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36 条记录 (耗时 0.024 秒)

    Backlight module
    1.
    发明授权
    Backlight module 有权
    背光模组

    公开(公告)号：US07922379B2

    公开(公告)日：2011-04-12

    申请号：US12209217

    申请日：2008-09-12

    申请人： Wen-Hsin Lin ,  Chien-Hung Chen ,  Tsung-Fu Cheng ,  Ren-Wei Huang

    发明人： Wen-Hsin Lin ,  Chien-Hung Chen ,  Tsung-Fu Cheng ,  Ren-Wei Huang

    IPC分类号： F21V19/00

    CPC分类号： G02F1/133604 ,  G02F1/133605 ,  G02F1/133608

    摘要： A backlight module including a back cover, a reflector, a lamp supporter, and a number of lamps is provided. The back cover includes a number of holes, an inner face, and an outer face. The reflector is disposed on the inner face and has a number of openings. The openings expose parts of the holes. The lamp supporter has a base substrate and a number of carriers that are connected to the base substrate. The base substrate is assembled to the outer face of the back cover, and the carriers penetrate the holes of the back cover and the openings of the reflector. The lamps are disposed in the carriers, such that the lamps and the base substrate are located at two opposite sides of the back cover.

    摘要翻译： 提供了包括后盖，反射器，灯支撑件和多个灯的背光模块。 后盖包括多个孔，内表面和外表面。 反射器设置在内表面上并且具有多个开口。 这些开口露出孔的部分。 灯支架具有基底基板和多个与基底基板连接的载体。 基底基板组装到后盖的外表面，载体穿过后盖的孔和反射器的开口。 灯被布置在载体中，使得灯和基底基板位于后盖的两个相对侧。

    BACKLIGHT MODULE
    2.
    发明申请
    BACKLIGHT MODULE 有权
    背光模组

    公开(公告)号：US20100002431A1

    公开(公告)日：2010-01-07

    申请号：US12209217

    申请日：2008-09-12

    申请人： Wen-Hsin Lin ,  Chien-Hung Chen ,  Tsung-Fu Cheng ,  Ren-Wei Huang

    发明人： Wen-Hsin Lin ,  Chien-Hung Chen ,  Tsung-Fu Cheng ,  Ren-Wei Huang

    IPC分类号： F21V17/00

    CPC分类号： G02F1/133604 ,  G02F1/133605 ,  G02F1/133608

    摘要： A backlight module including a back cover, a reflector, a lamp supporter, and a number of lamps is provided. The back cover includes a number of holes, an inner face, and an outer face. The reflector is disposed on the inner face and has a number of openings. The openings expose parts of the holes. The lamp supporter has a base substrate and a number of carriers that are connected to the base substrate. The base substrate is assembled to the outer face of the back cover, and the carriers penetrate the holes of the back cover and the openings of the reflector. The lamps are disposed in the carriers, such that the lamps and the base substrate are located at two opposite sides of the back cover.

    摘要翻译： 提供了包括后盖，反射器，灯支撑件和多个灯的背光模块。 后盖包括多个孔，内表面和外表面。 反射器设置在内表面上并且具有多个开口。 这些开口露出孔的部分。 灯支架具有基底基板和多个与基底基板连接的载体。 基底基板组装到后盖的外表面，载体穿过后盖的孔和反射器的开口。 灯被布置在载体中，使得灯和基底基板位于后盖的两个相对侧。

    Display Device and Light Source Block Used Therein
    3.
    发明申请
    Display Device and Light Source Block Used Therein 有权
    其中使用的显示设备和光源块

    公开(公告)号：US20100039580A1

    公开(公告)日：2010-02-18

    申请号：US12493369

    申请日：2009-06-29

    申请人： Chien-Hung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    发明人： Chien-Hung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    IPC分类号： G02F1/1335 ,  G02B5/00

    CPC分类号： G02B5/003 ,  G02F1/133608

    摘要： A display device and a light source block used therein are provided. The display device includes the light source block, a film set, and a display panel. The light source block has a reflective surface, a film supporter intersecting the reflective surface at an edge, and a panel supporting surface. The film supporter connects an end of an extremity surface, and the panel supporting surface connects the other end of the extremity surface. The film set is disposed on the film supporter, and the display panel is disposed on the panel supporting surface. The display panel has a display area and a light-shielding unit disposed outside the display area. The edge between the reflective surface and the film supporter falls into a vertical projection of the light-shielding unit.

    摘要翻译： 提供了一种其中使用的显示装置和光源块。 显示装置包括光源块，胶片组和显示面板。 光源块具有反射表面，与边缘处的反射表面相交的膜支撑件和面板支撑表面。 胶片支架连接末端表面的一端，面板支撑面连接肢体表面的另一端。 胶片组设置在胶片支持体上，显示面板设置在面板支撑面上。 显示面板具有设置在显示区域外的显示区域和遮光单元。 反射面与胶片支持体之间的边缘落入遮光单元的垂直投影中。

    Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module
    5.
    发明申请
    Method for Manufacturing PCB, Display Module and Method for Fabricating Display Module 有权
    PCB制造方法，显示模块及制造显示模块的方法

    公开(公告)号：US20120246926A1

    公开(公告)日：2012-10-04

    申请号：US13523990

    申请日：2012-06-15

    申请人： Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

    发明人： Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

    IPC分类号： H05K3/00

    CPC分类号： H01J9/241 ,  H05K3/0058 ,  H05K3/341 ,  H05K2201/10318 ,  H05K2201/10409 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

    摘要： A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.

    摘要翻译： 公开了一种制造印刷电路板的方法，包括以下步骤。 提供具有与上表面相对的上表面和底表面的基本板。 设置临时设置在基板上的多个电子部件。 提供临时设置在基板的位置上的至少一个定位销，其中电子部件不临时设置在该位置。 同时使用表面贴装技术来连接至少一个定位销和基板上的电子元件。

    Method for manufacturing PCB
    6.
    发明授权
    Method for manufacturing PCB 有权
    PCB制造方法

    公开(公告)号：US09299528B2

    公开(公告)日：2016-03-29

    申请号：US13523990

    申请日：2012-06-15

    申请人： Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

    发明人： Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

    IPC分类号： H05K3/36 ,  H01J9/24 ,  H05K3/00 ,  H05K3/34

    CPC分类号： H01J9/241 ,  H05K3/0058 ,  H05K3/341 ,  H05K2201/10318 ,  H05K2201/10409 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

    摘要： A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.

    摘要翻译： 公开了一种制造印刷电路板的方法，包括以下步骤。 提供具有与上表面相对的上表面和底表面的基本板。 设置临时设置在基板上的多个电子部件。 提供临时设置在基板的位置上的至少一个定位销，其中电子部件不临时设置在该位置。 同时使用表面贴装技术来连接至少一个定位销和基板上的电子元件。

    Intelligent driving assistant systems
    8.
    发明授权
    Intelligent driving assistant systems 失效
    智能驾驶辅助系统

    公开(公告)号：US08244410B2

    公开(公告)日：2012-08-14

    申请号：US12382880

    申请日：2009-03-26

    申请人： Bing-Fei Wu ,  Chao-Jung Chen ,  Hsin-Yuan Peng ,  Ying-Han Chen ,  Wen-Hsin Lin

    发明人： Bing-Fei Wu ,  Chao-Jung Chen ,  Hsin-Yuan Peng ,  Ying-Han Chen ,  Wen-Hsin Lin

    IPC分类号： G05D1/00 ,  B60Q1/00

    CPC分类号： G08G1/167 ,  B60Q9/008 ,  B60W50/14

    摘要： The invention discloses an intelligent driving assistant system applied to a handheld device. The invention can detect more than one safety mode including lane departure detection, lost-cargo detection, detecting front-object under driving condition, detecting side-object under driving condition and detecting back-object under driving condition, also the invention can mention alarm according to the detection results from different modules. Finally the invention can store the real-time image according to the detection results from different modules, and then transfer the related information to other places for real-time notice with matching the information from the GPS system and the digitized map.

    摘要翻译： 本发明公开了一种应用于手持设备的智能驾驶辅助系统。 本发明可以检测多种安全模式，包括车道偏离检测，货物丢失检测，驾驶状态下的前方物体检测，驾驶状况下检测侧面物体，检测驾驶状况下的后方物体，本发明还可以提及报警 对不同模块的检测结果。 最后，本发明可以根据来自不同模块的检测结果存储实时图像，然后将相关信息传送到其他地方进行实时通知，与GPS系统和数字化地图匹配。

    Lactobacillus Plantarum and Uses Thereof
    9.
    发明申请
    Lactobacillus Plantarum and Uses Thereof 有权
    植物乳杆菌及其用途

    公开(公告)号：US20120020943A1

    公开(公告)日：2012-01-26

    申请号：US12868136

    申请日：2010-08-25

    申请人： Wen-Hsin Lin

    发明人： Wen-Hsin Lin

    IPC分类号： A61K35/74 ,  C12N1/20 ,  A61P1/02 ,  A61P31/04 ,  A61P13/02

    CPC分类号： C12R1/25 ,  A23L33/135 ,  A61K2035/115 ,  C12N1/20

    摘要： Provided is an isolated Lactobacillus plantarum CMU995, which was deposited at the Food Industry Research and Development Institute in Taiwan with the accession number BCRC 910472 and in the German Collection of Microorganisms and Cell Cultures (DSMZ) under accession number DSM 23780. Also provided are a composition comprising Lactobacillus plantarum CMU995 and a method for inhibiting pathogens, protecting the gastrointestinal tract, and/or protecting the urinary tract in a mammal comprising administrating an effective amount of Lactobacillus plantarum CMU995 to the mammal.

    摘要翻译： 提供了一种分离的植物乳杆菌CMU995，其保藏在台湾的食品工业研究开发研究所，登记号为BCRC 910472，并在德国收藏的微生物和细胞培养物（DSMZ）中，登录号DSM 23780。还提供了 组合物，其包含植物乳杆菌CMU995和抑制病原体，保护胃肠道和/或保护哺乳动物的尿道的方法，包括向哺乳动物施用有效量的植物乳酸乳杆菌CMU995。

    High-precision ceramic substrate preparation process
    10.
    发明申请
    High-precision ceramic substrate preparation process 审中-公开
    高精度陶瓷基板的制备工艺

    公开(公告)号：US20110123931A1

    公开(公告)日：2011-05-26

    申请号：US12805720

    申请日：2010-08-17

    申请人： Wen-Hsin Lin

    发明人： Wen-Hsin Lin

    IPC分类号： G03F7/20

    CPC分类号： H05K3/108 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/281 ,  H05K2201/017

    摘要： A high-precision ceramic substrate preparation process is disclosed to bond a dry film to a metal layer on a ceramic plate, and then to coat a conductive layer on the metal layer and an anti-etching metal layer on the conductive layer after application of an exposing and developing process to form a predetermined circuit pattern in the dry film, and then to remove the dry film and to etch the metal layer, and then to bond an oxygen-free tape, which is prepared from a compound of ceramic powder, glass powder and pasting agent, to the conductive layer, and then to sinter the oxygen-free tape in an oxygen-free sintering furnace into a retaining wall, and then to coat an anti-oxidation bonding layer on the surface of the conductive layer.

    摘要翻译： 公开了一种高精度陶瓷基板制备方法，将干膜与陶瓷板上的金属层接合，然后在施加了导电层之后在导电层上涂覆金属层上的导电层和抗蚀刻金属层 曝光和显影工艺以在干膜中形成预定的电路图案，然后除去干膜并蚀刻金属层，然后粘合由陶瓷粉末化合物玻璃制成的无氧胶带 粉末和粘贴剂，导电层，然后在无氧烧结炉中将无氧胶带烧结成保持壁，然后在导电层的表面上涂覆抗氧化粘合层。