公开(公告)号：US20100078661A1

公开(公告)日：2010-04-01

申请号：US12239470

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch ,  Michael Solomensky

发明人： Wei Shi ,  Alex Shaikevitch ,  Michael Solomensky

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00 ,  H01L2924/00014

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US20100078663A1

公开(公告)日：2010-04-01

申请号：US12239516

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch

发明人： Wei Shi ,  Alex Shaikevitch

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/49175 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US09252336B2

公开(公告)日：2016-02-02

申请号：US12239552

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch ,  Shanquan Bao ,  Michael Solomensky

发明人： Wei Shi ,  Alex Shaikevitch ,  Shanquan Bao ,  Michael Solomensky

IPC分类号： H01L33/00 ,  H01L33/48 ,  H01L25/075

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US08049236B2

公开(公告)日：2011-11-01

申请号：US12239494

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch

发明人： Wei Shi ,  Alex Shaikevitch

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49175 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00 ,  H01L2924/00014

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US20100079994A1

公开(公告)日：2010-04-01

申请号：US12239552

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch ,  Shanquan Bao ,  Michael Solomensky

发明人： Wei Shi ,  Alex Shaikevitch ,  Shanquan Bao ,  Michael Solomensky

IPC分类号： H01L33/00 ,  F21V7/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US08058664B2

公开(公告)日：2011-11-15

申请号：US12239516

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch

发明人： Wei Shi ,  Alex Shaikevitch

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/49175 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US20100078662A1

公开(公告)日：2010-04-01

申请号：US12239494

申请日：2008-09-26

申请人： Wei Shi ,  Alex Shaikevitch

发明人： Wei Shi ,  Alex Shaikevitch

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49175 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00 ,  H01L2924/00014

摘要： A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

摘要翻译： 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US09346791B2

公开(公告)日：2016-05-24

申请号：US14343040

申请日：2012-09-07

申请人： Jun O. Liu ,  Wei Shi ,  Kalyan Kumar Pasunooti

发明人： Jun O. Liu ,  Wei Shi ,  Kalyan Kumar Pasunooti

IPC分类号： C07D405/14 ,  A61K31/496 ,  A61K31/506

CPC分类号： C07D405/14 ,  A61K31/496 ,  A61K31/506

摘要： Provided herein are Itraconazole analogs. Also provided herein are methods of inhibition of Hedgehog pathway, vascular endothelial growth factor receptor 2 (VEGFR2) glycosylation, angiogenesis and treatment of disease with Itraconazole analogs.

摘要翻译： 本文提供伊曲康唑类似物。 本文还提供了抑制Hedgehog途径，血管内皮生长因子受体2（VEGFR2）糖基化，血管生成和伊曲康唑类似物治疗疾病的方法。

公开(公告)号：US20130301625A1

公开(公告)日：2013-11-14

申请号：US13470035

申请日：2012-05-11

申请人： Alexander Thoukydides ,  Fei Tong ,  Wei Shi

发明人： Alexander Thoukydides ,  Fei Tong ,  Wei Shi

IPC分类号： H04W84/12 ,  H04W84/02

CPC分类号： H04W28/06

摘要： The present application relates to a method for transmitting information from a wireless access point to one or more wireless stations. The method comprises aggregating a plurality of information units of compatible types, such as MAC protocol data units (MPDUs) or acknowledgements into a single data frame, modulating the single data frame and transmitting the modulated data frame containing the plurality of information units to the one or more wireless stations.

摘要翻译： 本申请涉及一种从无线接入点向一个或多个无线站发送信息的方法。 该方法包括将多个兼容类型的信息单元（例如MAC协议数据单元（MPDU）或确认）聚合到单个数据帧中，调制单个数据帧并将包含多个信息单元的调制数据帧发送到一个 或更多的无线电台。

公开(公告)号：US08129144B2

公开(公告)日：2012-03-06

申请号：US11784626

申请日：2007-04-09

申请人： Liang Qiao ,  Wei Shi ,  Yujun Huang ,  Jianzhong Liu

发明人： Liang Qiao ,  Wei Shi ,  Yujun Huang ,  Jianzhong Liu

IPC分类号： C12P21/06

CPC分类号： C12N7/00 ,  A61K2039/525 ,  C12N2710/20023 ,  C12N2710/20061

摘要： The invention involves a papilloma pseudovirus that can induce immune response after oral intake as well as its preparation. It is characterized in that HPV or BPV pseudovirus are made by disrupting HPV-VLP or BPV-VLP, mixing them with plasmids (plasmids or DNA vaccine), and reassembling them into the pseudoviruses (VLPs with plasmids inside). Oral administration of the pseudoviruses will result in delivery to mucosal and systemic lymphoid tissues and induce immune responses for disease prevention and treatment. The pseudovirus induces stronger immune response than DNA vaccines. Additionally, the pseudovirus can be applied in gene therapy by bringing the therapeutic genes into lymphoid tissues in the human body.

摘要翻译： 本发明涉及一种乳头状假性假病毒，可在口服摄入后诱导免疫反应及其制备。 其特征在于HPV或BPV假病毒通过破坏HPV-VLP或BPV-VLP，与质粒（质粒或DNA疫苗）混合并将其重新组装成假病毒（其中具有质粒的VLP）而制备。 假性病毒的口服给药将导致输送到粘膜和系统性淋巴组织，并诱导用于疾病预防和治疗的免疫应答。 假DNA病毒诱导比DNA疫苗更强的免疫应答。 此外，假病毒可以通过将治疗基因引入人体的淋巴组织来应用于基因治疗。