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    Topography compensating land grid array interposer
    1.
    发明申请
    Topography compensating land grid array interposer 审中-公开
    地形补偿地面阵列插值器

    公开(公告)号：US20070054512A1

    公开(公告)日：2007-03-08

    申请号：US11327710

    申请日：2006-01-05

    申请人： Gareth Hougham ,  Brian Beaman ,  John Corbin ,  Paul Coteus ,  Shawn Hall ,  Kathleen Hinge ,  Theron Lewis ,  Frank Libsch ,  Amanda Mikhail

    发明人： Gareth Hougham ,  Brian Beaman ,  John Corbin ,  Paul Coteus ,  Shawn Hall ,  Kathleen Hinge ,  Theron Lewis ,  Frank Libsch ,  Amanda Mikhail

    IPC分类号： H01R12/00

    CPC分类号： H05K3/368 ,  H01R12/52 ,  H01R12/714 ,  H05K1/0269 ,  H05K3/325 ,  H05K2201/10378 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

    摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating serfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography.

    摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。 这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的匹配塞线接触。 对于通过成型技术（例如，Tyco Electronics MPI或Shin Etsu RP）或Metal-on-Elastomer型（IBM）等成型技术制造的LGA类型，使用具有所需形貌的模具可提供所需的 LGA地形。 对于由金属弹簧，悬臂，电枢等制成的那些LGAs，通过使用具有所需形状的尺寸模具在制造期间或之后使按钮成形来施加所需的形状。