating clock cycles, and by actively overwriting it to destroy it, prevents SRAM devices from developing a preferred state. By encrypting a relatively large amount of secret data with a master encryption key, and storing said master key in this non-preferred state storage, the electronic module conveniently extends this protection scheme to a large amount of data, without the overhead of investing or actively erasing the larger storage area.
摘要:
A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate is provided with substrate contacts and conductive pathways that are electrically coupled to the die contacts and extend through the substrate. Electrical conductors surround the conductive pathways. A monitoring circuit detects a break in continuity of one or more of the electrical conductors, and preferably renders the assembly inoperable. Preferably, an epoxy encapsulation is provided to prevent probing tools from being able to reach the die or substrate contacts.
摘要:
A method for embedding tamper proof layers and discrete components into a printed circuit board stack-up is disclosed. According to this method, a plating mask is applied on a base substrate to cover partially one of its faces. Conductive ink is then spread on this face so as to fill the gap formed by the plating mask. To obtain a uniform distribution of the conductive ink and then gel it, the conductive ink is preferably heated. A dielectric layer is applied on the conductive ink layer and the polymerization process is ended to obtain a strong adhesion between these two layers. In a preferred embodiment, conductive tracks are simultaneously designed on the other face of the base substrate to reduce thermo-mechanical strains and deformations.
摘要:
A tamper-proof cap adapted to be mounted on a large assembly for shielding a selected area of the large assembly is disclosed. The tamper-proof cap comprises a laminate stack-up structure wherein at least one open chamber is formed. The stack-up structure comprises at least two layers wherein tamper-proof layers are formed on top of the open chamber. A plurality of vias are disposed around the open chamber, forming with said tamper proof layers a tamper-proof structure around said open chamber. The vias are adapted for connecting the tamper-proof layers to the large assembly when the tamper-proof cap is mounted. In a preferred embodiment, the tamper-proof cap further comprises a shielding layer on top of the tamper-proof layer that are preferably done using conductive ink.
摘要:
A cryptographic circuit with voltage island-based tamper detection and response is disclosed. The circuit includes a voltage island having at least one monitoring circuit and a first storage area for security parameters. The circuit also includes a second storage area for key storage and management logic to tamper the security parameters upon detection of an environmental failure.
摘要:
An apparatus and method is disclosed for selecting data in a FIFO memory array made up of a plurality of memory cells arranged in rows and columns, where each row of cells has an associated number of word lines selectively addressable by an associated row address, and each column of cells has an associated bit line that provides access to the memory cells of the associated column as enabled by the respective word lines; and the memory array includes an address decoder having an address input for receiving an input address for selecting word lines in accordance with the input address, and a programmable-width vertical pointer for providing read and write input addresses to the address input of the address decoder during associated read and write operations of the memory array, where the programmable-width vertical pointer modifies the read and write addresses during operations of the memory array and provides a FIFO memory functionality.
摘要:
A method for embedding tamper proof layers and discrete components into a printed circuit board stack-up is disclosed. According to this method, a plating mask is applied on a base substrate to cover partially one of its faces. Conductive ink is then spread on this face so as to fill the gap formed by the plating mask. To obtain a uniform distribution of the conductive ink and then gel it, the conductive ink is preferably heated. A dielectric layer is applied on the conductive ink layer and the polymerization process is ended to obtain a strong adhesion between these two layers. In a preferred embodiment, conductive tracks are simultaneously designed on the other face of the base substrate to reduce thermo-mechanical strains and deformations.