Methods and Apparatus for Compressed Imaging Using Modulation in Pupil Plane
    1.
    发明申请
    Methods and Apparatus for Compressed Imaging Using Modulation in Pupil Plane 审中-公开
    用于瞳孔平面中调制的压缩成像方法与装置

    公开(公告)号:US20080219579A1

    公开(公告)日:2008-09-11

    申请号:US11940679

    申请日:2007-11-15

    IPC分类号: G06K9/36 G06K9/76

    摘要: Methods and apparatus are provided for compressed imaging by performing modulation in a pupil plane. Image information is acquired by modulating an incident light field using a waveplate having a pattern that modifies a phase or amplitude of the incident light field, wherein the waveplate is positioned substantially in a pupil plane of an optical system; optically computing a transform between the modulated incident light field at a plane of the waveplate and an image plane; and collecting image data at the image plane. The transform can be, for example, a Fourier transform or a fractional Fourier transform

    摘要翻译: 通过在瞳孔平面中执行调制,提供了用于压缩成像的方法和装置。 使用具有修改入射光场的相位或幅度的图案的波片调制入射光场来获取图像信息,其中波片基本上位于光学系统的光瞳平面中; 光学地计算在波片的平面处的调制入射光场与像面之间的变换; 并在图像平面上收集图像数据。 变换可以是例如傅立叶变换或分数阶傅里叶变换

    Process for fabricating article comprising photonic band gap material
    2.
    发明授权
    Process for fabricating article comprising photonic band gap material 有权
    制造包含光子带隙材料的制品的方法

    公开(公告)号:US06392787B1

    公开(公告)日:2002-05-21

    申请号:US09653916

    申请日:2000-09-01

    IPC分类号: G02F100

    CPC分类号: G02B6/1225 B82Y20/00

    摘要: An improved lithographic process for fabricating articles comprising photonic band gap materials with micron-scale periodicities is provided, the process readily capable of being performed by current lithographic processes and equipment. The process involves providing a three-dimensional structure made up of a plurality of stacked layers, where each layer contains a substantially planar lattice of shapes of a first material, typically silicon, with interstices between the shapes. Each shape contacts at least one shape of an adjacent layer, the interstices throughout the plurality of layers are interconnected, and the interstices comprise a second material, e.g., silicon dioxide. Typically, the second material is etched from the interconnected interstices to provide a structure of the first material and air, this structure designed to provide a particular photonic band gap.

    摘要翻译: 提供了用于制造包含具有微米级周期性的光子带隙材料的制品的改进的光刻工艺,该工艺容易地由当前的光刻工艺和设备执行。 该方法包括提供由多个堆叠层组成的三维结构,其中每个层包含具有在形状之间的间隙的第一材料(通常为硅)的基本上平面的形状的格子。 每个形状接触相邻层的至少一个形状,整个多个层中的间隙互连,并且间隙包括第二材料,例如二氧化硅。 通常,第二材料从互连的间隙中蚀刻以提供第一材料和空气的结构,该结构被设计成提供特定的光子带隙。

    Solder-bonding process
    3.
    发明申请
    Solder-bonding process 审中-公开
    焊接工艺

    公开(公告)号:US20090008430A1

    公开(公告)日:2009-01-08

    申请号:US11825490

    申请日:2007-07-06

    IPC分类号: B23K1/20

    摘要: Methods include providing substrate having substrate surface, forming metal-containing pad on substrate surface, and forming metal-containing protective shell enclosing metal-containing body on metal-containing pad. Methods may include forming sacrificial layer on metal-containing pad and including top surface and cavity, cavity having side wall extending between metal-containing pad and top surface; and forming metal-containing protective shell in cavity. Methods may also include providing first, second, third and fourth metal-containing pads on first, second, third and fourth substrate surfaces; forming first metal-containing protective shell on first or second metal-containing pad; forming second metal-containing protective shell on third or fourth metal-containing pad; heating first metal-containing protective shell to form solder-bond between first and second substrate surfaces; and heating second metal-containing protective shell to form solder-bond between third and fourth substrate surfaces.

    摘要翻译: 方法包括提供具有基板表面的基板,在基板表面上形成含金属垫,以及在含金属垫上形成包围含金属的主体的含金属保护壳。 方法可以包括在含金属垫上形成牺牲层,并且包括顶表面和空腔,具有在含金属垫和顶表面之间延伸的侧壁的空腔; 并在空腔中形成含金属的保护壳。 方法还可以包括在第一,第二,第三和第四衬底表面上提供第一,第二,第三和第四含金属焊盘; 在第一或第二含金属垫上形成第一含金属保护壳; 在第三或第四含金属垫上形成第二含金属保护壳; 加热第一含金属的保护壳,以在第一和第二基底表面之间形成焊料接合; 并加热第二含金属的保护壳,以在第三和第四衬底表面之间形成焊料接合。

    Micro-electro-mechanical system device and method of making same
    6.
    发明授权
    Micro-electro-mechanical system device and method of making same 有权
    微机电系统装置及其制造方法

    公开(公告)号:US06906846B2

    公开(公告)日:2005-06-14

    申请号:US10217609

    申请日:2002-08-14

    CPC分类号: G02B26/0841

    摘要: A MEMS device and a method for making a MEMS device are described. The MEMS device includes a support member, an optical device, and a flexible member. In one aspect, the flexible member is formed separately from the support member and the optical device. In one aspect, the flexible member is dimensioned to enable flex in one direction while maintaining stiffness in two orthogonal directions. In one fabrication embodiment, the MEMS device is formed by etching an opening into the structural layer to create a structural support member and an optical device. The structural support member and optical device are mounted on a support substrate with a sacrificial layer. A flexible member is conformally deposited over the structural support member and the optical device and then etched. The sacrificial layer is partially etched away to leave the structural support member anchored to the support substrate.

    摘要翻译: 描述了MEMS器件和制造MEMS器件的方法。 MEMS装置包括支撑构件,光学装置和柔性构件。 一方面,柔性构件与支撑构件和光学装置分开形成。 在一个方面,柔性构件的尺寸设计成使得能够在一个方向上弯曲,同时保持两个正交方向上的刚度。 在一个制造实施例中,通过将开口蚀刻到结构层中以形成结构支撑构件和光学装置来形成MEMS器件。 结构支撑构件和光学装置安装在具有牺牲层的支撑衬底上。 柔性构件保形地沉积在结构支撑构件和光学装置上,然后蚀刻。 牺牲层被部分地蚀刻掉以使结构支撑构件锚定到支撑衬底上。