摘要:
An aspect of the present invention is a method for forming a plurality of thin-film devices. The method includes providing a flexible substrate and utilizing a self-aligned imprint lithography (SAIL) process to form the plurality of thin-film devices on the flexible substrate.
摘要:
An integrated line selection apparatus within active matrix arrays is described. The circuit includes multiple gate line drive transistor devices, each gate line drive transistor device having a drain coupled to a gate line of multiple gate lines in a gate line driver circuit coupled to an active matrix array and a source to receive an input signal. The circuit further includes at least one address line transistor device corresponding to each gate line transistor device, each address line transistor device having a drain coupled to a gate of the corresponding gate line drive transistor device and a gate coupled to a corresponding address line, such that by asserting a predetermined combination of voltages on the plurality of address lines, a single gate line of said plurality of gate lines is selected to receive the input signal to be transmitted to a corresponding pixel within the corresponding active matrix array.
摘要:
An apparatus and method for measuring and monitoring layer properties in web-based processes are described. The apparatus includes multiple electrode devices adjacently positioned on a surface of a web material, which advances with a predetermined speed. The electrode devices perform measurements of electrical parameters of a layer of the web material and provide an electrical signal to a layer deposition system for further adjustment of layer properties of the layer.
摘要:
Provided is a low cost system and method for forming electronic devices, especially large surface area devices. The process of imprint lithography is combined with alternate manufacturing techniques to fabricate the devices. Initially, a template imprints a three-dimensional pattern into a resist layer deposited on a flexible substrate. The resist layer is cured using ultraviolet light or other curing techniques. After curing, the 3-D pattern is modified using one of several techniques to include inkjetting, electrodeposition or laser patterning. In one embodiment, a semi-fluid material may be jetted into channels formed in the pattern, thereby forming conductive or insulating lead lines. Alternatively, a two-dimensional pattern may be jetted onto the resist layer. Final processing may include multiple etch-mask-etch steps. The integration of techniques into a single system provides a low cost, efficient method for manufacturing high quality, large surface area electronic devices.
摘要:
An addressing circuit is operable to address one or more memory elements in a cross-point memory array. The addressing circuit includes first and second sets of address lines for addressing the cross-point memory array. The address circuit also includes pull-up and pull-down circuit elements. Both the pull-up and pull-down circuit elements and the address lines include cross-point resistive elements.
摘要:
An apparatus and method for measuring and monitoring layer properties in web-based processes are described. The apparatus includes multiple electrode devices adjacently positioned on a surface of a web material, which advances with a predetermined speed. The electrode devices perform measurements of electrical parameters of a layer of the web material and provide an electrical signal to a layer deposition system for further adjustment of layer properties of the layer.
摘要:
An silver island anti-fuse including a first electrical conductor, an electrically resistive material in contact with the first conductor and at least one silver island disposed opposite the first electrical conductor and upon the electrically resistive material. A second electrical conductor disposed over the silver island intimately couples the silver island to the electrically resistive material. When a critical potential is applied across the anti-fuse, a metallic filament precipitates from the silver island through the electrically resistive material layer, establishing a short and thus switching the silver island anti-fuse from a high resistance to a low resistance. A method of making the silver island anti-fuse and a memory device incorporating the silver island anti-fuse are further provided.
摘要:
An addressing circuit is operable to address one or more memory elements in a cross-point memory array. The addressing circuit includes first and second sets of address lines for addressing the cross-point memory array. The address circuit also includes pull-up and pull-down circuit elements. Both the pull-up and pull-down circuit elements and the address lines include cross-point resistive elements.
摘要:
An integrated line selection apparatus within active matrix arrays is described. The circuit includes multiple gate line drive transistor devices, each gate line drive transistor device having a drain coupled to a gate line of multiple gate lines in a gate line driver circuit coupled to an active matrix array and a source to receive an input signal. The circuit further includes at least one address line transistor device corresponding to each gate line transistor device, each address line transistor device having a drain coupled to a gate of the corresponding gate line drive transistor device and a gate coupled to a corresponding address line, such that by asserting a predetermined combination of voltages on the plurality of address lines, a single gate line of said plurality of gate lines is selected to receive the input signal to be transmitted to a corresponding pixel within the corresponding active matrix array.
摘要:
Provided is a low cost system and method for forming electronic devices, especially large surface area devices. The process of imprint lithography is combined with alternate manufacturing techniques to fabricate the devices. Initially, a template imprints a three-dimensional pattern into a resist layer deposited on a flexible substrate. The resist layer is cured using ultraviolet light or other curing techniques. After curing, the 3-D pattern is modified using one of several techniques to include inkjetting, electrodeposition or laser patterning. In one embodiment, a semi-fluid material may be jetted into channels formed in the pattern, thereby forming conductive or insulating lead lines. Alternatively, a two-dimensional pattern may be jetted onto the resist layer. Final processing may include multiple etch-mask-etch steps. The integration of techniques into a single system provides a low cost, efficient method for manufacturing high quality, large surface area electronic devices.