Process for the plasma cleaning of a component
    7.
    发明授权
    Process for the plasma cleaning of a component 有权
    用于等离子体清洗组件的方法

    公开(公告)号:US07513955B2

    公开(公告)日:2009-04-07

    申请号:US10591512

    申请日:2005-02-09

    CPC分类号: B08B7/00 C23G5/00

    摘要: Cracks are conventionally difficult to clean which often leads to damage to other regions of the component for cleaning. According to the invention, a plasma cleaning method is used, whereby a pressure and/or a separation of an electrode to the component are varied, in order to achieve a plasma cleaning in the crack.

    摘要翻译: 通常难以清理裂纹,这通常会导致对组件其他区域的损坏进行清洁。 根据本发明,使用等离子体清洗方法,从而改变电极对部件的压力和/或分离,以便在裂纹中实现等离子体清洁。