公开(公告)号：US20240404869A1

公开(公告)日：2024-12-05

申请号：US18804194

申请日：2024-08-14

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： Jason STEPHENS ,  Guleid HUSSEN ,  Michael PARKER ,  Dennis REX ,  Ashish BHATNAGAR ,  Brent ELLIOT ,  Kevin PTASIENSKI

IPC: H01L21/687 ,  B32B18/00 ,  H01L21/67 ,  H01L21/683

Abstract: A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid-state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.

公开(公告)号：US20210292246A1

公开(公告)日：2021-09-23

申请号：US17342212

申请日：2021-06-08

Applicant: Watlow Electric Manufacturing Company

Inventor： Brent ELLIOT ,  Dennis George REX ,  Guleid HUSSEN ,  Michael PARKER ,  Jason STEPHENS

IPC: C04B37/02 ,  B32B1/08 ,  B32B15/04 ,  B32B15/20 ,  H02G3/22 ,  H05G2/00

Abstract: An electrical termination unit or feedthrough which may be used for routing electrical conductors through a chamber wall, or otherwise across a barrier between isolated atmospheric conditions. The electrical termination unit may have aluminum as the interface material to the chamber interface and may utilize a ceramic insulator. The electrical termination unit may have the aluminum used as the interface brazed directly to a ceramic surface of the insulator. The aluminum that forms the chamber interface may be formed within a hollow ceramic tube in the same process step that brazes the aluminum to the ceramic tube with a hermetic joint. Machining subsequent to the brazing of the aluminum to the ceramic insulator may allow for achievement of the final form desired. A method for manufacturing such an electrical termination unit.

公开(公告)号：US20250069943A1

公开(公告)日：2025-02-27

申请号：US18940051

申请日：2024-11-07

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： Michael PARKER ,  Dennis REX ,  Guleid HUSSEN ,  Jason STEPHENS

IPC: H01L21/687

Abstract: A hybrid shaft assembly for use in controlled atmosphere chambers, such as by way of example heated pedestals for semiconductor manufacturing, includes a substrate, a hub having an upper portion and a lower portion, the upper portion being secured to the substrate with an upper joining layer, and a shaft secured to the lower portion of the hub with a lower joining layer. The shaft comprises a material having a thermal conductivity lower than a material of the hub and a material of the substrate.

公开(公告)号：US20230347436A1

公开(公告)日：2023-11-02

申请号：US18347662

申请日：2023-07-06

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： Michael PARKER ,  Alfred Grant ELLIOT ,  Brent Donald Alfred ELLIOT ,  Frank BALMA ,  Richard Erich SCHUSTER ,  Dennis George REX ,  Alexander VEYTSER

IPC: B32B18/00 ,  B32B9/00 ,  B23K35/28 ,  B23K35/00 ,  B32B7/14 ,  H01L21/67 ,  H05B1/00 ,  B32B15/20 ,  B23K1/19 ,  B23K1/20 ,  H01L21/687 ,  B23K1/00 ,  C04B35/645 ,  F16B9/00 ,  B32B3/30 ,  C04B37/00 ,  B32B9/04 ,  H01L21/683

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K35/005 ,  B23K35/286 ,  B32B3/30 ,  B32B7/14 ,  B32B9/005 ,  B32B9/04 ,  B32B9/041 ,  B32B15/20 ,  B32B18/00 ,  C04B35/645 ,  C04B37/001 ,  C04B37/006 ,  F16B9/00 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68757 ,  H01L21/68785 ,  H05B1/00 ,  B23K2103/10 ,  C04B2237/84 ,  Y10T403/46 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.

公开(公告)号：US20220143726A1

公开(公告)日：2022-05-12

申请号：US17583483

申请日：2022-01-25

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： Michael PARKER

IPC: B23K1/00 ,  B23K1/20 ,  B32B9/04 ,  B23K35/28 ,  H01L21/67 ,  F16B9/00 ,  C04B37/00 ,  B32B18/00 ,  B32B15/20 ,  B23K1/19 ,  H05B1/00 ,  B32B3/30 ,  B23K35/00 ,  B32B9/00 ,  B32B7/14 ,  C04B35/645 ,  H01L21/683 ,  B23K103/10

Abstract: A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

公开(公告)号：US20250050439A1

公开(公告)日：2025-02-13

申请号：US18930016

申请日：2024-10-29

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： Brent ELLIOT ,  Guleid HUSSEN ,  Jason STEPHENS ,  Michael PARKER ,  Alfred Grant ELLIOT

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/19 ,  B23K35/28 ,  B23K103/00 ,  B32B9/00 ,  C04B35/581 ,  C04B37/00 ,  C04B37/02 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A method for joining ceramic pieces includes placing a layer of titanium on each of a first ceramic piece and a second ceramic piece; placing a layer of nickel on each of the layers of titanium; assembling the first ceramic piece and the second ceramic piece with the layers of nickel and the layers of titanium between the ceramic pieces; pressing the first ceramic piece and the second ceramic piece with the layers of nickel and the layers of titanium together; heating the first ceramic piece, the second ceramic piece, the layers of nickel, and the layers of titanium to a joining temperature in a vacuum; and cooling the first ceramic piece, the second ceramic piece, the layers of nickel, and the layers of titanium to create a hermetic seal between the first ceramic piece and the second ceramic piece.

公开(公告)号：US20220148904A1

公开(公告)日：2022-05-12

申请号：US17532988

申请日：2021-11-22

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： Brent ELLIOT ,  Guleid HUSSEN ,  Jason STEPHENS ,  Michael PARKER

IPC: H01L21/683 ,  H01L21/687 ,  B32B17/06 ,  B32B15/04 ,  B32B9/00 ,  B32B9/04 ,  B32B37/04 ,  H01J37/32

Abstract: A method for joining quartz pieces using metallic aluminum as the joining element. The aluminum may be placed between two quartz pieces and the assembly may be heated in the range of 500 C to 650 C. The joining atmosphere may be non-oxygenated. A method for the joining of quartz pieces which may include barrier layers on the quartz pieces. The barrier layers may be impervious to aluminum diffusion and may be of a metal oxide or metal nitride. The quartz pieces with the barrier layers may then be joined at temperatures higher than 650 C and less than 1200 C. A device such as an RF antenna or electrode in support of semiconductor processing using joined quartz pieces wherein the aluminum joining layer which has joined the pieces and also functions as antenna electrode.