公开(公告)号：US20070227769A1

公开(公告)日：2007-10-04

申请号：US11760919

申请日：2007-06-11

申请人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

发明人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

IPC分类号： H01R12/00 ,  H05K1/03

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

公开(公告)号：US20070226997A1

公开(公告)日：2007-10-04

申请号：US11760925

申请日：2007-06-11

申请人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

发明人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

IPC分类号： H01R43/00 ,  H05K3/36

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

公开(公告)号：US20060166522A1

公开(公告)日：2006-07-27

申请号：US11043573

申请日：2005-01-26

申请人： William Brodsky ,  Amanda Mikhail

发明人： William Brodsky ,  Amanda Mikhail

IPC分类号： H01R12/00

CPC分类号： H01R13/2421

摘要： A contact assembly including an insulative carrier having a plurality of passages formed therein. A spring contact is positioned in the plurality of passages. The spring contact includes a helical spring and a contact plate affixed to one end of the helical spring. The contact plate has a plurality of portions extending away from the contact plate and extending away from the helical spring.

公开(公告)号：US20070054512A1

公开(公告)日：2007-03-08

申请号：US11327710

申请日：2006-01-05

申请人： Gareth Hougham ,  Brian Beaman ,  John Corbin ,  Paul Coteus ,  Shawn Hall ,  Kathleen Hinge ,  Theron Lewis ,  Frank Libsch ,  Amanda Mikhail

发明人： Gareth Hougham ,  Brian Beaman ,  John Corbin ,  Paul Coteus ,  Shawn Hall ,  Kathleen Hinge ,  Theron Lewis ,  Frank Libsch ,  Amanda Mikhail

IPC分类号： H01R12/00

CPC分类号： H05K3/368 ,  H01R12/52 ,  H01R12/714 ,  H05K1/0269 ,  H05K3/325 ,  H05K2201/10378 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating serfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography.

摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。 这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的匹配塞线接触。 对于通过成型技术（例如，Tyco Electronics MPI或Shin Etsu RP）或Metal-on-Elastomer型（IBM）等成型技术制造的LGA类型，使用具有所需形貌的模具可提供所需的 LGA地形。 对于由金属弹簧，悬臂，电枢等制成的那些LGAs，通过使用具有所需形状的尺寸模具在制造期间或之后使按钮成形来施加所需的形状。

公开(公告)号：US20080090440A1

公开(公告)日：2008-04-17

申请号：US11865103

申请日：2007-10-01

申请人： Brian Beaman ,  Joseph Kuczynski ,  Theron Lewis ,  Amanda Mikhail ,  Arvind Sinha

发明人： Brian Beaman ,  Joseph Kuczynski ,  Theron Lewis ,  Amanda Mikhail ,  Arvind Sinha

IPC分类号： H01R13/62

CPC分类号： H01R13/533 ,  H01R12/716 ,  Y10T29/49222

摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

摘要翻译： 说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的热膨胀系数的差异的方法。 插座包括表面安装的触点和细长的外壳。 细长壳体包括孔，其中表面安装的接触件从孔径延伸。 至少一个板连接到细长壳体，其中至少一个板具有选择的热膨胀系数以补偿插座和印刷电路板之间的热膨胀系数差。

公开(公告)号：US20050285708A1

公开(公告)日：2005-12-29

申请号：US10879811

申请日：2004-06-29

申请人： Jessica Berens ,  Don Gilliland ,  Amanda Mikhail

发明人： Jessica Berens ,  Don Gilliland ,  Amanda Mikhail

IPC分类号： H01F3/10 ,  H01F17/06 ,  H01F27/02 ,  H01F27/255

CPC分类号： H01F17/06 ,  H01F3/10 ,  H01F27/255 ,  H01F2017/065

摘要： Ferrite cores are provided with rounded, convex head ends and complimentary rounded, concave tail ends. The configuration of the head and tail ends permits a reduction in gap width between adjacent cores when they are joined together into a core assembly that suppresses electromagnetic interference emitted from a cable.

摘要翻译： 铁氧体磁芯设有圆形凸起的头端和互补的圆形凹入的尾端。 头端和尾端的构造允许相邻芯之间的间隙宽度在它们连接在一起成为抑制从电缆发射的电磁干扰的芯组件中时减小。

公开(公告)号：US20070035937A1

公开(公告)日：2007-02-15

申请号：US11201972

申请日：2005-08-11

申请人： John Colbert ,  Eric Eckberg ,  Roger Hamilton ,  Mark Hoffmeyer ,  Amanda Mikhail ,  Arvind Sinha

发明人： John Colbert ,  Eric Eckberg ,  Roger Hamilton ,  Mark Hoffmeyer ,  Amanda Mikhail ,  Arvind Sinha

IPC分类号： H05K7/04 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US20060137890A1

公开(公告)日：2006-06-29

申请号：US11023675

申请日：2004-12-28

申请人： Jessica Berens ,  Don Gilliland ,  Amanda Mikhail ,  Dennis Wurth

发明人： Jessica Berens ,  Don Gilliland ,  Amanda Mikhail ,  Dennis Wurth

IPC分类号： H01B11/06

CPC分类号： H01F17/06 ,  H01F2017/065

摘要： In a first aspect, a first apparatus for providing radiated emission suppression in cabling is provided. The first apparatus includes (1) at least one cable; (2) one or more ferrite elements each substantially surrounding a length of the at least one cable; and (3) a capacitive sleeve element substantially surrounding a length of the at least one cable and the one or more ferrite elements. The capacitive sleeve element includes a conducting material adapted to be connected to a ground. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种用于在布线中提供辐射发射抑制的第一装置。 第一装置包括（1）至少一根电缆; （2）一个或多个铁素体元件，每个铁素体基本上围绕所述至少一根电缆的长度; 和（3）基本上围绕所述至少一个电缆的长度和所述一个或多个铁氧体元件的电容套筒元件。 电容套筒元件包括适于连接到地面的导电材料。 提供了许多其他方面。

公开(公告)号：US20060137891A1

公开(公告)日：2006-06-29

申请号：US11359931

申请日：2006-02-22

申请人： Jessica Berens ,  Don Gilliland ,  Amanda Mikhail ,  Dennis Wurth

发明人： Jessica Berens ,  Don Gilliland ,  Amanda Mikhail ,  Dennis Wurth

IPC分类号： H01B11/06

CPC分类号： H01F17/06 ,  H01F2017/065

摘要： In a first aspect, a first apparatus for providing radiated emission suppression in cabling is provided. The first apparatus includes (1) at least one cable; (2) one or more ferrite elements each substantially surrounding a length of the at least one cable; and (3) a capacitive sleeve element substantially surrounding a length of the at least one cable and the one or more ferrite elements. The capacitive sleeve element includes a conducting material adapted to be connected to a ground. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种用于在布线中提供辐射发射抑制的第一装置。 第一装置包括（1）至少一根电缆; （2）一个或多个铁素体元件，每个铁素体基本上围绕所述至少一根电缆的长度; 和（3）基本上围绕所述至少一个电缆的长度和所述一个或多个铁氧体元件的电容套筒元件。 电容套筒元件包括适于连接到地面的导电材料。 提供了许多其他方面。