Abstract:
This disclosure is concerned with a method of forming light reflective etch pits preferably having a tetrahedral pattern, in a surface, preferably a (111) surface, of a body of semiconductor material. The body of semiconductor material, preferably silicon, has two opposed major surfaces which are substantially parallel, the body is divided into four alternate regions of opposite type conductivity, the two end regions being emitter regions and the two middle regions being base regions when the body is employed as a light activated four region switch. Activating light enters at one major surface of the body, passes entirely through the body to the opposed major surface where light reflective etch pits cause the light to pass back through the body.
Abstract:
This disclosure relates to a new and novel encapsulating package for a light-activated or light-sensitive semiconductor device. The various problems associated with introducing light through the top or cap of the encapsulating case especially the establishment of a hermetic seal are overcome by introducing light through an aperture in the base member of the case and establishing a hermetic seal by employing a soft silver layer which is disposed on the surface of the base member in contact with the semiconductor wafer.
Abstract:
This disclosure relates to a new and novel encapsulating package for a light activated or light sensitive semiconductor device. The various problems associated with introducing light through the top or cap of the encapsulating case are overcome by introducing light through an aperture in the base member of the case.
Abstract:
A light activated thyristor with high dI/dt capability is provided by disposing first and second thyristors, one a primary and one a pilot thyristor, in a semiconductor body having first and second major surfaces. The two thristors have common cathodebase, anode-base and anode-emitter regions, and have spaced apart cathode-emitter regions adjoining the first major surface of the body. The common cathode-base region adjoins the first major surface between the two thyristors as well as intermittently of the cathode-emitter region of the first thyristor to form shunts. The first major surface at the cathode-emitter region of the second thyristor is adapted for activation of the second thyristor therethrough with electromagnetic radiation of wavelengths corresponding substantially to the energy bandgap of the semiconductor body. The cathode electrode makes ohmic contact with the cathode-emitter region of the first thyristor and the common cathode-base region at the shunts, and the anode electrode makes ohmic contact with the common anode-emitter regions. A floating contact also makes ohmic contact to the cathode-emitter region of the second thyristor and the common cathode-base region between the thyristors, while leaving exposed substantial portions of the first major surface adjoining the cathode-emitter region of the second thyristor.
Abstract:
This disclosure is concerned with a four region light activated controlled rectifier. The controlled rectifier, which comprises in part a body of silicon having four alternate regions of opposite type conductivity, the two end regions being emitter regions and two middle regions being base regions, is ''''turnedon'''' by light. The light enters at one major surface of the body passes entirely through the body to the opposed major surface where reflective means causes the light to pass back through the body. The reflection of the light causes the rectifier to be ''''turned-on'''' faster than possible with prior art devices.
Abstract:
Semiconductor devices such as silicon thyristors are provided with increased blocking voltage without significantly increasing the forward voltage drop of the device. Bulk portions of the device are masked against radiation, such as an electron radiation, and peripheral portions of the device are irradiated with suitable radiation such as electron radiation.
Abstract:
Tantalum and gold alloy electrical contacts are applied to selected areas of a body of silicon carbide. An oxidized surface is first produced on the silicon carbide body and removed from those portions of the surface to which the alloy contact of the body is to be applied. A thin layer of aluminum is deposited on only the oxidized surface. Thin films of tantalum and gold are alternately deposited on the exposed surface of the silicon carbide. Any tantalum and gold deposited on the aluminum forms an alloy which is readily removed by an etchant which attacks tantalum-gold-aluminum intermetallics but will not attack the tantalum-gold alloy electrical contact of the body.